TE CONNECTIVITY 1410140-1

Embedded Computing Board-Level Interconnects Rugged High-Speed Solutions That Save Weight and Space AEROSPACE, DEFENSE & MARINE /// EMBEDDED COMPUTING Table of Contents Introduction 3 VITA 46: MULTIGIG RT 2 and MULTIGIG RT 2-R Connectors 5 Additional VPX 46 Products 8 VITA 66: Optical Modules 9 VITA 67: RF Modules 10 VITA 61: Mezalok Connectors 11 VITA 62: MULTI-BEAM XLE Power Connectors 12 Next-Generation Connectivity: Fortis Zd Connectors 13 Fortis Zd LRM Connector System 15 Complete Solutions for Embedded Computing 19 AEROSPACE, DEFENSE & MARINE /// EMBEDDED COMPUTING PAGE 2 Embedded Computing Rugged, Weight- and Space-Saving High-Speed Solutions SWaP: Reduce Size and Weight Increase Power, Data and Bandwidth Speed Design with Open Architecture Solutions Next-generation processors need next-generation connectivity to keep pace with the growing demand for bandwidth even as space, weight, and power savings become critical. TE Connectivity (TE) has been pushing the bandwidth envelope by adapting high-speed commercial technology and combining it with our expertise in rugged packaging. The results are board-level interconnects that give you more performance in harsh military and aerospace applications. Beyond Speed We are also reducing size through higher contact densities and supporting RF and optical interconnects at the board level. And to allow compact, high-speed box-to-box connectivity, we have a full range of I/O connectors supporting rates to 10 Gb/s. Meeting the Needs of Battlespaces We are meeting the demanding needs of battlespaces with ruggedized copper and fiber interconnect and cable assemblies. And we are helping to protect systems with lightweight shielding and EMI-immune datapaths. TE is focusing our technology to minimize size, weight and power consumption, to increase bandwidth, and to enable open architecture systems. More Performance for Land, Sea, Air, and Space • Avionics and Vetronics • Communications Hubs and Processing • Electronic Warfare and Countermeasure Management • Two-Level Maintenance and ESD Sensitive Applications • Mobile and Fixed Satellite Terminals and Ground Base Stations • Power Supply and Distribution • Radar Interface and Processing – RF and Digital • Sensor Array Hubs and Data Processing • Vehicle Mission Computers and Navigation • Weapons Control and Targeting • Space TE Components . . . TE Technology . . . TE Know-how . . . AMP | AGASTAT | CII | HARTMAN | KILOVAC | MICRODOT | NANONICS | POLAMCO | Raychem | Rochester | DEUTSCH SEACON Phoenix | LL ROWE | Phoenix Optix | AFP | SEACON Empower Engineers to Solve Problems, Moving the World Forward. AEROSPACE, DEFENSE & MARINE /// EMBEDDED COMPUTING PAGE 3 Embedded Computing VPX Compliant Solutions As the latest standard architecture evolving from VMEbus, the VPX standard meets the needs for data-intensive processing in the aerospace and defense industries, where both ruggedness and high-speed performance are crucial. Supporting 6.25 Gb/s in a switched fabric architecture, VPX systems are designed for flexible application of demanding high- speed protocols, such as 10G Ethernet, RapidIO, InfiniBand, and HyperTransport, in ground, aerospace, and marine applications. Scalable VPX systems are highly scalable and flexible, supporting both 3U and 6U formats to meet the widest range of needs. The VPX backplane uses the TE 7-row MULTIGIG RT 2 connector system to support both single-ended and differential signals. Open Architecture As a widely used standard, VPX promotes interoperability, a healthy choice of suppliers, and economies of scale that result from higher board volumes. Flexible Not only does VPX accommodate new technologies, it has expanded beyond