Electronics Finder

Description

ESD Suppressor Diode Arrays Automotive 5-Pin DFN T/R

Part Number

RF2197-000

Price

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Manufacturer

TE CONNECTIVITY

Lead Time

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Category

Circuit Protection » ESD Suppressors

Specifications

Manufacturer

TE Connectivity

Manufacturers Part #

RF2197-000

Industry Aliases

SESD0802Q4UG-0020-090

Sub-Category

ESD Suppressors

Brand

Raychem Wire and Tubing

Packaging

Tape and Reel

Factory Pack Quantity

5000

Datasheet

littelfuse_tvs_diode_array_sesd_ultra_low_capacitance_diode_arrays_datasheet.pdf.pdf

1393 KiB

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Extracted Text

® TVS Diode Arrays (SPA Diodes) SESD Series Ultra Low Capacitance Diode Arrays RoHS Pb GREEN ELV SESD Series Ultra Low Capacitance Diode Arrays Description The SESD series Ultra Low Capacitance Diode Arrays provides signal integrity-preserving unidirectional ESD protection for the world’s most challenging high speed serial interfaces. Compelling packaging options including the standard 2.5mmx1.0mm layout, the SOD883, and board space-friendly 0802 and 1103 DFN minimize trace layout complexity, and save significant PCB space. This series is rated in excess of 20kV contact ESD protection (IEC61000-4-2) while maintaining extremely low leakage and dynamic resistance, and is offered in the industry’s most progressive and soon to be popular footprints. The SESD series sets higher standards for signal integrity and usability. Pinout 0402 DFN array 0802 DFN array Features 12 4 3 • 0.20pF TYP capacitance • Facilitates excellent signal integrity • ESD, IEC61000-4-2, • AEC-Q101 qualified (1004) ±20kV contact, ±20kV air • Moisture Sensitivity • Low clamping voltage 2 1 G Level(MSL-1) 3 of 9.2V @ I =2.0A PP (t =8/20μs) • ELV Compliant P 1004 DFN array • Low profile DFN array • RoHS Compliant and ACE-Q101 qualified) 1103 DFN array packages Lead Free 1 2 3.G 4 5 G 3 2 1 Applications 4 5 6 • USB 3.1, 3.0, 2.0 • Tablet PC and external 10 9 8.G 7 6 storage with high speed • HDMI 2.0, 1.4a, 1.3 interfaces (TM) • DisplayPort Bottom View • Applications requiring ®) • V-by-One high ESD performance in • Thunderbolt small packages Functional Block Diagram • LVDS interfaces • Consumer, mobile and 1 2 4 5 1 2 portable electronics Additional Information 3 G, 3, 8 Samples Datasheet Resources 0802/1004 DFN array 0402 DFN array 1 2 3 4 5 6 G 1103 DFN array © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/17/18 ® TVS Diode Arrays (SPA Diodes) SESD Series Ultra Low Capacitance Diode Arrays Absolute Maximum Ratings Symbol Parameter Value Units I Peak Current (t =8/20μs) 2.0 A PP p T Operating Temperature -55 to 125 °C OP T Storage Temperature -55 to 150 °C STOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics - (T =25°C) OP Parameter Test Conditions Min Typ Max Units Input Capacitance @ V = 0V, f = 3GHz 0.20 0.22 pF R Breakdown Voltage V @ I =1mA 9.00 V BR T Reverse Working Voltage 7.0 V Reverse Leakage Current I @ V =5.0V 25 50 nA L RWM Clamping Voltage V @ I =2.0A 9.20 V CL PP Peak Pulse Current t =8/20μs 2.0 A P IEC61000-4-2 (Contact) ±20 ESD Withstand Voltage kV IEC61000-4-2 (Air) ±20 Insertion Loss Diagram - 1103 DFN Array Insertion Loss Diagram 0 0 -5.0 -5.0 -10.0 -10.0 -15.0 -15.0 -20.0 -20.0 -25.0 -25.0 -30.0 -30.0 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 Frequency (Hz) Frequency (Hz) © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/17/18 