WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 2 Surface Mount Heat Sinks D PAK, TO-220, SOT-223, SOL-20 217 SERIES Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a vari- ety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increas- ing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers' component thermal specifications. FEATURES AND BENEFITS: No interface material is needed Copper with matte tin plating for improved solderability and assembly Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats EIA standards and ESD protection are specified Can be used with water soluble or no clean SMT solder creams or other pastes Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Package Package Natural Forced P/N in. (mm) in. (mm) Format Quantity Convection Convection) 217-36CTE6 .360 (9.1) .600 (15.2) x .740 (18.8) Bulk 1 55°C @ 1W 16.0°C/W @ 200 LFM 217-36CTTE6 .360 (9.1) .600 (15.2) x .740 (18.8) Tube 20 55°C @ 1W 16.0°C/W @ 200 LFM 217-36CTRE6 .360 (9.1) .600 (15.2) x .740 (18.8) Tape & Reel 250 55°C @ 1W 16.0°C/W @ 200 LFM Material: Copper, Matte Tin Plated MECHANICAL DIMENSIONS 217 HEAT SINK WITH THERMAL PERFORMANCE DDPAK DEVICE 6 LAYER BOARD, D' PAK 125°C LEAD, 40°C AMBIENT 217-36CT6 Device Power Dissipation. W KEY: � Device only, NC � Device + HS, NC � Device + HS, 100 lfm � Device + HS, 200 lfm � Device + HS, 300 lfm SECTION A-A NOTES TAPE DETAILS 1. Material to be “ESD” 2. Approximately 6 Meters per Reel 3. 250 Pieces per Reel. 217-36CTR6 REEL DETAILS Dimensions: in. 22 Device Tab dT, C WTS001_p1-25 6/14/07 10:54 AM Page 23 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 2 Surface Mount Heat Sinks 217 SERIES D PAK, TO-220, SOL-20 MECHANICAL DIMENSIONS BOARD LAYOUT RECOMMENDATIONS 217 SERIES TUBE DETAILS TUBE: 16.25 Inches Long, Min. ESD Material with Nail Stops 20 Pieces per Tube 217-36CTT6 SOL 20 REF: JEDEC TO-263 (DD PAK) 217-36CT6 REF: JEDEC MO-169 (DD PAK) Dimensions: in. Surface Mount Heat Sink 218 SERIES SMT Devices Height Above Maximum Standard PC Board Footprint Thermal Performance at Typical Load P/N in. (mm) in. (mm) Natural Convection Forced Convection 218-40CTE3 .40 (10.2) .90 (22.9) x .315 (8.0) 62°C rise @ 2W 21°C/W @ 200LFM 218-40CTE5 .40 (10.2) 1.03 (26.2) x .50 (12.7) 62°C rise @ 2W 21°C/W @ 200LFM Material: Copper, Matte Tin Plated MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS AIR VELOCITY (LFM) 0 200 400 600 800 1000 100 25 80 20 60 15 40 10 20 5 0 0 0 200 400 600 800 1000 0.5 1.0 1.5 2.0 2.5 HEAT DISSIPATED (WATTS) Solid line = 218-40CT5 Dashed Line = 218-40CT3 218-40CT3 218-40CT5 23 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) THERMAL RESISTANCE SINK TO AMBIENT (C) WTS001_p1-25 6/14/07 10:54 AM Page 24 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Vertical Mount Heat Sink TO-220 206 SERIES Height Above Maximum Standard PC Board Footprint Thermal Performance at Typical Load P/N in. (mm) in. (mm) Natural Convection Forced Convection 206-1PABEH 