backplane/daughterboard signaling to embrace mezzanine application, power modules, and optical and RF connectivity—all with the goal of providing unmatched flexibility and capabilities for embedded computing. High Speeds, Multimedia, Maximum Flexibility TE’s portfolio of VPX systems gives you a complete array for high-speed data, optical, RF, power, and mezzanine connectivity. More choice means more flexibility in achieving specific system architectures with standards- based solutions. Get the high-speed signal integrity advanced applications require in rugged, reliable connectors. AEROSPACE, DEFENSE & MARINE /// EMBEDDED COMPUTING PAGE 4 Embedded Computing VITA 46 MULTIGIG RT 2 and MULTIGIG MULTIGIG RT 2 RT 2-R Connectors RUGGED Modular MULTIGIG RT 2 Connector System with • The standard for VITA 46 applications Data Rates up to 10 Gb/s • Modular connector system features a protected backplane connector The MULTIGIG RT 2 connector, the standard for VITA 46, represents a huge step forward in the world of rugged computing FAST and C4ISR enabling technology. The connectors support speeds • Supports speeds up to 10 Gb/s, up to 10 Gb/s, providing a comfortable performance margin in providing a comfortable performance VPX applications. margin in VPX applications This modular connector system features a protected pinless backplane connector and wafer-based design in place of FLEXIBLE pin contacts. Wafers, available for differential, single-ended, • Wafers are easily modified to and power needs, can be easily modified to support specific support the need for propagation customer needs for characteristic impedance, propagation delay, characteristic impedance, and delay, and other electrical parameters. This lightweight other electrical parameters connector system also offers built in ESD features, enabling field • Lightweight connector offers serviceability, and is fully qualifies for VITA 47 environments. built-in ESD features enabling Ultra-Rugged MULTIGIG RT 2-R Connectors field serviceability MULTIGIG RT 2-R connectors are an evolution of MULTIGIG RT MULTIGIG RT 2-R 2 connectors, designed to offer even more ruggedness and EXTREME RUGGEDNESS reliability in demanding high-vibration environments. They go beyond VITA 47 environmental performance to meet the • Passes extreme requirements of demanding requirements of VITA 72. VITA 72 study group The connectors are specified for VITA 78 SpaceVPX fault- • Features a quad-redundant contact tolerant interoperable backplanes and modules. The lightweight system for greater reliability in a high connectors offer low outgassing and resist the growth of tin vibration environment whiskers to high reliability in the challenging environment • Specified for VITA 78 SpaceVPX of space. applications Backward compatible to all existing VITA 46 daughtercards, ULTRA FLEXIBLE rugged MULTIGIG RT 2-R connectors have a pinless interface • Compatible with standard MULTIGIG tested to 10,000 mating/unmating cycles. The connector has RT-2 connectors for VITA 46 been torture tested by exposing a 6U VPX test unit to random 2 vibration levels of 0.2 g /Hz for 12 hours. • Optimized footprints for signal integrity and ease of board design • Low outgassing MULTIGIG RT 2 MULTIGIG RT 2-R AEROSPACE, DEFENSE & MARINE /// EMBEDDED COMPUTING PAGE 5 Embedded Computing DAUGHTERCARD BACKPLANE Part No. Part No. Module Position Module Position MULTIGIG MULTIGIG RT MULTIGIG MULTIGIG RT RT 2 2-R RT 2 2-R P0 1410189-3 2102772-1 J0 1410186-1 2102735-1 Differential 1410187-3 2102771-1 J1, J3, J4, J5 1410140-1 2102736-1 P1, P2, P3, P4, P5, P6 Single-Ended 1410190-3 2102847-1 J2, J6 1410142-1 2102737-1 2000713-X 1-1469491-X 1-1469492-X 2000676-X (Machined (Standard Keying Guide (Standard