S21 Insertion Loss (dB) S21 Insertion Loss (dB) ® TVS Diode Arrays (SPA Diodes) SESD Series Ultra Low Capacitance Diode Arrays Device IV Curve 1.0 0.8 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 -0.8 -1.0 -2 -1 01 2 34 56 78 910 Voltage (V) USB3.0 Eye Diagram 5.0 Gb/s, 1000mV differential, CPO Compliant Test Pattern Without SESD Device With SESD Device Soldering Parameters Reflow Condition Pb – Free assembly t P T P Critical Zone Critical Zone - Temperature Min (T ) 150°C s(min) T TL L to to T TP P Ramp-u Ramp-up p Pre Heat - Temperature Max (T ) 200°C s(max) T L t L - Time (min to max) (t ) 60 – 180 secs T s S(max) Ramp-dow Ramp-do n Average ramp up rate (Liquidus) Temp (T ) L 3°C/second max Preheat Preheat to peak T S(min) T to T - Ramp-up Rate 3°C/second max t S S(max) L - Temperature (T ) (Liquidus) 217°C L Reflow 25 - Temperature (t ) 60 – 150 seconds time to peak temperature L Time +0/-5 Peak Temperature (T ) 260 °C P Time within 5°C of actual peak 20 – 40 seconds Temperature (t ) p Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (T ) 8 minutes Max. P Do not exceed 260°C © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/17/18 Current (mA) Temperature ® TVS Diode Arrays (SPA Diodes) SESD Series Ultra Low Capacitance Diode Arrays Package Dimensions — 0402 DFN Array Millimeters Inches Symbol Min Typ Max Min Typ Max A 0.33 0.38 0.43 0.013 0.015 0.017 A1 0 - 0.05 0 - 0.002 A3 0.13 ref. 0.005 ref. D 0.55 0.60 0.65 0.022 0.024 0.026 E 0.95 1.00 1.05 0.037 0.039 0.041 K 0.35 0.40 0.45 0.014 0.016 0.018 L1 0.45 0.50 0.55 0.018 0.020 0.022 L2 0.20 0.25 0.30 0.008 0.010 0.012 b 0.10 0.15 0.20 0.004 0.006 0.008 e1 0.35 BSC 0.014 BSC e2 0.65 BSC 0.026 BSC Symbol Millimeters Inches A 0.60 0.024 B 1.00 0.039 C 0.23 0.009 D 0.35 0.014 D1 0.35 0.014 E 0.15 0.006 F 0.30 0.012 Pad Layout Embossed Carrier Tape & Reel Specification — 0402 DFN Array D 0 P2 P 0 T Y Symbol Millimeters E1 A0 0.70+/-0.05 D 1 B0 1.15+/-0.05 D0 ø 1.55 + 0.05 F W D1 ø 0.40 +/- 0.05 B0 E1 1.75+/-0.10 F 3.50+/-0.05 K0 K0 0.47+/-0.05 A0 P1 P0 4.00+/-0.10 Section Y - Y Y P1 2.00+/-0.05 User Feeding Direction P2 2.00+/-0.05 W 8.00 +/-0.10 T 0.20+/-0.05 Pin 1 Location © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/17/18 ® TVS Diode Arrays (SPA Diodes) SESD Series Ultra Low Capacitance Diode Arrays Package Dimensions — 0802 DFN Array Millimeters Inches Symbol Min Typ Max Min Typ Max A 0.33 0.38 0.43 0.013 0.015 0.017 A1 0 0.02 0.05 0 -- 0.002 A3 0.127 ref 0.005 ref. D 0.50 0.60 0.70 0.020 0.024 0.028 E 1.90 2.00 2.10 0.075 0.079 0.083 b 0.15 0.20 0.25 0.006 0.008 0.010 b1 0.25 0.30 0.36 0.010 0.012 0.014 L 0.25 0.30 0.36 0.010 0.012 0.014 L1 0.35 0.40 0.45 0.014 0.016 0.018 L2 0.05 BSC 0.002 BSC e 0.40 BSC 0.016 BSC e1 0.45 BSC 0.018 BSC e2 0.25 BSC 0.010 BSC N 4 4 Symbol Millimeters Inches A 0.60 0.024 B 2.00 0.079 C 0.30 0.012 D 0.30 0.012 E 0.25 0.010 F 0.10 0.004 F1 0.15 0.006 G 0.40 BSC 0.016 BSC G1 0.45 BSC 0.018 BSC Pad Layout Embossed Carrier Tape & Reel Specification — 0802 DFN Array D0 2 P P0 T Symbol Millimeters Y E 1 A0 0.81+/-0.05 D 1 B0 2.21+/-0.05 D0 ø 1.50+0.10/-0 F W B0 D1 ø 0.40 min E1 1.75+/-0.10 F 3.50+/-0.05 K0 K0 0.46+/-0.05 A 0 1 P Section Y - Y Y P0 4.00+/-0.10 P1 2.00+/-0.10 User Feeding Direction P2 2.00+/-0.05 W 8.00+0.30/-0.10 T 0.25+/-0.20 Pin 1 Location © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/17/18 ® TVS Diode Arrays (SPA Diodes) SESD Series Ultra Low Capacitance Diode Arrays A1 D LxN 8xb Package Dimensions — 1004 DFN Array A1 D Millimeters Inches LxN 8xb Symbol Min Typ Max Min Typ Max L1 2x A 0.33 0.38 0.43 0.013 0.015 0.017 R1 E b1 2x A1 0.00 0.02 0.05 0 -- 0.002 e1 L1 2x A3 0.127 ref. 0.005 ref. R1 E b1 2x e1 e 2xR D 0.90 1.00 1.10 0.035 0.039 0.043 E 2.40 2.50 2.60 0.094 0.098 0.102 e 2xR A3 b 0.15 0.20 0.25 0.006 0.008 0.010 Pin 1 ID A b1 0.35 0.40 0.45 0.014 0.016 0.018 Marking Location A3 Pin 1 ID A L 0.33 0.38 0.43 0.013 0.015 0.017 Marking Location SIDE VIEW 1 TOP VIEWB SIDE VIEW 2 OTTOM VIEW L1 0.00 0.10 0.15 0.000 0.004 0.006 (Front) SIDE VIEW 1 TOP VIEWB SIDE VIEW 2 OTTOM VIEW e 0.50 BSC 0.020 BSC (Front) e1 0.50 BSC 0.020 BSC R 0.08 BSC 0.003 BSC END VIEW 1END VIEW 2 R1 0.13 BSC 0.005 BSC END VIEW 1END VIEW 2 N 10 10 2x F A 2x F A 2x F 2x F A 2x F1 A 2x F1 Symbol Millimeters Inches 2x F1 2x F1 2x D1 2x D1 A 1.20 0.047 B 2.20 0.087 B B D1 B C 0.50 0.020 D1 B G1 4x G G1 4x G G1 4x G D 0.20 0.008 G1 4x G 4x G 4x G D1 0.40 0.016 8x D E 0.20 0.008 8x D 8x D E 8x D E F 0.30 0.012 E 8x C E 8x C F1 0.20 0.008 8x C Recommended 8x C Alternate G 0.50 BSC 0.020 BSC Recommended Alternate G1 1.00 BSC 0.039 BSC Pad Layout Pad Layout Embossed Carrier Tape & Reel Specification — 1004 DFN Array D0 2 P P0 T Y Symbol Millimeters E1 A0 1.20+/-0.05 D 1 B0 2.70+/-0.05 D0 ø 1.50+0.10/-0 F W B0 D1 ø 0.50 min E1 1.75+/-0.10 F 3.50+/-0.05 K0 A K0 0.51+/-0.10 0 1 P Section Y - Y Y P0 4.00+/-0.10 P1 4.00+/-0.10 P2 2.00+/-0.05 W 8.00+0.30/-0.10 T 0.25+/-0.05 © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/17/18 45 1 23 Gnd 45 1 23 Gnd N=10 9 Gnd 8 7 6 N=10 9 Gnd 8 7 6 ® TVS Diode Arrays (SPA Diodes) SESD Series Ultra Low Capacitance Diode Arrays Package Dimensions — 1103 DFN Array Millimeters Inches Symbol Min Typ Max Min Typ Max A 0.33 0.38 0.43 0.013 0.015 0.017 A1 0.00 0.02 0.05 0 -- 0.002 A3 0.127 ref. 0.005 ref. D 0.70 0.80 0.90 0.027 0.031 0.035 E 2.70 2.80 2.90 0.106 0.1 10 0.1 14 b 0.15 0.20 0.25 0.006 0.008 0.010 b1 0.25 0.30 0.35 0.010 0.012 0.014 L 0.30 0.35 0.40 0.012 0.014 0.016 L1 0.50 0.55 0.60 0.019 0.021 0.024 L2 0.05 BSC 0.002 BSC e 0.40 BSC 0.016 BSC e1 0.45 BSC 0.018 BSC e2 0.40 BSC 0.016 BSC N 6 6 4 Symbol Millimeters Inches A 0.80 0.031 B 2.80 0.110 C 0.35 0.014 D 0.30 0.012 E 0.45 0.018 F 0.10 0.004 Pad Layout F1 0.15 0.006 G 0.40 BSC 0.016 BSC G1 0.45 BSC 0.018 BSC Embossed Carrier Tape & Reel Specification — 1103 DFN Array Symbol Millimeters D 0 P2 P 0 T A0 1.00+/-0.05 Y E 1 B0 3.00+/-0.05 D D0 ø 1.50+0.10/-0 1 D1 ø 0.50 min F W B0 E1 1.75+/-0.10 F 3.50+/-0.05 K0 0.51+/-0.05 K0 P0 4.00+/-0.10 A 0 P1 Section Y - Y Y P1 4.00+/-0.10 P2 2.00+/-0.05 W 8.00+0.30/-0.10 T 0.25+/-0.05 © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/17/18 ® TVS Diode Arrays (SPA Diodes) SESD Series Ultra Low Capacitance Diode Arrays Part Numbering System Part Marking System – 090 SESD xxxx Q xUG 0020 Breakdown Voltage SESD product 090: 9.0V (TYP) C MC Package Input Capacitance 0402 0020: 0.20pF (TYP) 0802 1004 Common GND pin 0402 0802 1103 Directional U: Unidirectional DFN Array Package No of channel 4C 6C 2: Two Channels 4: Four Channels 6: Six Channels 1004 1103 Ordering Information Part Number Package Marking Ordering Part Number Minimum Order Quantity SESD0402Q2UG-0020-090 0402 DFN Array I C RF2946-000 50,000 SESD0802Q4UG-0020-090 0802 DFN Array I MC RF3076-000 25,000 SESD1004Q4UG-0020-090 1004 DFN Array I 4C RF3077-000 25,000 SESD1103Q6UG-0020-090 1103 DFN Array I 6C RF3078-000 25,000 © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/17/18

