TE CONNECTIVITY 216842-4

Section Catalog 1654370-1 Issued 4-2010. Press-In Connections Main Catalog 1654400-1 ACTION PIN and Multispring Contacts Chapter 31 – Issued 4-2010. Introduction For many years Compliant ACTION PIN Contacts have proven their Reliability in the Automotive Industry Multispring II ACTION PIN Multispring Solderless interconnections  Faulty soldered joint must be fixed on the solder Features of the Compliant have been popular in electrical side of the PCB and/or com- ACTION PIN and  Solder fumes (contacts and electronic applications ponent side. In those cases, Multispring Contacts become contaminated) with worldwide success for the holes for the compliant  Solder spots (short circuits  Large gas-tight contact zone decades. They provide reliable connectors are covered during between printed circuits)  High reliability due to stored electrical and mechanical the solder process and press-  Flux residues energy stability and offer cost savings in is done after soldering. across the board.  Thermal strain on PCBs and  Minimum damage to Other applications for press-in components plated-through holes during Solderless electrical inter- interconnections include PCBs application connections have become  Degasing of plated-through that incorporate components increasingly important for holes. using surface mounting  Especially suited for multi- printed circuit board applica- technology (SMT). Here, too, layer PCBs Since its introduction in the tions. The TE Connectivity press-in interconnections can  More economic board early 1970’s, the compliant compliant ACTION PIN and be applied after soldering, manufacturing due to larger ACTION PIN contact has Multispring contacts provide eliminating complications hole tolerances compared achieved wide success. Billions reliable electro-mechanical caused by connectors suitable to the use of a solid pin of contacts have successfully connection to plated-through for surface mounting.  Application can be made proven their reliability in electro- pc board holes. Implementing lead-free by the end-user nic and electrical applications. Since TE Connectivity com- technology according environ-  High-end TE Connectivity For many years compliant pin pliant contacts do not have mental directives, all Tyco application tooling available to be soldered, the following contacts have been extensively Electronics compliant press-in used in the automotive industry. problems associated with connectors feature lead-free solder are eliminated: plating finishes. Solderless press-in intercon- nections are used in racks, ACTION PIN and Multispring especially where connectors are trademarks. All specifications subject to change. Consult TE Connectivity for latest specifications. 31-1 Section Catalog 1654370-1 Issued 4-2010. Press-In Connections Main Catalog 1654400-1 ACTION PIN and Multispring Contacts Chapter 31 – Issued 4-2010. Introduction (continued) Figure 1: Cross section of ACTION PIN contact press-in area in pc board holes with minimum and maximum hole diameter. Principle of the Compliant ACTION PIN Contact When a compliant ACTION PIN The compliant pin also reduces contact is inserted into a plated- strain on the board. With a rigid through hole, two spring pin, the elastic strain energy is members are compressed, stored entirely in the board. This exerting force against the hole will lead to damage of plated- for a gas-tight connection. The through holes. diameter of the hole is smaller The compliant ACTION PIN than the diagonal size of the pin contact produces a tight contact (fig. 1). zone between the pin and the The beam characteristics of the plated-through hole and guaran- pin are designed so that a plastic tees long-term reliable electrical as well as an elastic deformation interconnection and mechanical will take place during insertion. reliability. The residual force of The two spring members are the elastic deformation maintains compressed at different degrees stored energy, insuring long-term to accomodate hole tolerances. reliability of compliant ACTION PIN contact press-in connections. PC Board Thickness Each compliant pin contact connector type is designed for a certain minimum pc board thickness. Generally, types suit- able for pc board thickness of 1.5/1.6 mm can also be used for thicker pc boards. A tolerance of 10 % applies to the normal thickness. For information concerning other printed circuit board thicknesses contact your local TE Connectivity representative. 31-2 All specifications subject to change. Consult TE Connectivity for latest specifications. Section Catalog 1654370-1 Issued 4-2010. Press-In Connections Main Catalog 1654400-1 ACTION PIN and Multispring Contacts Chapter 31 – Issued 4-2010. Introduction (continued) Specifications of Plated-Through Holes Besides the final diameter, the entire hole design – hole dia- 1 Pad meter, copper and tin thickness – is important. 