Keying Guide Pin (Stainless 6061 Zinc Die Socket Modules Zinc Die Steel) Aluminum with Cast) Cast) ESD Contact) See TE drawings for guide module and pin options. RoHS equivalents available. SpaceVPX CONNECTORS (PER VITA 78) FOR SpaceUM MODULES VITA 78 Module Designation 3U position 6U position Part No. Module 8 P0 P0 2286123-1 Module 16A — P1, P5 2286117-1 Module 16B P2 P2, P6 2286118-1 Module 16C — P3 2286119-1 Module 16D — P4 2286120-1 Module 16E P1 — 2286121-1 DAUGHTERCARD MODULES FOR VITA 66.4 AND 67.1 3U APPLICATIONS Part No. Module Position MULTIGIG MULTIGIG RT RT 2 2-R P0 + P1A 1410326-3 2286250-1 Differential 1410187-3 2102771-1 P1B + P2A P0 + P1A VITA P1B + P2A 66.4/67.1 Single-Ended 1410190-3 2102847-1 AEROSPACE, DEFENSE & MARINE /// EMBEDDED COMPUTING PAGE 6 Embedded Computing REAR TRANSITION MODULE REAR TRANSITION BACKPLANE Part No. Part No. Module Position Module Position MULTIGIG MULTIGIG MULTIGIG MULTIGIG RT 2 RT 2 RT 2-R RT 2-R See Note 1 1410964-1 2102768-1 RP0 1410968-3 2102773-1 RJ0 See Note 2 1410965-1 2102850-1 Differential 1410975-3 2102774-1 RP1 See Note 3 1410140-1 2102736-1 Single-Ended 1410970-3 2102849-1 RJ1 See Note 4 1410966-1 2102851-1 Differential 1410971-3 2102775-1 RP2 RJ2 1410186-1 2102735-1 Single-Ended 1410972-3 2102848-1 RJ3 1410142-1 2102737-1 RP3, RP4, Differential 1410975-3 2102774-1 RJ4, RJ5, RJ6 1410140-1 2102736-1 RP5, RP6 1410956-1 2226127-1 Keying Guide Pin (Standard Zinc (Stainless Single-Ended 1410190-3 2102847-1 Die Cast) Steel) 2000713-X 1-1469492-X (Machined Keying Guide (Standard Zinc 6061 Notes (Reference VITA 46.10; Observation 3-6): Socket Modules Note 1: 16 column shell, 15 columns of contacts Die Cast) Aluminum with Note 2: 16 column shell, 7 columns of contacts present ESD Contact) (plus contacts i9-16) Note 3: 16 column shell, 16 columns of contacts Note 4: 16 column shell, 8 columns of contacts present (plus contacts i1-8) AEROSPACE, DEFENSE & MARINE /// EMBEDDED COMPUTING PAGE 7 Embedded Computing Additional VPX-Compatible Products Stacking Compliant Pin Connector Part No. 2102785-1 Permanent Stacking • Compliant pin termination on both sides • Well suited for rigid flex or board-to-board stacking where a separable interface is not required Convenient • Simple press-fit application • Connector footprint matches the MULTIGIG RT 2 daughtercard connector pattern for low noise and low loss • 56 position modules, end-to-end stackable to build the pin count required with standard components Low Profile • 4 mm stack height VITA 46 Interposer Part No. 2226027-1 Parallel Backplanes • Stacking connector to enable parallel backplanes in a VPX chassis. • Mates to backplane VITA 46 connectors, maintaining VITA 46 pinout • 25 mm stack height VPX Daughtercard (Plug-In Module) Covers Part No. 2226808-1 6U Part No. 2226808-2 3U Rugged Protection • Durable polycarbonate protective cover applied to a plug-in card • Prevents connector damage in handling AEROSPACE, DEFENSE & MARINE /// EMBEDDED COMPUTING PAGE 8 Embedded Computing VITA 66 Optical Modules The VITA 66 standard for optics gives you the choice of MT array connectors, ARINC 801 termini, or expanded beam (EB) contacts using a common module. With an aerospace pedigree, each style of termini offers different benefits in terms of density, ruggedness, repairability, and other characteristics. MT Ferrules • Highest-density interconnection • Up to 48 fibers in a 3U system • Up to 248 fibers in a 6U system MORE CHOICE • Choose from MT array connectors, ARINC 801 Termini ARINC 801 termini, or expanded • Industry-standard 1.25 mm high-performance ceramic ferrules beam (EB) contacts using a • Physical contact technology for very low insertion loss, common module with angled polishes • Keyed orientation for optimal single-mode performance • Up to 248 fibers in a 6U system • Each style of termini offers Expanded Beam Termini different benefits • Up to four fibers per module • Ball lens to tolerate less than pristine conditions EASY TO USE • Excellent for handling shock, vibration, or repeated • Common mounting interface mating/unmating requirements for the various fiber- • Well suited to two-level maintenance or applications calling optic interconnects within 3U and for frequent insertion/extraction 6U VPX applications • Quickly and confidently implement the best solution for specific applications Part No. Interface RUGGED Backplane Daughtercard • Improved density, ruggedness, and VITA 66.1: MT 2000973-1 2000974-1 repairability via three termini styles VITA 66.2: ARINC 801 — — • The three module varieties are based VITA 66.3: Expanded Beam 2102282-1 2102283-1 upon proven optical termini for VITA 66.4: MT 2226880-1 2226881-1 military and aerospace applications MT Ferrule Kit 2102866-1 2102866-2 (12 Fiber, Multimode) Contact TE about availability and additional fiber assemblies. AEROSPACE, DEFENSE & MARINE /// EMBEDDED COMPUTING PAGE 9 Embedded Computing VITA 67 RF Modules VITA 67 RF modules from TE are modular systems designed specifically to allow backplane/daughtercard multi-contact mating within a robust platform to withstand the mechanical rigors of military and aerospace applications. They are also fully compatible with VPX packaging to make it easy and convenient to achieve RF connectivity within a well- established architecture. The contacts tolerate generous misalignment to allow blind mating and be configured to eliminate the possibility of stubbing. The contacts are housed in robust stainless steel MORE CHOICE or aluminum modules that hold four or eight contacts. The • Modular design with 4- or modules are configured to provide RFI/EMI shielding between 8-position modules for application- the RF contacts and provide a high level of adjacent channel specific configuration isolation of at least 100 dBc up through 40 GHz. • Modules available in stainless steel and aluminum VITA 67 MODULES • Float-mounted jack maintains Part No. Interface positive RF connection Mounting Flange Material Side 4-Position 8-Position Stainless VERSATILE Countersink 1996883-4 1996705-4 Steel Through Holes to • Will support 0.80” card pitch Accept 2-56 UNC Daughtercard Aluminum 2157338-3 2157350-3 (Plug-In • .240” center-to-center Stainless Module) 2101925-4 2101924-4 2-56 UNC contact spacing Steel Mounting Holes Aluminum 2157339-4 2157340-4 • RF contacts are available for a variety of cables Part No. Contact Interface to Module ROBUST Rear of Backplane Material 4-Position 8-Position • SMPM-based contact performance SMPM Plug Stainless 1996884-1 1996706-1 (Snap On) Steel to 40 GHz Backplane OSMM Jack Stainless 2101510-2 1996777-2 • Excellent channel-to-channel (Threaded) Steel isolation Direct Attach Cable Aluminum — 2157553-1 • Higher packaging density saves RF CONTACTS space and weight Interface Side Cable Type* Part No. .047" Dia. 1996771-1 Daughtercard .086" Dia. 1996390-1 .086" Low-Loss Cable 2101814-1 .047" Dia. (For Direct Attach Cable) 2157248-1 .086" Dia. (For Direct Attach Cable) 2101012-1 Backplane .086" Low-Loss Cable (For Direct Attach Cable) 2157022-1 NA — Press Fit Directly Into Backplane 1996318-1 *Semirigid cable or flex equivalent. TOOLING Tool Use Part No. OSMM Low-Profile Wrench Use for OSMM Connectors Mating to Backplane Modules 2119704-1 SMPM Jack Insertion/Extraction Tool Use On 1996390-1, 1996771-1 2101595-1 SMPM Plug Extraction Tool Use On 2101012-1, 2157248-1 2161640-1 AEROSPACE, DEFENSE & MARINE /// EMBEDDED COMPUTING PAGE 10 Embedded Computing