SAMTEC MIT-038-02-L-D

F-218 SUPPLEMENT MIT–019–01–F–D MIT–038–01–F–D ® MIT–057–01–L–D (0.635 mm) .025" MIT SERIES MIXED TECHNOLOGY HEADER Board Mates: Integral metal plane SPECIFICATIONS MIS for power or ground For complete specifications and Standoffs: 76 signal lines recommended PCB layouts see SO www.samtec.com?MIT per linear inch Insulator Material: Liquid Crystal Polymer Choice of Contact Material: mated heights Phosphor Bronze Plating: Au or Sn over • Mixed 50 µ" (1.27 µm) Ni technology Operating Temp Range: footprint -55 °C to +125 °C Voltage Rating: 275 VAC Max Cycles: 100 HIGH-SPEED CHANNEL PERFORMANCE RoHS Compliant: Yes MIT/MIS @ 5 mm Mated Stack Height Rating based on Samtec reference channel. PROCESSING For full SI performance data visit Samtec.com 28 or contact SIG@samtec.com Gbps Lead–Free Solderable: Polarized Yes SMT Lead Coplanarity: (0.10 mm) .004" max (019-057) Board Stacking: For applications requiring more than two connectors per board NO. OF POSITIONS LEAD PLATING OTHER contact ipg@samtec.com MIT D PER ROW STYLE OPTION OPTION RECOGNITIONS For complete scope of Specify recognitions see –K www.samtec.com/quality LEAD = (7.00 mm) –019, –038, –057 –F .275" DIA STYLE (38 total positions per bank) = Gold Flash on Signal Pins and Polyimide from FILE NO. E111594 Ground Plane, Matte Tin on tails film Pick & chart Place Pad ALSO AVAILABLE –L = 10 µ" (0.25 µm) Gold on (MOQ Required) –TR Signal Pins and Ground Plane, = Tape & Matte Tin on tails • 11 mm, 16 mm, 18.75 mm Reel and 22 mm stack height –C* • 30 µ" (0.76 µm) Gold LEAD = Electro-Polished Selective A • Differential Pair and STYLE 50 µ" (1.27 µm) min Au over “Partitionable” (combine (4.27) .168 –01 150 µ" (3.81 µm) Ni on Signal Pins differential & single-ended (7.26) .286 –02 in contact area, 10 µ" (0.25 µm) banks in same connector) min Au over 50 µ" (1.27 µm) Ni available. on Ground Plane in contact area, • 76, 95, 114 and 133 Matte Tin over 50 µ" (1.27 µm) min (No. of Positions/19) x (12.70) .500 + (11.43) .450 positions per row Ni on all solder tails (12.70) Contact Samtec. .500 02 (5.97) (7.11) .235 .280 MATED HEIGHT* MIS MIT LEAD STYLE 01 (0.635) (0.20) LEAD –01 –02 .025 .008 STYLE (7.11) .280 (1.40) (5.00) (8.00) –01 .055 .197 .315 A *Processing conditions will affect mated height. See SO Series for (0.38) board space tolerances. (0.58) .023 x (0.38) .015 .015 *Note: –C Plating passes 10 year MFG testing Note: Rugged through-hole ground plane soldered to board Note: Some lengths, styles (requires paste-over-hole, not press-fit) for added retention to PCB. and options are non-standard, non-returnable. Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM All parts within this catalog are built to Samtec’s specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.