F-218 (Rev 10OCT17) BSE–020–01–F–D–A 10 YEAR MFG WITH 50 µ" GOLD EXTENDED LIFE PRODUCT HIGH MATING BTE–060–02–F–D–A BTE–040–02–L–D–A CYCLES (0.80 mm) .0315" BTE, BSE SERIES BASIC BLADE & BEAM HEADER & SOCKET SPECIFICATIONS OTHER NO. OF POSITIONS LEAD PLATING BTE D A OPTION PER ROW STYLE OPTION For complete specifications and recommended PCB layouts see www.samtec.com?BTE or www.samtec.com?BSE Mates with: Specify Insulator Material: BSE Liquid Crystal Polymer LEAD –K –F Contact Material: STYLE = (7.00 mm) .275" DIA Phosphor Bronze = Gold Flash on contact, from Plating: –020, –040, –060, Polyimide Film Pick Matte Tin on tail chart Au or Sn over & Place Pad –080, –100, –120 50 µ" (1.27 µm) Ni –L Current Rating: –TR = 10 µ" (0.25 µm) Gold 2 A per pin LEAD = Tape & Reel (2 pins powered) No. of positions x (0.80) .0315 A on contact, STYLE Operating Temp Range: + (4.00) .1575 (80 positions maximum) Matte Tin on tail (4.27) -55 °C to +125 °C 01 –01 .168 Voltage Rating: –C* (5.97) 225 VAC with 5 mm Stack Height (3.94) (7.21) –02 = Electro-Polished Max Cycles: .155 .235 .284 100 Selective 02 RoHS Compliant: 50 µ" (1.27 µm) min Au (0.80) .0315 POWER/SIGNAL Yes over 150 µ" (3.81 µm) (7.11) APPLICATION Ni on Signal Pins in .280 PROCESSING contact area, Matte Tin (0.76) .030 over 50 µ" (1.27 µm) min A Lead-Free Solderable: Ni on all solder tails Yes (0.20) SMT Lead Coplanarity: (0.89) *Note: –C Plating passes .008 (0.10 mm) .004" max (020-080) .035 10 year MFG testing (0.15 mm) .006" max (100-120)* DIA MATED HEIGHT *(.004" stencil solution may be available; contact LEAD STYLE MATED HEIGHT* IPG@samtec.com) Board Stacking: (5.00) .197 –01 For applications requiring more Compatible with (8.00) .315 –02 than two connectors per board UMPT/UMPS for flexible *Processing conditions will or 80 positions or higher, affect mated height. two-piece power/signal solutions contact ipg@samtec.com RECOGNITIONS NO. OF POSITIONS PLATING OTHER BSE 01 A For complete scope D PER ROW OPTION OPTION of recognitions see www.samtec.com/quality Mates with: FILE NO. E111594 BTE –F –TR = Gold Flash on contact, = Tape & Reel ALSO AVAILABLE –020, –040, –060, Matte Tin on tail (80 positions (MOQ Required) –080, –100, –120 maximum) –L • 30 µ" (0.76 µm) Gold = 10 µ" (0.25 µm) Gold on contact, • Edge Mount Capability Matte Tin on tail • Friction Lock option • 11 mm, 14 mm, 16.10 mm, –C* No. of positions x (0.80) .0315 19.10 mm, 22 mm, 25 mm = Electro-Polished Selective + (5.27) .2075 and 30 mm Stack Height 50 µ" (1.27 µm) min Au over 02 (Caution: Some automatic 150 µ" (3.81 µm) Ni on Signal Pins in placement/inspection (6.22) (3.81) (7.24) contact area, Matte Tin over .245 machines may have .150 .285 50 µ" (1.27 µm) min Ni on all solder tails component height restrictions. 01 Please consult machinery (0.80) .0315 *Note: –C Plating passes 10 year MFG testing (3.25) specifications.) .128 (7.49) Contact Samtec. (0.76) .295 .030 (1.78) .070 Note: (0.15) (0.89) (3.05) Some lengths, styles and .006 .035 .120 options are non-standard, DIA non-returnable. Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM All parts within this catalog are built to Samtec’s specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.