SAMTEC MIS-076-01-L-D

F-218 SUPPLEMENT MIS–019–01–F–D ® MIS–057–01–L–D MIS–038–01–F–D (0.635 mm) .025" (0.635 mm) .025" MIS SERIES MIXED TECHNOLOGY SOCKET Board Mates: SPECIFICATIONS MIT Integral metal plane For complete specifications and Standoffs: for power or ground recommended PCB layouts see SO www.samtec.com?MIS Insulator Material: Polarized Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au or Sn over • Mixed 50 µ" (1.27 µm) Ni technology Operating Temp Range: footprint -55 °C to +125 °C Voltage Rating: 275 VAC Max Cycles: 100 HIGH-SPEED CHANNEL PERFORMANCE RoHS Compliant: Yes MIT/MIS @ 5 mm Mated Stack Height Rating based on Samtec reference channel. 76 signal lines PROCESSING For full SI performance data visit Samtec.com 28 per linear inch or contact SIG@samtec.com Gbps Lead–Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (019-057) Board Stacking: For applications requiring more than two connectors per board PLATING OTHER NO. OF POSITIONS contact ipg@samtec.com 01 MIS D OPTION OPTION PER ROW RECOGNITIONS For complete scope of recognitions see –K www.samtec.com/quality = (7.00 mm) –F .275" DIA –019, –038, –057 = Gold Flash on Signal Pins and Polyimide (38 total positions per bank) FILE NO. E111594 Ground Plane, Matte Tin on tails film Pick & Place Pad –L = 10 µ" (0.25 µm) –TR ALSO AVAILABLE Gold on Signal Pins and = Tape & (MOQ Required) Ground Plane, Matte Tin on tails Reel • 11 mm, 16 mm, 18.75 mm –C* and 22 mm stack height = Electro-Polished Selective • 30 µ" (0.76 µm) Gold 50 µ" (1.27 µm) min Au over • Differential Pair and 150 µ" (3.81 µm) Ni on “Partitionable” (combine Signal Pins in contact area, (No. of Positions/19) x (12.70) .500 + (12.70) .500 differential & single-ended 10 µ" (0.25 µm) min Au over (12.70) .500 banks in same connector) 01 50 µ" (1.27 µm) Ni on Ground available. Plane in contact area, Matte Tin (6.22) • 76, 95, 114 and 133 over 50 µ" (1.27 µm) min Ni .245 positions per row on all solder tails 02 Contact Samtec. (0.635) (0.15) .025 .006 MATED HEIGHT* (1.32) .052 MIT LEAD (3.43) MIS (3.63) STYLE .135 LEAD .143 STYLE (7.49) –01 –02 .295 (0.69) .027 (5.00) (8.00) –01 (0.18) .197 .315 .007 *Processing conditions will affect mated height. *Note: –C Plating passes See SO Series for board Note: Rugged through-hole ground plane soldered to board 10 year MFG testing space tolerances. (requires paste-over-hole, not press-fit) for added retention to PCB. Note: Some lengths, styles and options are non-standard, non-returnable. Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM All parts within this catalog are built to Samtec’s specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.