2 Drilled Hole 3 Plated-Through Hole PC Board Requirements for 4 Copper Thickness Solderless ACTION PIN Contact 5 Tin Thickness Press-In Connections Type: Glass-epoxy (NEMA grade G 10, G 11, FR 4, FR 5 cor- responding to DIN 7735 Hgw-Types or DIN 40802 EP-Types). Hole Position Tolerance: ±0.05 mm not cumulative Structure of Plated-Through Hole Nominal PCB Hole Diameter, 0.6 mm 0.9 mm 1.0 mm 1.35 mm 1.45 mm 1.6 mm Plated Drilled Hole Diameter (mm) 0.7 ±0.025 1.0 ±0.025 1.15 ±0.025 1.5 ±0.025 1.6 ±0.025 1.75 ±0.025 Copper Layer (μm) 25–50 25–75 Tin Layer (μm) 4–10 4–15 Diameter, Galvanized (mm) 0.55–0.65 0.85–0.95 0.94–1.09 1.29–1.44 1.39–1.54 1.54–1.69 For information concerning other printed circuit board plating types contact your local TE Connectivity representative. Gas-Tight Connection An electrical connection should have a long-term low electrical resistance which is not effected by environmental conditions. This feature is described as gas-tight. Press-in methods using compliant ACTION PIN and Multispring contacts with corresponding pc board holes are gas-tight. In figure 2, the area can be seen, where the compliant ACTION PIN contact the plated-through hole, protecting against industry atmosphere. Figure 2: The polished section of a plated-through hole shows a clean contact area. The remaining plated-through area has visibly changed due to industry atmosphere. Replaceable Contacts In general, press-in connections cannot be re-used. Retention Force ACTION PIN and Multispring are Consequently, different finishes Using a new compliant ACTION generally designed in accordance need to be evaluated separately. Press-in pins are designed to PIN contact as a replacement, with the IEC 60352-5 specifica- take on additional functions ACTION PIN and Multispring a pc board hole can be used tion. TE Connectivity press-fit besides contacting the pc board. compliant pin contacts feature again. Compliant ACTION PIN solutions have been designed for They can also be used for wire typical retention force values of contacts are individually replace- the use with HAL Sn finishes. wrapping and/or with connectors. 30 N minimum. able by use of a simple tool. Therefore, press-in pins must Alternative lead-free PCB plating Damaged pins can be removed take additional stresses without finishes can have significant and replaced several times damaging the press-in connec- effect on the mechanical perform- without sacrificing mechanical tion. ance of a press-fit system. or electrical performance. All specifications subject to change. Consult TE Connectivity for latest specifications. 31-3 Section Catalog 1654370-1 Issued 4-2010. Press-In Connections Main Catalog 1654400-1 ACTION PIN Contacts Chapter 31 – Issued 4-2010. AMPMODU II Pins Technical Features 0.64 2.54 Product Specification: Contact Pin 0.64 IEC 60352-5 Area Application Specification: 114-25011 B A C ACTION PIN Area PCB 1.6 nom. Cut Off Single Pin Part Numbers Dimensions Nominal (mm) PCB Hole Material Finish Strip Package Loose- Package Diameter,
Form Quantity Piece Quantity Plated AB C 5.20 4.00 8.40 1) 1-928776-9 1-928836-9 1) 2-928776-5 2-928836-5 6.80 5.60 10.00 3) 1-928776-5 1-928836-5 7.45 6.25 10.65 3) 2-928776-0 2-928836-0 1) 2-928776-2 2-928836-2 8.25 7.05 11.45 3) 1-928776-2 1-928836-2 9.50 8.30 12.70 1) 1-928776-8 1-928836-8 1) 3-928776-4 3-928836-4 10.00 8.80 13.20 0.9 CuSn 4 3) 1-928776-4 50,000 1-928836-4 1,000 1) 2-928776-3 2-928836-3 12.00 10.80 15.20 3) 1-928776-3 1-928836-3 1) 1-928776-6 1-928836-6 13.60 12.40 16.80 3) 2-928776-6 2-928836-6 1) 2-928776-7 2-928836-7 18.00 16.80 21.20 3) 1-928776-7 1-928836-7 1) 2-928776-1 2-928836-1 21.30 20.10 24.50 3) 1-928776-1 1-928836-1 3.60 2.40 6.80 0.9 CuSn 4 1) 0-964056-2 50,000 –– 8.25 8.05 11.45 0.9 CuSn 4 2) 0-737604-2 50,000 –– 1) 1-215345-4 9.70 6.70 13.60 3) 0-215345-2 1 1..0 0 C Cu uS Sn n 4 4 4) 0-215345-3 50,000 –– 1) 1-215345-3 13.10 10.10 17.00 4) 0-215345-5 Finish:
) Structure of finished plated-through 1) Tin over nickel plated hole see table page 31-3. 2) Contact pin area selective 0.2 μm gold over nickel plated, ACTION PIN area selective tin over nickel plated 3) Contact pin area selective 0.8 μm gold over nickel plated, ACTION PIN area selective tin over nickel plated Other post lenghts, materials and 4) Contact pin area selective 1.3 μm gold over nickel plated, ACTION PIN area selective tin over nickel plated finishes on request. 31-4 All specifications subject to change. Consult TE Connectivity for latest specifications. Section Catalog 1654370-1 Issued 4-2010. Press-In Connections Main Catalog 1654400-1 ACTION PIN Contacts Chapter 31 – Issued 4-2010. ) MQS Pins (0.63 x 0.63 –0.03 –0.03 2.54 0.63 0.63 Contact Pin Area B A C ACTION PIN Area PCB 1.6 nom. Cut Off Single Pin Part Number Dimensions Nominal (mm) PCB Hole Product Application Material Finish Strip Package Diameter, Specification Specification
Form Quantity Plated AB C 1) 2-929958-1 8.25 7.05 11.45 2) 1-929958-1 0.9 CuSn 4 50,000 –– 1) 2-929958-2 10.00 8.80 13.20 2) 1-929958-2 1) 2-963964-3 8.25 7.05 11.65 2) 1-963964-3 9.40 8.20 12.80 1) 2-963964-8 1) 2-963964-4 10.00 8.80 13.40 1.0 CuNiSi 50,000 108-18643 114-18279 2) 1-963964-4 1) 2-963964-7 11.30 10.10 14.70 2) 3-963964-7 21.50 20.30 24.90 1) 7-963964-9