1.18 (30.0) 1.00 (25.4) x .50 (12.7) 56°C rise @ 4W 7.3°C/W @ 200LFM Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS AIR VELOCITY (LFM) 0 200 400 600 800 1000 100 10 80 8 60 6 40 4 20 2 0 0 0 2 00 2 4 400 6 600 8 800 1 100 00 HEAT DISSIPATED (WATTS) Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks 230 & 234 SERIES TO-220 Height Above Footprint Solderable Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Tab Mounting Natural Forced P/N in. (mm) in. (mm) Configuation Option Style Convection Convection) 230-75AB .750 (19.1) .570 (14.5) x .500 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM 230-75ABE-01 .750 (19.1) .570 (14.5) x .500 (12.7) Vertical 01 Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM 230-75ABE-05 .500 (12.7) .750 (19.1) x .570 (14.5) Horizontal 05 Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM PATENT PENDING 230-75ABE-10 .875 (22.2) .570 (14.5) x .500 (12.7) Vertical 10 Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM 234-75AB .790 (20.0) .570 (14.5) x .500 (12.7) Vert./Horiz No Tab Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM 234-75ABE-01 .790 (20.0) .570 (14.5) x .500 (12.7) Vertical 01 Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM 234-75ABE-05 .500 (12.7) .790 (20.0) x .570 (14.5) Horizontal 05 Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM Material: Aluminum, Black Anodized 230-75AB-05 230-75AB-01 230-75AB-10 MECHANICAL DIMENSIONS 230 AND 234 SERIES 230 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS 234 SERIES 234 SERIES 234-75AB 234-75AB-01 234-75AB-05 Dimensions: in. (mm) 24 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) THERMAL RESISTANCE SINK TO AMBIENT (C) WTS001_p1-25 6/14/07 10:54 AM Page 25 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Horizontal Mount Heat Sink TO-220 241 SERIES Height Above Maximum Standard PC Board Footprint Thermal Performance at Typical Load P/N in. (mm) in. (mm) Natural Convection Forced Convection 241-69ABE-03 .39 (9.9) .86 (21.8) x .69 (17.5) 77°C rise @ 4W 12°C/W @ 200LFM Material: Aluminum, Black Anodized NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS AIR VELOCITY (LFM) 0200 400 600 800 1000 100 20 18 80 16 14 60 12 10 40 8 6 20 4 2 0 0 1 2 3 4 5 0200 400 600 800 1000 HEAT DISSIPATED (WATTS) Horizontal and Vertical Mount Heat Sink 262 SERIES TO-220 Height Above Maximum Standard PC Board Footprint Thermal Performance at Typical Load P/N in. (mm) in. (mm) Natural Convection Forced Convection 262-75ABE-05 .53 (13.4) .75 (19.1) x .50 (12.78) 80°C rise @ 2W 10°C/W @ 200LFM 262-75ABE-01 .75 (19.1) .53 (13.4) x .50 (12.7) 80°C rise @ 2W 10°C/W @ 200LFM Material: Aluminum, Black Anodized NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS AIR VELOCITY (LFM) 0200 400 600 800 1000 100 10 80 8 60 6 40 4 20 2 0 0 1 2 3 4 5 0200 400 600 800 1000 HEAT DISSIPATED (WATTS) 25 HEAT SINK TEMPERATURE RISE HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) ABOVE AMBIENT AIR (C) THERMAL