Frequently asked questions

Electronics Finder' parent company, GID Industrial, specializes in procuring industrial parts. We know where to find the rare and obsolete equipment that our customers need in order to get back to business. We stand apart from our competition through our commitment to quality, and look forward to the opportunity to show you how.

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What they say about us

FANTASTIC RESOURCE

One of our top priorities is maintaining our business with precision, and we are constantly looking for affiliates that can help us achieve our goal. With the aid of GID Industrial, our obsolete product management has never been more efficient. They have been a great resource to our company, and have quickly become a go-to supplier on our list!

Bucher Emhart Glass

EXCELLENT SERVICE

With our strict fundamentals and high expectations, we were surprised when we came across GID Industrial and their competitive pricing. When we approached them with our issue, they were incredibly confident in being able to provide us with a seamless solution at the best price for us. GID Industrial quickly understood our needs and provided us with excellent service, as well as fully tested product to ensure what we received would be the right fit for our company.

Fuji

HARD TO FIND A BETTER PROVIDER

Our company provides services to aid in the manufacture of technological products, such as semiconductors and flat panel displays, and often searching for distributors of obsolete product we require can waste time and money. Finding GID Industrial proved to be a great asset to our company, with cost effective solutions and superior knowledge on all of their materials, it’d be hard to find a better provider of obsolete or hard to find products.

Applied Materials

CONSISTENTLY DELIVERS QUALITY SOLUTIONS

Over the years, the equipment used in our company becomes discontinued, but they’re still of great use to us and our customers. Once these products are no longer available through the manufacturer, finding a reliable, quick supplier is a necessity, and luckily for us, GID Industrial has provided the most trustworthy, quality solutions to our obsolete component needs.

Nidec Vamco

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This company has been a terrific help to us (I work for Trican Well Service) in sourcing the Micron Ram Memory we needed for our Siemens computers. Great service! And great pricing! I know when the product is shipping and when it will arrive, all the way through the ordering process.

Trican Well Service

GO TO SOURCE

When I can't find an obsolete part, I first call GID and they'll come up with my parts every time. Great customer service and follow up as well. Scott emails me from time to time to touch base and see if we're having trouble finding something.....which is often with our 25 yr old equipment.

ConAgra Foods

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