10.60 9.30 13.90 1.0 CuNiSi 1) 1-929278-2 – 108-18643 114-18279 ±0.05 ±0.05 ) TH .025 Pins (0.64 x 0.64 Part Number Dimensions Nominal (mm) PCB Hole Product Application Material Finish Strip Package Diameter, Specification Specification
Form Quantity Plated AB C

9.4 8.2 12.8 1.0 CuNiSi 1) 1801209-1 –––

Finish: ) Structure of finished plated-through hole see table page 31-3.

1) Tin over nickel plated ) Customer restricted 2) Contact pin area selective 0.8 μm gold over nickel plated, ACTION PIN area selective tin over nickel plated. Other post lenghts, materials and finishes on request. All specifications subject to change. Consult TE Connectivity for latest specifications. 31-5 Section Catalog 1654370-1 Issued 4-2010. Press-In Connections Main Catalog 1654400-1 ACTION PIN Contacts Chapter 31 – Issued 4-2010. Tab with 1 ACTION PIN Area Width Thickness Contact Tab Area B A C ACTION PIN Area PCB 1.6 nom. Cut Off Single Tab Part Numbers Tab Dimensions Nominal (mm) PCB Hole Product Application Material Finish Strip Package Width x Diameter, Specification Specification
Form Quantity Thickness Plated AB C 1.20 x 0.60 13.60 12.20 17.00 1.00 CuSn 1) 0-1743447-2 – 108-61069 114-61008



1.50 x 0.60 13.55 10.30 16.90 1.00 CuNiSi 1) 0-1394353-2 50,000 ––



1.00 x 0.64 13.80 12.60 17.20 1.00 CuSn 1) 0-0368405-2 – 108-61087 114-61013 2.30 x 0.64 18.20 16.30 21.65 1.00 CuSn 1) 1-1452691-2 20,000 –– 10.20 8.50 14.10 1) 1-1452692-2 25,000 11.30 9.60 15.20 1.35 CuSn 1) 1-1563229-2 25,000 1.50 x 0.80 1.35 CuSn 108-18867 114-18570



1) 1-1670386-2 25,000 12.40 10.70 16.30



2) 1-1670386-4 25,000 1.60 1.00 x 1.00 22.00 20.00 29.00 CuSn 1) 0-0100349-2 50,000 –– pcb thickness 2.4

Finish: ) Structure of finished plated-through hole see table page 31-3.

