 Precise active area location  Surface mountable  TTL compatible output  Wide supply voltage range  Wide operating temperature range Each OPR5011 device is a hybrid sensor array that consists of three channels of the OPTEK differential optical comparator (‘TRI-DOC”) IC. The single chip construction ensures very tight dimensional tolerances between active areas. Specifically designed for high-speed/high-resolution encoder applications, the open collector output switches based on the comparison of the input photodiode’s light current levels. Logarithmic amplification of the input signals facilitates operation over a wide range of light levels. The surface-mountable opaque polyimide package shields the photodiodes from stray light and can withstand multiple exposures to the most demanding soldering conditions, while the gold-plated wraparound contacts provide exceptional storage and wetting characteristics. See Application Bulletin 237 for handling instructions. Ordering Information Optical Optical  High-speed Part # of Icc (mA)Typ / Hysteresis (%) Offset (%) Packaging applications Number Sensor Elements Max Typical Min / Max  High-resolution Differential Optical OPR5011 3 9 / 20 40.00 -40/+40 Chip Tray applications Comparator  Applications Differential Optical requiring a wide OPR5011T 3 9 / 20 40.00 -40/+40 Tape & Reel Comparator range of light levels NOTE: SEE PAGE 2 FOR APPLICATION CIRCUIT. [MILLIMETERS] DIMENSIONS ARE IN: INCHES Warning: Front Win- dow is pressure sen- sitive. Do not apply pressure or high vacuum to window. Pin # Description Pin # Description Pin # Description Pin # Description 1 B - Output 5 N.C. 9 Z + Trim 13 B + Trim 2 B - Vcc 6 A - Output 10 Z -Trim 14 B -Trim 3 A + Trim 7 A - Vcc 11 Z - Output 4 A -Trim 8 Common 12 Z - Vcc RoHS Application Circuit - OPR5011 Notes: (1) The 74LS04 is recommended as a means of isolating the “DOC” comparator circuitry from transients induced by inductive and capacitive loads. (2) It is recommended that a decoupling capacitor be placed as close as possible to the device. Block Diagram - OPC8332 Storage and Operating Temperature -40° C to +100° C Supply Voltage 24 V Output Voltage 24 V Output Current 14 mA Power Dissipation 500 mW (1) Solder reflow time within 5°C of peak temperature is 20 to 40 seconds 250° C I Supply Current - 9 20 mA V = 24 V CC CC (2) V Low Level Output Voltage - 0.3 0.4 V I = 14 mA, V = 4.5 V OL OL CC (3) I High Level Output Current - 0.1 1 µA V = V = 20 V OH CC O (4)(7) OPT-HYS Optical Hysteresis - 40 - % V = 5 V, I = 1 mA CC OL (4)(7) OPT-OFF Optical Offset -40 10 +40 % V = 5 V, I = 1 mA CC OL (5) f Frequency Response - 1 - MHz max (6) t Output Rise Time - 1 - µs V = 5 V lh CC (6) t Output Fall Time - 300 - ns hl Notes: (1) Solder time less than 5 seconds at temperature extreme. (2) Pin (+) = 100.0 nW and Pin (-) = 1.0 µW . (3) Pin (+) = 1.0 µW and Pin (-) = 100.0 nW. (4) Pin (-) is held at 1.0 µW while Pin (+) is ramped from 0.5 µW to 1.5 µW and back to 0.5 µW. (5) Pin (+) is modulated from 1.0 µW to 2.0 µW. Pin (-) is modulated from 1.0 µW to 2.0 µW with phase shifted 180° with respect to Pin (+). Use 100 kΩ trimpot to set the output signal to 50% duty cycle for maximum operating frequency. (6) Measured between 10% and 90% points. (7) Optical Hysteresis and Optical Offset are found by placing 1.0 µW of light on the inverting photodiode and ramping the light intensity of the non-inverting input from 0.5 µW up to 1.5 µW and back down. This will produce two trigger points – an upper trigger point and lower trigger point. These points are used to calculate the optical hysteresis and offset. These are defined as: % Optical Hysteresis = 100 x (P rise - P fall) P in (-) % Optical Offset = 100 x (P average - P (-)) P in (-) Where: P in (-) = Light level incident upon the “-” photodiode on the IC chip (Pin) (-) = 1.0 µW). P rise = Value of light power level incident upon the “+” photodiode that his required to switch the digital output when the light level is an increasing level (rising edge). P fall = Value of light power level incident upon the “+” photodiode that is required to switch the digital output when the light level is decreasing level (falling edge). P average = (P rise + P fall) 2