VITA 61 Mezalok Connectors VERSATILE TE’s Mezalok connectors are rugged surface mount connectors • 114-position module is VITA 61 featuring a quad redundant mini-box contact system having compliant 500-mating-cycle durability. • 60, 114, and 320 positions Engineered for high-speed reliability across the most adverse • 10, 12, 15, and 18 mm stack heights environments, the Mezalok connector enables 10+ Gb/s data ROBUST rates coupled with a four-point redundant contact system based on the M55302 standard. The 114-position connectors are • Rugged surface-mount compliant with VITA 61 for XMC 2.0 applications. mezzanine connector with 500 mating cycle durability • Improved thermal cycling stability compared to VITA 42 connectors—2000 or more thermal shock cycles • Supports data rates to 5+ Gb/s • Anti-stubbing design during mating HIGH PERFORMANCE • Mini-Box contact system provides four points of contact for ultra-reliability • LCP plastic housings offer superior thermal stability and low outgassing • Compliant BGA board-attach supports standard surface mount processing and excellent thermal stability 50 Microinch Gold Mating Face 30 Microinch Gold Mating Face Tin-Lead BGA Lead Free BGA Tin-Lead BGA Lead Free BGA 60 (6 x 10) Positions Pin Connector 2102079-1 2102079-2 2102079-3 2102079-4 10 mm 2102080-1 2102080-2 2102080-5 2102080-6 Socket 12 mm 2102080-3 2102080-4 2102080-7 2102080-8 Connector 18 mm 2102080-9 1-2102080-0 1-2102080-1 1-2102080-2 114 (6 x 19) Positions Pin Connector 2102060-1 2102060-2 2102060-3 2102060-4 10 mm 2102061-1 2102061-2 2102061-5 2102061-6 12 mm 2102061-3 2102061-4 2102061-7 2102061-8 Socket Connector 15 mm 1-2102061-3 1-2102061-4 1-2102061-5 1-2102061-6 18 mm 2102061-9 1-2102061-0 1-2102061-1 1-2102061-2 320 (8 x 40) Positions Pin Connector 2102429-1 2102429-2 2102429-3 2102429-4 10 mm 2102430-1 2102430-2 2102430-5 2102430-6 Socket Connector 18 mm 2102430-9 1-2102430-0 1-2102430-1 1-2102430-2 AEROSPACE, DEFENSE & MARINE /// EMBEDDED COMPUTING PAGE 11 Embedded Computing VITA 62 MULTI-BEAM XLE Power Connectors The MULTI-BEAM XLE power connector, specified for the VPX VITA 62 power supply standard, offers 50 A and 20 A contacts. The design is hot pluggable, features a vented housing for heat dissipation, tolerates mating misalignment, and has lower mating forces. HIGH PERFORMANCE • 20 A and 50 A power contacts, plus signal contacts • 3-beam high-conductivity-copper contact design allows for a greater angular misalignment between mating connectors and offers a lower mating force • Hot-plug capable CONVENIENT • Slim guide sockets reduce the overall PCB footprint • Vented housing allows for better heat dissipation • Connector tolerates mating misalignment • Lower mating force Connector Configuration (No. of Contacts) Part No. High Power (50 A) Low Power (20 A) Signal Plug-In Module Size Receptacle Plug 2 6 32 3U 1-6450869-4 6450849-7 7 — — 6U 6450863-5 6450843-6 10 — 36 6U 1-6450869-0 6450849-6 AEROSPACE, DEFENSE & MARINE /// EMBEDDED COMPUTING PAGE 12 Embedded Computing Next-Generation Connectivity Fortis Zd Connectors Extreme Mechanical and Electrical Performance for the Most Demanding Bandwidth Applications VERSION 1 With high speeds and high reliability in demanding applications, the Fortis Zd connector family is designed to Six-Row Connectors Nine-Row Connectors meet next-generation processing-intensive applications. The connectors support speeds of 12+ Gb/s in a design that saves weight and space. 