SAMTEC ERF8-075-07.0-L-DV-TR

F-218 (Rev 08FEB18) ERF8–020–05.0–S–DV–TR ERF8–040–05.0–S–DV–TR ERF8–060–05.0–L–DV–TR (0.80 mm) .0315" ERF8 SERIES RUGGED HIGH-SPEED SOCKET ® Robust Edge Rate contact improves 10 to 200 I/Os (1.50 mm) Board Mates: “Zippered” SPECIFICATIONS .059" ERM8 unmating NOMINAL WIPE For complete specifications and Cable Mates: recommended PCB layouts see ERCD, ERDP www.samtec.com?ERF8 Insulator Material: Black LCP 10 YEAR MFG WITH 30 µ" GOLD Contact Material: BeCu EXTENDED LIFE PRODUCT Plating: Au or Sn over 50 µ" (1.27 µm) Ni HIGH MATING POWER/SIGNAL CYCLES Current Rating: APPLICATION 2.2 A per pin (2 pins powered) Operating Temp Range: -55 °C to + 125 °C MATED HEIGHT* Voltage Rating: ERF8 ERM8 LEAD STYLE 225 VAC / 318 VDC LEAD RoHS Compliant: STYLE –02.0 –05.0 –08.0 –09.0 HIGH-SPEED CHANNEL PERFORMANCE Yes (7.00) (10.00) (13.00) (14.00) –05.0 ERM8/ERF8 @ 7 mm .276 .394 .512 .551 Mated Stack Height PROCESSING (9.00) (12.00) (15.00) (16.00) –07.0 .354 .472 .591 .629 Rating based on Samtec Lead–Free Solderable: Compatible with reference channel. (11.00) (14.00) (17.00) (18.00) Yes –09.0 For full SI performance data visit UMPT/UMPS for flexible .453 .551 .669 .709 SMT Lead Coplanarity: Samtec.com or contact SIG@samtec.com two-piece power/signal solutions *Processing conditions will affect mated height. (0.10 mm) .004" max (005-030) (0.12 mm) .005" max (040-060)* (0.15 mm) .006" max (070-100)* PLATING *(.004" stencil solution NO. OF POSITIONS LEAD OTHER may be available; contact ERF8 DV TR OPTION PER ROW STYLE OPTION IPG@samtec.com) RECOGNITIONS For complete scope of Specify –L recognitions see LEAD = 10 µ" –TR www.samtec.com/quality –005, –010, –011, –L (0.25 µm) STYLE = Tape & = Latching –013, –020, –025, Gold on Reel from (Not available with contact, FILE NO. E111594 Packaging –030, –035 –040, –049, –EGP or –EGPS options chart Matte Tin (Not & Lead Style –07) –050, –060, –070, –075 on tail available PROTOCOLS LEAD with 100 A STYLE –EGP –100 –S • 100 GbE positions) = Extended Guide Post (5.10) (Available with –05.0 lead style only) = 30 µ" ® –05.0 • PCI Express (Lead Style –07.0 only) .200 (0.76 µm) (Not available with (7.00) Gold on 07.0 –L & –EGPS option) .276 ALSO AVAILABLE contact, (MOQ Required) (9.00) Matte Tin –09.0 .354 –EGPS on tail • Mezzanine stack heights = Extended Guide Post Shield No. of Positions x Contact Samtec. (Lead Style –05.0 & –07.0 only) (0.80) .0315 + (6.00) .236 (Not available with –L –L & –EGP = No. of Positions x & –EGP option) (0.80) .0315 + (7.50) .295 (–010, –020, –025, –030 only) APPLICATIONS –EGPS = No. of Positions x (7.25) (0.80) .0315 + (10.00) .394 STANDARD POS. PART NOs. SERIES 01 –K .285 10 ASP-148421-01 ERF8-DV = (6.00 mm) .236" DIA ™ (3.35) NEXUS5001 .org (5.60) 11 ASP-137969-01 ERF8-DV ™ Polyimide Film .132 POWER.org .220 –EGP Pick & Place Pad 17 ASP-137973-01 ERF8-DV 02 ARM/HSSTP 20 ASP-130367-01 ERF8-DV (6.20) (2.50) 23 ASP-130368-01 ERF8-DV (5.30) .098 .244 ™ .209 25 ASP-148422-01 ERF8-DV NEXUS5001 .org ™ (1.07) POWER.org 35 ASP-135029-01 ERF8-DV (3.35) .042 .132 A 40 ASP-148424-01 ERF8-DV Notes: (0.64) (1.32) (0.80) (7.20) Patented (5.40) .025 .052 .0315 (0.94) .213 .283 DIA Some lengths, styles and .037 –L –EGPS options are non-standard, non-returnable. Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM All parts within this catalog are built to Samtec’s specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.