F-218 (Rev 13FEB18) BTH–030–01–L–D–RA–WT 10 YEAR MFG WITH 50 µ" GOLD EXTENDED LIFE PRODUCT BTH–090–01–F–D–A HIGH MATING CYCLES (0.50 mm) .0197" BTH SERIES BASIC BLADE & BEAM HEADER SPECIFICATIONS NO. OF POSITIONS PLATING OTHER A BTH 01 D For complete specifications and PER ROW OPTION OPTION recommended PCB layouts see www.samtec.com?BTH Insulator Material: Mates with: Black LCP BSH Contact Material: Phosphor Bronze –F –K Plating: = Gold Flash on contact, = (7.00 mm) .276" DIA Au or Sn over –030, –050, –060, Matte Tin on tail Polyimide Film Pick 50 µ" (1.27 µm) Ni –090, –120, –150 & Place Pad Current Rating: –L 2.0 A per pin (2 pins powered) = 10 µ" (0.25 µm) –TR No. of Positions x (0.50) .01969 Flammability Rating: Gold on contact, = Tape & Reel + (5.00) .197 UL 94 VO 01 Matte Tin on tail (120 positions maximum) Operating Temp Range: -55 °C to +125 °C (3.94) (5.97) .235 –C* Voltage Rating: 175 VAC .155 Max Cycles: 100 = Electro-Polished Selective POWER/SIGNAL 02 RoHS Compliant: Yes (0.20) (0.50) 50 µ" (1.27 µm) min Au .008 .01969 APPLICATION over 150 µ" (3.81 µm) Ni on Signal Pins in contact area, PROCESSING Matte Tin over (0.76) Lead-Free Solderable: .030 50 µ" (1.27 µm) min Ni (4.27) Yes .168 on all solder tails SMT Lead Coplanarity: (0.89) Vertical= *Note: –C Plating passes .035 (0.10 mm) .004" max (030-090) 10 year MFG testing DIA Vertical= MATED HEIGHT (0.15 mm) .006" max (120-150)* Right-angle= LEAD STYLE MATED HEIGHT* (0.15 mm) .006" max (030-090)* (5.00) .197 –01 Compatible with *(.004" stencil solution may be available; contact *Processing conditions will UMPT/UMPS for flexible affect mated height. IPG@samtec.com) two-piece power/signal solutions Board Stacking: For applications requiring more than two connectors per board NO. OF POSITIONS PLATING OTHER or 90 positions or higher, BTH 01 D RA WT contact ipg@samtec.com PER ROW OPTION OPTION RECOGNITIONS Mates with: For complete scope of BSH recognitions see www.samtec.com/quality –K –F = (7.00 mm) .276" DIA = Gold Flash on contact, –030, –060, –090 Polyimide Film Pick FILE NO. E111594 Matte Tin on tail & Place Pad –L ALSO AVAILABLE = 10 µ" (0.25 µm) Gold on contact, (MOQ Required) Matte Tin on tail • 30 µ" (0.76 µm) Gold • Edge Mount Capability No. of Positions x (0.50) .01969 + (10.88) .428 • 8 mm, 11 mm, 16 mm, 19 mm and 22 mm Stack (9.78) (3.05) Height (Caution: Some .385 .120 automatic placement/ inspection machines may have component height restrictions. Please consult machinery specifications.) 01 (11 mm, 16 mm, 19 mm and 22 mm not available (5.97) (0.71) with 50 positions) .235 .028 Contact Samtec. (0.64) (0.50) (0.20) 02 (1.32) (1.10) (1.32) .025 .01969 .008 x Note: Some lengths, styles .052 .043 .052 SQ and options are non-standard, DIA non-returnable. Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM All parts within this catalog are built to Samtec’s specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.