14.25 19.05 12.25 17.05 7.43 FAST 59.30 7.43 59.30 • Allows 12+ Gb/s data rates in a 22.83 design that saves weight and space 10.65 15.82 15.55 RUGGED 20.35 • Extreme mechanical and electrical performance for the most 62.91 62.91 26.90 demanding applications • Space-compatible materials The Mini-Box contact, with spring contact on all four of the mating posts, has years of • Proven compliant pin board proven reliability in rugged applications. attach facilitates manufacturing VERSION 2 efficiency, repairability, and superior electrical performance Six-Row Connectors Nine-Row Connectors • Protected pin field on backplane for reliability and durability FLEXIBLE • Modular design allows for user 59.30 59.30 configurability and modular evolution • M55302-heritage Mini-Box separable 19.05 14.25 interface provides four points of 17.05 12.25 contact on all sides of the pin 7.43 • Staggered daughtercard pin field 7.43 supports two-level maintenance HIGH PERFORMANCE • Three shell varieties for application versatility, including: 62.91 Shielded for EMI protection 62.91 Plastic for lowest weight 22.83 Machined metal shell for ruggedized daughtercard 15.82 10.65 20.35 15.55 • 3-pair (9-row) and 2-pair (6-row) versions available to accommodate multiple slot pitches 26.90 AEROSPACE, DEFENSE & MARINE /// EMBEDDED COMPUTING PAGE 13 Embedded Computing STANDARD FORTIS Zd MODULES Part No. Left Center Right Full Shroud 10 Col. 10 Col. 20 Col. 10 Col. 10 Col. 20 Col. 6-Row (2-Pair) Connector Modules Right-Angle Differential 2102086-1 2102087-1 2102096-1 2102088-1 2102081-1 2102232-1 Vertical — 2102092-1 2102093-1 2102098-1 2102092-1 2102094-1 2102234-1 9-Row (3-Pair) Connector Modules Differential 2000890-1 2000891-1 2000903-1 2000892-1 2102155-1 2102159-1 Right-Angle Single Ended 2102314-1 2102315-1 2102316-1 2102317-1 2102318-1 2102319-1 Vertical — 2000895-1 2000896-1 2000905-1 2000895-1 2102157-1 2102161-1 -1 parts have tin-lead plated contact tails; for lead-free tin order -2. SHIELDED FORTIS Zd MODULES Part No. 10 Col. 20 Col. 30 Col. 40 Col. 50 Col. 60 Col. 6-Row (2-Pair) Connector Modules Right-Angle Differential 2102515-1 2102515-2 2102515-3 2102515-4 2102515-5 2102515-6 Vertical — 2102516-1 2102516-2 2102516-3 2102516-4 2102516-5 2102516-6 9-Row (3-Pair) Connector Modules Differential 2102247-1 2102247-2 2102247-3 2102247-4 2102247-5 2102247-6 Right-Angle Single Ended 2102320-1 2102320-2 2102320-3 2102320-4 2102320-5 2102320-6 Vertical — 2102248-1 2102248-2 2102248-3 2102248-4 2102248-5 2102248-6 MACHINED METAL SHELL FOR RIGHT-ANGLE FORTIS Zd MODULES Part No. 10 Col. 20 Col. 30 Col. 40 Col. 50 Col. 60 Col. 6-Row (2-Pair) Connector Modules Right-Angle Differential 2102114-1 2102114-2 2102114-3 2102114-4 2102114-5 2102114-6 9-Row (3-Pair) Connector Modules Right-Angle Differential 2102077-1 2102077-2 2102077-3 2102077-4 2102077-5 2102077-6 Shells are applied to right-angle modules, ordered separately. They mate with standard vertical modules. GUIDE HARDWARE Part No. Universal Guide Hardware VITA 46 Rugged VITA 46 Machined Guide Pin 223969-X 1-1469491-X 2000676-X Guide Module 223979-X 1-1469492-X 2000713-X (with ESD contact) See TE drawings for guide module and pin options. AEROSPACE, DEFENSE & MARINE /// EMBEDDED COMPUTING PAGE 14 Embedded Computing Fortis Zd LRM Connector System Rugged Next-Generation Packaging Made Flexible with Lightweight, Modular System The Fortis Zd LRM Connector System is an innovative modular connector system for rugged next-generation packaging, from avionics boxes to military ground vehicles. Optical and RF modules are based on VITA 66 and 67, featuring precision guide hardware and shell features that ensure reliable plug-in and excellent stability under extreme vibration. It features a rugged, lightweight, multibay shell that accepts HIGH PERFORMANCE high-speed digital signal, power, RF and optical modules. • Performance to 12+ Gb/s Based on well-established technology, Fortis Zd LRM connector • Controlled