1) Tin over nickel plated ) Customer restricted 2) Contact tab area selective silver over nickel plated, ACTION PIN area selective tin over nickel plated. Other post lenghts, materials and finishes on request. 31-6 All specifications subject to change. Consult TE Connectivity for latest specifications. Section Catalog 1654370-1 Issued 4-2010. Press-In Connections Main Catalog 1654400-1 Multispring Contacts Chapter 31 – Issued 4-2010. Tab with 1 Multispring Area Width Thickness Contact Tab Area B A C Multispring Area PCB 1.6 nom. Cut Off Single Tab Part Numbers Tab Dimensions Nominal (mm) PCB Hole Product Application Material Finish Strip Package Width x Diameter, Specification Specification
Form Quantity Thickness Plated AB C



1.70 x 0.64 12.40 10.80 16.40 1.00 CuSn 1) 0-1801059-1 –––

Finish: ) Structure of finished plated-through hole see table page 31-3.

1) Tin over nickel plated ) Customer restricted Other post lenghts, materials and finishes on request. All specifications subject to change. Consult TE Connectivity for latest specifications. 31-7 Section Catalog 1654370-1 Issued 4-2010. Press-In Connections Main Catalog 1654400-1 ACTION PIN Contacts Chapter 31 – Issued 4-2010. Tab with 2 ACTION PIN Areas Width Contact Tab Area Thickness B A C ACTION PIN PCB Area 1.6 nom. Cut Off D Single Tab Part Numbers Tab Dimensions Nominal (mm) PCB Hole Product Application Material Finish Strip Package Width x Diameter, Specification Specification
Form Quantity Thickness Plated AB C D 1.5 x 0.6 10.50 9.00 13.80 2.00 1.00 CuSn 1) 1-1823233-2 – 108-18706 114-18379 2.8 x 0.6 10.00 7.90 13.40 2.54 1.00 CuNiSi 1) 1-1452568-1 –––



2.4 x 0.8 12.40 10.40 15.90 3.10 1.35 CuSn 1) 0- 969174-2 20,000 –– 8.00 6.00 11.50 3.10 1.35 1) 0- 969053-2 20,000 –– 8.50 6.00 12.00 2.54 1.35 1) 0- 352604-2 – 1) 1-1452688-2 11.30 9.40 14.90 2.50 1.35 2) 3-1452688-1 20,000 108-18644 114-18280 3) 2-1452688-1



11.30 9.40 14.90 2.50 1.35 1) 1-0929277-2 20,000 108-18644 114-18280 CuSn 1) 0- 338429-2 12,500 2.8 x 0.8 2) 0- 338429-3 12,500 13.50 10.75 18.50 2.54 1.45 –– 1) 0-1483313-2 12,500 2) 0-1483313-3 12,500



13.50 11.60 17.70 2.54 1.45 1) 1-1670123-2 13.80 11.80 17.80 3.10 1.35 1) 0- 969054-2 20,000 16.40 13.65 21.40 2.54 1.45 1) 0-1377181-2 – 4.8 x 0.8 13.70 10.95 18.70 2.54 1.45 CuSn 1) 0-1345034-2 11,000 ––

Finish: ) Structure of finished plated-through hole see table page 31-3.

1) Tin over nickel plated ) Customer restricted 2) Contact tab area selective silver over nickel plated, ACTION PIN area selective tin over nickel plated. Other post lenghts, materials and finishes on request. 3) Contact tab area selective 0.8 μm gold over nickel plated, ACTION PIN area selective tin over nickel plated. 31-8 All specifications subject to change. Consult TE Connectivity for latest specifications. Section Catalog 1654370-1 Issued 4-2010. Press-In Connections Main Catalog 1654400-1 ACTION PIN Contacts Chapter 31 – Issued 4-2010. Tab with 3 ACTION PIN Areas Contact Tab Area Thickness Width Hole for Positive Lock Receptacle B A C ACTION PIN Area PCB 1.6 nom. Cut Off D D Single Tab Part Numbers Tab Dimensions Nominal Product Application (mm) PCB Hole Hole Material Finish Specifi- Specifi- Strip Package Loose- Width x Diameter, cation cation
Form Quantity Piece Thickness Plated AB C D



12.20 10.10 15.40 2.54 1.35 – CuSn 1) 1-0929451-2 20,000 1564228-2 108-18707 114-18380 4.8 x 0.8 14.40 12.30 17.60 2.54 1.35 – CuSn 1) 1-1452719-2 20,000 – 108-18707 114-18380 13.50 10.75 18.50 2.54 1.45 X CuSn 1) 0-0216842-2 12,500 –– – 6.3 x 0.8 13.50 10.75 18.50 2.54 1.45 X CuSn 2) 0-0216842-4 12,500 –– –



19.85 16.05 23.85 2.54 1.45 X CuSn 1) 1-1740723-2 12,500 –– –

Finish: ) Structure of finished plated-through hole see table page 31-3.

