Photomicrosensor (Transmissive) EE-SX1108 Be sure to read Precautions on page 24. ■ Dimensions ■ Features Ultra-compact with a 5-mm-wide sensor and a 2-mm-wide slot. Note: All units are in millimeters unless otherwise indicated. PCB surface mounting type. High resolution with a 0.3-mm-wide aperture. ■ Absolute Maximum Ratings (Ta = 25°C) Item Symbol Rated value Emitter Forward current I 25 mA F (see note 1) Pulse forward cur- I 100 mA FP rent (see note 2) Reverse voltage V 5 V R Optical Detector Collector–Emitter V 20 V axis CEO voltage Emitter–Collector V 5 V ECO voltage Cross section AA Collector current I 20 mA C Collector dissipa- P 75 mW Recommended C Internal Circuit Soldering Pattern tion (see note 1) Ambient tem- Operating Topr –30°C to 85°C perature Storage Tstg –40°C to 90°C Reflow soldering Tsol 255°C (see note 3) Terminal No. Name Manual soldering Tsol 350°C (see note 3) A Anode K Cathode Unless otherwise specified, the Note: 1. Refer to the temperature rating chart if the ambient temper- C Collector ature exceeds 25°C. tolerances are ±0.15 mm. E Emitter 2. Duty: 1/100; Pulse width: 0.1 ms 3. Complete soldering within 10 seconds for reflow soldering and within 3 seconds for manual soldering. ■ Electrical and Optical Characteristics (Ta = 25°C) Item Symbol Value Condition Emitter Forward voltage V 1.1 V typ., 1.3 V max. I = 5 mA F F Reverse current I 10 μA max. V = 5 V R R Peak emission wavelength λ 940 nm typ. I = 20 mA P F Detector Light current I 50 μA min., 150 μA typ., I = 5 mA, V = 5 V L F CE 500 μA max. Dark current I 100 nA max. V = 10 V, 0 lx D CE Leakage current I --- --- LEAK Collector–Emitter saturated voltage V (sat) 0.1 V typ., 0.4 V max. I = 20 mA, I = 50 μA CE F L Peak spectral sensitivity wavelength λ 900 nm typ. --- P Rising time tr 10 μs typ. V = 5 V, R = 1 kΩ, CC L I = 100 μA L Falling time tf 10 μs typ. V = 5 V, R = 1 kΩ, CC L I = 100 μA L 32 EE-SX1108 Photomicrosensor (Transmissive) ■ Engineering Data Forward Current vs. Collector Forward Current vs. Forward Light Current vs. Forward Current Dissipation Temperature Rating Voltage Characteristics (Typical) Characteristics (Typical) Ta = 25°C V = 5 V CE Forward current I (mA) Ambient temperature Ta (°C) Forward voltage V (V) F F Light Current vs. Collector−Emitter Dark Current vs. Ambient Tem- Relative Light Current vs. Ambient Voltage Characteristics (Typical) perature Characteristics (Typical) Temperature Characteristics (Typical) Ta = 25°C I = 5 mA F V = 5 V CE I = 10 mA F V = 10 V CE V = 2 V CE I = 5 mA F Collector−Emitter voltage V (V) CE Ambient temperature Ta (°C) Ambient temperature Ta (°C) Response Time vs. Load Resist- Sensing Position Characteristics Sensing Position Characteristics ance Characteristics (Typical) (Typical) (Typical) V = 5 V CC I = 5 mA I = 5 mA F F Ta = 25°C V = 5 V V = 5 V CE CE Load resistance R (kΩ) L Distance d (mm) Distance d (mm) Response Time Measurement Circuit Input 90 % Output 10 % Input Output EE-SX1108 Photomicrosensor (Transmissive) 33 Light current I (μA) Forward current I (mA) L F Response time tr, tf (μs) Collector dissipation P (mW) C Forward current I (mA) Relative light current I (%) Relative light current I (%) F L L Light current I (μA) L Relative light current I (%) Dark current I (nA) L D Unit: mm (inch) ■ Tape and Reel Reel 21±0.8 dia. 330±2 dia. 2±0.5 13± 0.5 dia. 80±1 dia. Product name Quantity Lot number +2 12.4 0 18.4 max. Tape 1.5 dia. Tape configuration Leading part Terminating part Parts mounted (400 mm min.) (40 mm min.) Empty (40 mm min.) Pull-out direction Tape quantity 2,000 pcs./reel 34 EE-SX1108 Photomicrosensor (Transmissive) Precautions ■ Soldering Information Reflow soldering The following soldering paste is recommended: Melting temperature: 216 to 220°C Composition: Sn 3.5 Ag 0.75 Cu The recommended thickness of the metal mask for screen printing is between 0.2 and 0.25 mm. Set the reflow oven so that the temperature profile shown in the following chart is obtained for the upper surface of the product being soldered. 260°C max. 255°C max. 1 to 5°C/s 230°C max. 150 to 180°C 1 to 5°C/s 10 sec max. 120 sec 40 sec max. Time Manual soldering Use ”Sn 60” (60% tin and 40% lead) or solder with silver content. Use a soldering iron of less than 25 W, and keep the temperature of the iron tip at 300°C or below. Solder each point for a maximum of three seconds. After soldering, allow the product to return to room temperature before handling it. Storage To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended. If this is not possible, store the product under the following conditions: Temperature: 10 to 30°C Humidity: 60% max. The product is packed in a humidity-proof envelope. Reflow soldering must be done within 48 hours after opening the envelope, during which time the product must be stored under 30°C at 80% maximum humidity. If it is necessary to store the product after opening the envelope, use dry-box storage or reseal the envelope. Baking If a product has remained packed in a humidity-proof envelope for six months or more, or if more than 48 hours have lapsed since the envelope was opened, bake the product under the following conditions before use: Reel: 60°C for 24 hours or more Bulk: 80°C for 4 hours or more EE-SX1108 Photomicrosensor (Transmissive) 35 Temperature