impedance design systems feature M55320 box contacts, with four points • Low crosstalk and superior of contact, to provide electrical stability in high-vibration electrical characteristics environments. Additionally, the compliant pin board attach results in manufacturing efficiency, reparability, and superior • Low noise board footprint electrical performance. WEIGHT SAVING MODULAR DESIGN • Lightweight aluminum shell with chromate finish • 3, 4, 8 or 9 bays standard, with other sizes possible • Easy mixing and matching of modules RUGGED RELIABILITY • High-temperature, space- compatible materials • Shell’s integral guide keys align and minimize micromotion between boards FULL RANGE OF MODULES • Single-ended signals • Differential signals • Power • RF • Fiber optics AEROSPACE, DEFENSE & MARINE /// EMBEDDED COMPUTING PAGE 15 Embedded Computing Shells Rugged and Lightweight • Precision machined from aluminum for light weight • Chromate finished Modular Flexibility • Identical bays for flexibility in mixing and matching modules and positioning them optimally 3U and 6U Solutions • 3 and 4-bay shells support 3U boards • 8 and 9-bay shells support 6U boards • Other sizes can be made available • Custom shell features possible, including integrated covers Signal Modules Flexible • Differential and single-ended signal daughtercard modules • Universal backplane module for both differential and single-ended signals • 90 contacts per module • Differential module supports 30 pairs, with ground shields for isolation Reliable • Reliable box contacts with four points of contact • RoHS compliant High-Power Modules High Current • 55 A contacts • Two contacts per module • 3-beam high-conductivity contacts • Vented housing for thermal dissipation Tried and True Technology • Based on MULTI-BEAM XLE connector design • Same interface as used in VITA 62 power supply modules for VPX Low-Power Modules Flexible Current Handling • 15 A contacts • Five contacts per module Tried and True Technology • Based on TE Universal Power Module AEROSPACE, DEFENSE & MARINE /// EMBEDDED COMPUTING PAGE 16 Embedded Computing RF Modules Rugged Performance • Superior RF performance to 40 GHz • Float-mounted contacts ensure mated contacts bottom, for excellent isolation and low VSWR Tried and True Technology • Based on TE’s VITA 67 modules for VPX • SMPM contacts • Five position modules Optical Modules Tried and True Technology • MT ferrule inserts • Up to 24 fibers (12 per ribbon) • Based on VITA 66 Filler Modules • Protects unused bays from dust or contamination • Snaps into place on daughtercard shell Guide Hardware Precision Machined • Tightly toleranced to minimize micromotion between boards • Lightweight aluminum Flexible Keying • 8 key orientations per pin • 64 key combinations per assembly • ESD springs in daughtercard shell’s guide sockets AEROSPACE, DEFENSE & MARINE /// EMBEDDED COMPUTING PAGE 17 Embedded Computing Application Daughtercard Assembly Backplane Assembly PART NUMBERS Part No. Part Type Daughtercard Backplane 3 bay 2226783-1 2226784-1 4 bay 2226783-2 2226784-2 Connector Shells 9 bay 2226783-3 2226784-3 8 bay 2226783-4 2226784-4 Differential Pair 2102436-1 2102438-1 Single Ended 2102436-2 2102438-1 Low-Power Module 2102444-1 2102446-1 Modules High-Power Module 2102440-1 2102442-1 RF (SMPM) Module 2226511-1 2226512-1 Optical (MT) Module 2226790-1 2226789-1 Filler 2102449-1 — Guide Socket, Keyed 2102503-2 — Guide Socket, Non-Keyed 2102503-4 — Screw, Guide Module, Phillips Head 208021-1 — Guide Hardware Screw, Guide Module, Torx 2226170-1 — Guide Pin, Keyed — 2102502-2 Guide Pin, Non-Keyed — 2102502-4 AEROSPACE, DEFENSE & MARINE /// EMBEDDED COMPUTING PAGE 18 Embedded Computing Complete Solutions for