1) Tin over nickel plated ) Customer restricted 2) Contact tab area selective silver over nickel plated, ACTION PIN area selective tin over nickel plated. Other post lenghts, materials and finishes on request. All specifications subject to change. Consult TE Connectivity for latest specifications. 31-9 Section Catalog 1654370-1 Issued 4-2010. Press-In Connections Main Catalog 1654400-1 ACTION PIN Contacts Chapter 31 – Issued 4-2010. Tab with 4 ACTION PIN Areas Width Contact Thickness Tab Area Hole for Positive Lock Receptacle B A C ACTION PIN Area PCB 1.6 nom. Cut Off D D Single Tab D Part Numbers Tab Dimensions Nominal Product Application (mm) PCB Hole Hole Material Finish Specifi- Specifi- Strip Package Width x Diameter, cation cation
Form Quantity Thickness Plated AB C D 4.8 x 0.8 28.2 25.45 33.2 2.54 1.45 X CuSn 1) 338099-2 –– –
Finish: ) Structure of finished plated-through hole see table page 31-3. 1) Tin over nickel plated Other post lenghts, materials and finishes on request. 31-10 All specifications subject to change. Consult TE Connectivity for latest specifications. Section Catalog 1654370-1 Issued 4-2010. Press-In Connections Main Catalog 1654400-1 ACTION PIN Contacts Chapter 31 – Issued 4-2010. ACTION PIN – PCB EDGE Contact Technical Features 3.5 max. Contact Material: 0.4 1.0 CuSn Contact Finish: tin over nickel plated 8.7 3.1 PCB 1.6 nom. 3.0 ACTION PIN Area 5.0 PCB EDGE Contact Part Numbers Nominal PCB Hole Diameter, Strip Package Loose- Package Applicator Hand Tool Plated Form Quantity Piece Quantity 0.6 969015-2 50,000 –––– All specifications subject to change. Consult TE Connectivity for latest specifications. 31-11 Section Catalog 1654370-1 Issued 4-2010. Press-In Connections Main Catalog 1654400-1 ACTION PIN Contacts Chapter 31 – Issued 4-2010. ACTION PIN Contact – Wire Connection Technical Features Contact Material: 6.45 CuNiSi 0.64 A Contact Finish: tin over nickel plated Product Specification: 108-18298 B Application: for Capacitor ACTION PIN Area Wire Connection Part Numbers For Wire Dimen- Nominal Diameter sion PCB Hole Strip Package Loose- Package A B Diameter, Applicator Hand Tool Form Quantity Piece Quantity (mm) (mm) Plated 0.8 1-968964-2 20,000 19.8 1.0 ––– – 1.0 2-968964-2 20,000 0.8 2-1670195-2 20,000 22.2 1.0 ––– – 1.0 1-1670195-2 20,000 Finish: Tin over nickel plated 31-12 All specifications subject to change. Consult TE Connectivity for latest specifications. Section Catalog 1654370-1 Issued 4-2010. Press-In Connections Main Catalog 1654400-1 ACTION PIN Contacts Chapter 31 – Issued 4-2010. ACTION PIN Contact – Foil-PC Board – Multiple Crimp Technical Features Contact Material: CuNiSi Contact Finish: tin over nickel plated Contact Resistance (New State): CuNiSi:
3 m Total Temperature max.: –40 °C to +120 °C (tin plated) ACTION PIN Area Product Specification: 108-18587-2 1.8 Application Specification: 114-18210-2 14.2 Multiple Crimp Part Numbers Nominal PCB Hole Diameter, Strip Package Loose- Package Applicator Hand Tool Plated Form Quantity Piece Quantity 224910 1.0 1670255-2 ––– 90273-5 318619 All specifications subject to change. Consult TE Connectivity for latest specifications. 31-13 Section Catalog 1654370-1 Issued 4-2010. Press-In Connections Main Catalog 1654400-1 Chapter 31 – Issued 4-2010. Engineering Notes 31-14 All specifications subject to change. Consult TE Connectivity for latest specifications.