F-218 (Rev 15FEB18) HSEC8–125–01–L–DV–A HSEC8–149–01–L–DV–A (0.80 mm) .0315" HSEC8-DV SERIES ® VERTICAL EDGE RATE CARD SOCKET Mates with (1.60 mm) .062" or (2.36 mm) .093" cards MISALIGNMENT Card Mates: SPECIFICATIONS MITIGATION (1.60 mm) .062" card, For complete specifications and (2.36 mm) .093" card, recommended PCB layouts see HSC8 www.samtec.com?HSEC8-DV Cable Mates: Insulator Material: ECDP Black Liquid Crystal Polymer Contact: BeCu Plating: Au or Sn over 10 YEAR MFG 50 µ" (1.27 µm) Ni WITH 30 µ" GOLD Current Rating: EXTENDED LIFE 2.8 A per pin PRODUCT (2 adjacent pins powered) HIGH MATING Operating Temp: CYCLES -55 °C to +125 °C RoHS Compliant: Yes PROCESSING HIGH-SPEED CHANNEL PERFORMANCE Lead–Free Solderable: HSEC8-DV Yes Rating based on Samtec reference channel. SMT Lead Coplanarity: For full SI performance data visit Samtec.com 28 (0.10 mm) .004" max (10-60) Custom designs compensate for or contact SIG@samtec.com Gbps misalignment. Contact Samtec. RECOGNITIONS For complete scope POSITIONS OTHER PLATING CARD of recognitions see HSEC8 DV A 1 PER ROW OPTION OPTION THICKNESS www.samtec.com/quality FILE NO. E111594 –01 = (1.60 mm) .062" –L –K thick card 09, 10, 13, 20, = 10 µ" (0.25 µm) Gold on contact, = (7.01 mm) .276" DIA Matte Tin on tail Polyimide Film 25, 30, 37, 40, 49, –03 Pick & Place Pad 50, 60, 70, 80, 100 = (2.36 mm) .093" (with –01 card) –S (13, 25, 49 only available thick card = (6.25 mm) .246" DIA = 30 µ" (0.76 µm) Gold on contact, with –L or –L2 option; Polyimide Film Matte Tin on tail 09 only available with –L2 option; Pick & Place Pad 37 only available with –L option) (with –03 card) POSITIONS A B No. of Positions x (0.80) .0315 + (7.80) .307 PER ROW –BL 02 † (4.50) .177 (11.80) .465 = Board Locks 09* † 13* (6.10) .240 (15.00) .591 (–01 card only) † (6.10) .240 (24.60) .969 25* (Weld tab standard) † 37 (18.10) .713 (34.20) 1.346 01 40 (18.90) .744 (36.60) 1.441 A –L † (22.90) .902 (43.80) 1.724 49* = Latching Option B 50 (22.90) .902 (44.60) 1.756 (–01 card only) (26.90) 1.059 (52.60) 2.071 60 (13, 25, 37, 49 only) † 70 (26.90) 1.059 (60.60) 2.386 (Weld tab standard) † 80 (26.90) 1.059 (68.60) 2.701 (1.32) † (26.90) 1.059 (84.60) 3.331 100 CABLE CONNECTOR .052 Positions where no dimensions are given –L2 ECDP–04 HSEC8–109–L2 do not have keying feature. = ECDP Latching ECDP–08 HSEC8–113–L2 * Mates with ECDP Series. (–01 card only) ECDP–16 HSEC8–125–L2 (No. of Positions + 6) x (0.80) .0315 + (0.60) .024 † Available with –01 Card Only. (09, 13, 25, 49 only) ECDP–32 HSEC8–149–L2 09, 13, 25, 37, 100 (For use with ECDP) Notes: (Weld tab standard) While optimized for 50 W applications, this connector No. of Positions x (0.80) .0315 + (4.60) .181 with alternative signal/ground –WT 02 patterns may also perform well = Weld tab (7.98) (7.80) in certain 75 W applications. .314 .307 (5.60) (7.00) Contact Samtec for further .220 .276 –TR information. = Tape & Reel (1.12) .044 DIA 01 (1.75) (0.80) .0315 Some lengths, styles and (09 - 70 only) No. of Positions x (0.80) .0315 + (2.20) .087 .070 options are non-standard, 10, 20 & 30 non-returnable. Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM All parts within this catalog are built to Samtec’s specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.