Embedded Computing Count on TE for complete end-to-end solutions to enable high-performance computing. Our I/O solutions give you one of the widest ranges of choices for helping to increase speeds speeds, going longer distances, and eliminating bandwidth bottlenecks. CeeLok FAS-T Connectors CeeLok FAS-X Connectors • Small, field terminable, • One of the highest speed I/O 10 Gigabit Ethernet, connectors available rugged I/O connector • Single-channel size 11 or • Compact size 8 shell saves four-channel size 25 weight and space 38999 shells or ARINC 809 • Ruggedized for excellent • Fast, easy assembly shock, vibration, temperature, • Composite or metal shell and sealing performance, with • Lanyard-release option integral backshell that provides low cost, low-weight strain relief, and EMI protection DEUTSCH Wildcat Rack and Panel Connectors Connectors • Full range of sizes and • I/O for LRUs and LRMs configurations, with wide • Blindmate, rugged, choice of materials and finishes high pin count • 38999 and micro sizes • Signal, Quadrax, RF, • Close to double density power, and optical compared to standard 38999 (ARINC 801 and mini expanded beam) RF Connectors High-Speed Cable • I/O for LRUs and LRMs • Gigabit/10G Ethernet • Blindmate, rugged, • Fibre Channel high pin count • DVI/HDMI • Signal, Quadrax, RF, power, • IEEE 1394 and optical • USB 3.0 (ARINC 801 and mini • CANbus expanded beam) Optical Connectors Harnessing Components • Expanded beam, ceramic • Families matched to ferrule, and MT termini application extremes • Single mode and multimode • Heat-shrink tubing for any reach • Molded parts • Compatibility with an • Adhesives extensive line of standard and • Backshells optics-only connectors • Identification • Solder sleeves and termination devices AEROSPACE, DEFENSE & MARINE /// EMBEDDED COMPUTING PAGE 19 LET’S CONNECT We make it easy to connect with our experts and are ready to provide all the support you need. Just call your local support number or visit www.te.com/industrial to chat with a Product Information Specialist. Technical Support te.com/support-center North America +1 800 522 6752 Asia Pacific +86 400 820 6015 North America (Toll) +1 717 986 7777 Japan +81 044 844 8180 EMEA/South Africa +800 0440 5100 Australia +61 2 9554 2695 EMEA (Toll) +31 73 624 6999 New Zealand +64 (0) 9 634 4580 India (Toll-Free) +800 440 5100 Rugged High-Speed Solutions That Save Weight and Space te.com/embeddedcomputing AMP, AGASTAT, CeeLok FAS-T, CeeLok FAS-X, CII, DEUTSCH, Fortis Zd, HARTMAN, KILOVAC, LL ROWE, Mezalok, MICRODOT, MULTI-BEAM XLE, MULTIGIG RT, NANONICS, POLAMCO, Raychem, SEACON, TE, TE Connectivity and the TE connectivity (logo) are trademarks of the TE Connectivity Corporation. Other products, logos, and company names mentioned herein may be trademarks of their respective owners. While TE has made every reasonable effort to ensure the accuracy of the information herein, nothing herein constitutes any guarantee that such information is error-free, or any other representation, warranty or guarantee that the information is accurate, correct, reliable or current. The TE entity issuing this publication reserves the right to make any adjustments to the information contained herein at any time without notice. All implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability or fitness for a particular purpose are expressly disclaimed. The dimensions herein are for reference purposes only and are subject to change without notice. Specifications are subject to change without notice. Consult TE for the latest dimensions and design specifications. © 2017 TE Connectivity Corporation All Rights Reserved. 4-1773700-7  06/17    AEROSPACE, DEFENSE & MARINE /// EMBEDDED COMPUTING