RESISTANCE SINK TO THERMAL RESISTANCE SINK TO AMBIENT (C) AMBIENT (C) WTS001_p26-49 6/14/07 10:55 AM Page 26 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Self-Locking Wavesolderable Heat Sinks TO-220 233 & 236 SERIES Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection 233-60AB .600 (15.2) .570 (14.5) x .500 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 58°C @ 2W 11.0°C/W @ 400 LFM 233-60ABE-01 .600 (15.2) .570 (14.5) x .500 (12.7) Vertical 01 Clip/Mtg Hole 58°C @ 2W 11.0°C/W @ 400 LFM 233-60ABE-05 .500 (12.7) .600 (15.2) x .570 (14.5) Horizontal 05 Clip/Mtg Hole 58°C @ 2W 11.0°C/W @ 400 LFM 233-60ABE-10 .725 (18.4) .570 (14.5) x .500 (12.7) Vertical 10 Clip/Mtg Hole 58°C @ 2W 11.0°C/W @ 400 LFM PATENT PENDING 236-150AB 1.500 (38.1) .570 (14.5) x .500 (12.7) Vert./Horiz No Tab Clip/Mtg Hole 40°C @ 2W 4.80°C/W @ 400 LFM 236-150ABE-01 1.500 (38.1) .570 (14.5) x .500 (12.7) Vertical 01 Clip/Mtg Hole 40°C @ 2W 4.80°C/W @ 400 LFM 236-150ABE-05 .500 (12.7) 1.500 (38.1) x .570 (14.5) Horizontal 05 Clip/Mtg Hole 40°C @ 2W 4.80°C/W @ 400 LFM 236-150ABE-10 1.625 (41.3) .570 (14.5) x .570 (12.7) Vetrical 10 Clip/Mtg Hole 40°C @ 2W 4.80°C/W @ 400 LFM Material: Aluminum, Black Anodized NATURAL AND FORCED MECHANICAL DIMENSIONS CONVECTION CHARACTERISTICS 233 AND 236 SERIES 233-60AB-01 233-60AB-10 236-150AB-01 236-150AB-10 233-60AB-05 236-150AB-05 236-150AB Dimensions: in. (mm) 233-60AB Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks TO-220 275 & 231 SERIES Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection 275-75AB .750 (19.1) .835 (21.2) x .400 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 44 C @ 2W 7.9°C/W @ 400 LFM 275-75ABE-01 .750 (19.1) .835 (21.2) x .400 (12.7) Vertical 01 Clip/Mtg Hole 44°C @ 2W 7.9°C/W @ 400 LFM 275-75ABE-10 .875 (12.7) .835 (21.2) x .400 (14.5) Vertical 10 Clip/Mtg Hole 44°C @ 2W 7.9°C/W @ 400 LFM 231-69PAB .690 (18.4) .835 (21.2) x .400 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 45°C @ 2W 8°C/W @ 400 LFM PATENT 5381041 231-69PABE .400 (10.1) .690 (17.5) x .835 (12.7) Horizontal 13H Clip/Mtg Hole 45°C @ 2W 8°C/W @ 400 LFM 231-69PABE-XXX .690 (17.5) .835 (21.2) x .400 (12.7) Vertical 13V, 14V, 15V Clip/Mtg Hole 45°C @ 2W 8°C/W @ 400 LFM 231-75PAB .750 (19.1) .835 (21.2) x .400 (14.5) Vert./Horiz. No Tab Clip/Mtg Hole 43°C @ 2W 7.9°C/W @ 400 LFM 231-75PABE .400 (10.1) .750 (19.1) x .835 (12.7) Horizontal 13H Clip/Mtg Hole 43°C @ 2W 7.9°C/W @ 400 LFM 231-75PABE-XXX .750 (19.1) .835 (21.2) x .400 (12.7) Vertical 13V, 14V, 15V Clip/Mtg Hole 43°C @ 2W 7.9°C/W @ 400 LFM 231-137PAB 1.375 (35) .835 (21.2 x .400 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 32°C @ 2W 5.9°C/W @ 400 LFM 231-137PABE .400 (10.2) 1.375 (34.9) x .835 (12.7) Horizontal 13H Clip/Mtg Hole 32°C @ 2W 5.9°C/W @ 400 LFM 231-137PABE-XXX 1.375 (35) .835 (21.2) x .400 (12.7) Vertical 13V, 14V, 15V Clip/Mtg Hole 32°C @ 2W 5.9°C/W @ 400 LFM Material: Aluminum, Pre-anodized Black (PAB), Anodized Black (AB) 275 AND 231 SERIES NATURAL AND FORCED MECHANICAL CONVECTION CHARACTERISTICS DIMENSIONS TAB 13H All versions No Tab TAB TAB 14V 13V NATURAL AND FORCED CONVECTION CHARACTERISTICS TAB 01 TAB 10 TAB 15V TAB 13H Dimensions: in. (mm) 26 WTS001_p26-49 6/14/07 10:55 AM Page 27 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks 235 SERIES TO-220 Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection 235-85AB .850 (21.6) 1.000 (25.4) x .500 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 40°C @ 2W 6.8°C/W @ 400 LFM 235-85ABE-01 .850 (21.6) 1.000 (25.4) x .500 (12.7) Vertical 01 Clip/Mtg Hole 40°C @ 2W 6.8°C/W @ 400 LFM 235-85ABE-05 .500 (12.7) .850 (21.6) x 1.000 (25.4) Horizontal 05 Clip/Mtg Hole 40°C @ 2W 6.8°C/W @ 400 LFM 235-85ABE-10 .975 (24.8) 1.000 (25.4) x .500 (12.7) Vertical 10 Clip/Mtg Hole 40°C @ 2W 6.8°C/W @ 400 LFM PATENT 5381041 Material: Aluminum, Black Anodized NATURAL AND FORCED 235 SERIES MECHANICAL DIMENSIONS 235-85AB CONVECTION CHARACTERISTICS 235-85AB-05 235-85AB-01 235-85AB-10 Dimensions: in. (mm) Labor-Saving Clip-On Heat Sinks 243 SERIES TO-220 Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection 243-1PAB 1.000 (25.4) .800 (20.3) x .270 (6.9) Vert./Horiz. No Tab Clip 50°C@ 2W 4.5°C/W @ 400 LFM 243-3PAB .800 (20.3) .800 (20.3) x .270 (6.9) Verl./Horiz. No Tab Clip 78°C@ 2W 8.2°C/W @ 400 LFM Material: Aluminum, Pre-anodized Black NATURAL AND FORCED MECHANICAL DIMENSIONS CONVECTION CHARACTERISTICS 243 SERIES VIEW B-B SECTION A-A Dimensions: in. (mm) Snap-Down Self-Locking Heat Sinks TO-220 239 SERIES Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection 239-75AB .750 (19.1) 1.120 (28.4) x .435 (11.0) Vert./Horiz No Tab Clip/Mtg Hole 38°C @ 2W 6°C/W @ 400 LFM 239-75ABE-03 .750 (19.1) 1.120 (28.4) x .435 (11.0) Vertical 03 Clip/Mtg Hole 38°C @ 2W 6°C/W @ 400 LFM 239-75ABE-04 .750 (19.1) 1.120 (28.4) x .435 (11.0) Vertical 04 Clip/Mtg Hole 38°C @ 2W 6°C/W @ 400 LFM PATENT PENDING Material: Aluminum, Black Anodized 239 SERIES NATURAL AND FORCED MECHANICAL DIMENSIONS CONVECTION CHARACTERISTICS SECTION A-A 239-75AB 239-75AB-03 239-75AB-04 Dimensions: in. (mm) 27 WTS001_p26-49 6/14/07 10:55 AM Page 28 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Vertical Mount Heat Sink TO-220 265 SERIES Height Above Maximum Standard PC Board Footprint Thermal Performance at Typical Load P/N in. (mm) in. (mm) Natural Convection Forced Convection 265-118ABHE-22 1.18 (30.0) 1.00 (25.4) x .50 (12.7) 56°C rise @ 4W 7.0°C/W @ 200LFM Material: Aluminum, Black Anodized NATURAL AND FORCED MECHANICAL DIMENSIONS CONVECTION CHARACTERISTICS AIR VELOCITY (LFM) 0 200 400 600 800 1000 100 10 80 8 60 6 40 4 20 2 0 0 0 200 400 600 800 1000 2 4 6 8 10 HEAT DISSIPATED (WATTS) Vertical Mount Heat Sink 286DB SERIES TO-220 Height Above Maximum Standard PC Board Footprint Thermal Performance at Typical Load P/N in. (mm) in. (mm) Natural Convection Forced Convection 286DBE .95 (24.1) 1.00 (25.4) x .50 (12.7) 65°C rise @ 4W 9.0°C/W @ 200LFM Material: Aluminum, Black Anodized NATURAL AND FORCED MECHANICAL DIMENSIONS CONVECTION CHARACTERISTICS AIR VELOCITY (LFM) 0 200 400 600 800 1000 100 10 80 8 60 6 40 4 20 2 0 0 2 4 6 8 10 0 200 400 600 800 1000 HEAT DISSIPATED (WATTS) 28 HEAT SINK TEMPERATURE RISE HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) ABOVE AMBIENT AIR (C) THERMAL RESISTANCE SINK TO THERMAL RESISTANCE SINK TO AMBIENT (C) AMBIENT (C) WTS001_p26-49 6/14/07 10:55 AM Page 29 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Low-Cost, Low-Height Wavesolderable Heat Sinks 273 SERIES TO-218, TO-220 Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection 273-AB .375 (9.5) .750 (19.1) x .750 (19.1) Vert./Horiz. No Tab Mtg Hole 49°C @ 2W 7.2°C/W @ 400 LFM 273-ABE-01 .375 (9.5) .750 (19.1) x .750 (19.1) Vertical 01 Mtg Hole 49°C @ 2W 7.2°C/W @ 400 LFM 273-ABE-02 .375 (9.5) .750 (19.1) x .750 (19.1) Vertical 02 Mtg Hole 49°C @ 2W 7.2°C/W @ 400 LFM Material: Aluminum, Black Anodized NATURAL AND FORCED MECHANICAL DIMENSIONS 273 SERIES CONVECTION CHARACTERISTICS 273-AB 273-AB-01 273-AB-02 Dimensions: in. (mm) Low-Cost, Low-Height Wavesolderable Heat Sinks TO-220 274 & 281 SERIES Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection 274-1AB .375 (9.5) .520 (13.2) x .750 (19.1) Vert./Horiz. No Tab Mtg Hole 56°C @ 2W 8.0°C/W @ 400 LFM 274-1ABE-01 .375 (9.5) .520 (13.2) x .750 (19.1) Vertical 01 Mtg Hole 56°C @ 2W 8.0°C/W @ 400 LFM 274-1ABE-02 .375 (9.5) .520 (13.2) x .750 (19.1) Vertical 02 Mtg Hole 56°C @ 2W 8.0°C/W @ 400 LFM 274-2AB .500 (12.7) .520 (13.2) x .750 (19.1) Vert./Horiz. No Tab Mtg Hole 50°C @ 2W 7.0°C/W @ 400 LFM 274-2ABE-01 .500 (12.7) .520 (13.2) x .750 (19.1) Vertical 01 Mtg Hole 50°C @ 2W 7.0°C/W @ 400 LFM Material: Aluminum, 274-2ABE-02 .500 (12.7) .520 (13.2) x .750 (19.1) Vertical 02 Mtg Hole 50°C @ 2W 7.0°C/W @ 400 LFM Black Anodized 274-3AB .250 (6.4) .520 (13.2) x .750 (19.1) Vert./Horiz. No Tab Mtg Hole 62°C @ 2W 9.0°C/W @ 400 LFM 274-3ABE-01 .250 (6.4) .520 (13.2) x .750 (19.1) Vertical 01 Mtg Hole 62°C @ 2W 9.0°C/W @ 400 LFM 274-3ABE-02 .250 (6.4) .520 (13.2) x .750 (19.1) Vertical 02 Mtg Hole 62°C @ 2W 9.0°C/W @ 400 LFM 281-1AB .375 (9.5) .520 (13.2) x .750 (19.1) Vertical No Tab Mtg Hole 56°C @ 2W 8.0°C/W @ 400 LFM 281-2AB .500 (12.7) .520 (13.2) x .750 (19.1) Vertical No Tab Mtg Hole 50°C @ 2W 7.0°C/W @ 400 LFM NATURAL AND FORCED MECHANICAL DIMENSIONS 274 SERIES CONVECTION CHARACTERISTICS 274-XAB-02 274-XAB-01 274 SERIES 281 SERIES Dimensions: in. (mm) Labor-Saving Twisted Fin Heat Sinks TO-220 240 SERIES Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection 240-118ABEH-22 1.180 (30.0) 1.000 (25.4) x .500 (12.7) Vertical 22 Clip/Mtg Hole 55°C @ 4W 5.3°C/W @ 400 LFM 240-118ABES-22 1.180 (30.0) 1.000 (25.4) x .500 (12.7) Vertical 22 Clip/Mtg Slot 55°C @ 4W 5.3°C/W @ 400 LFM Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 240 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS 240-118ABS-22 240-118ABH-22 Dimensions: in. (mm) 29 WTS001_p26-49 6/14/07 10:55 AM Page 30 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Low-Height, Low-Profile Twisted Fin Heat Sinks TO-220 242 SERIES Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection 242-125ABE-22 1.285 (32.6) .875 (22.2) x .250 (6.4) Vertical 22 Mtg Hole 48°C @ 2W 6.2°C/W @ 400 LFM Material: Aluminum, Black Anodized 242-125AB-22 242 SERIES MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) Staggered Fin Heat Sinks for Vertical Mounting TO-202, TO-220 232 & 238 SERIES Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection 232-200AB 2.000 (50.8) 1.380 (35.1) x .500 (12.7) Vertical 2, Twisted Clip/Mtg Hole 48°C @ 4W 3.3°C/W @ 400 LFM 232-200ABE-23 2.000 (50.8) 1.380 (35.1) x .500 (12.7) Vertical 2, Solderable Clip/Mtg Hole 48°C @ 4W 3.3°C/W @ 400 LFM 238-200AB 2.000 (50.8) 1.380 (35.1) x .500 (12.7) Verlical 2, Twisted Mtg Slot 48°C @ 4W 3.3°C/W @ 400 LFM Material: Aluminum, 238-200ABE-23 2.000 (50.8) 1.380 (35.1) x .500 (12.7) Verlical 2, Solderable Mtg Slot 48°C @ 4W 3.3°C/W @ 400 LFM Black Anodized MECHANICAL DIMENSIONS 238-200AB 238-200AB-23 NATURAL AND FORCED CONVECTION CHARACTERISTICS 232-200AB 232-200AB-23 238 SERIES 232 AND 238 SERIES Dimensions: in. (mm) Slim-Profile Heat Sinks With Integral Clips 251 SERIES 15 Lead Multiwatt Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection 251-62AB .620 (15.7) .910 (23.1) x .380 (9.7) Vert./Horiz. No Tab Clip 66°C @ 3W 66°C/W @ 400 LFM 251-80AB .845 (21.5) .910 (23.1) x .380 (9.7) Vert./Horiz. No Tab Clip 64°C @ 3W 66°C/W @ 400 LFM 251-80ABE-19 .875 (22.2) .910 (23.1) x .380 (9.7) Vertical 19 Clip 64°C @ 3W 66°C/W @ 400 LFM Material: Aluminum, Black Anodized NATURAL AND FORCED MECHANICAL DIMENSIONS 251 SERIES CONVECTION CHARACTERISTICS 251-80AB 251-80AB-19 251-62AB Dimensions: in. (mm) 30 WTS001_p26-49 6/14/07 10:55 AM Page 31 Board Level Heat Sinks BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATT™ COMPONENTS Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks 244 SERIES MULTIWATT Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) 244-145AB 1.450 (36.8) 1.300 (33.0) x 480 (12.1) Vert/Horiz, No Tab 44°C @ 4W 4.4°C/W @ 400 LFM .0160 (7.25) 244-145ABE-50 1.650 (41.9) 1.300 (33.0) x 480 (12.1) Vertical 50 44°C @ 4W 4.4°C/W @ 400 LFM .0170 (7.20) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks MULTIWATT 245 SERIES Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) 245-145AB 1.450 (36.8) 1.750 (44.5) x .380 (9.7) Ver.t/Horiz. No Tab 38°C @ 4W 3.2°C/W @ 400 LFM .0160 (7.25) 245-145ABE-50 1.650 (41.9) 1.750 (44.5) x .380 (9.7) Vertical 50 38°C @ 4W 3.2°C/W @ 400 LFM .0170 (7.20) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) MULTIWATT Medium Height, Slim Profile Wavesolderable Folded Fin Heat Sinks 246 SERIES Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) 246-197AB 1.968 (50.0) 1.986 (50.4) x 3.75 (9.5) Vert./Horiz. No Tab 35°C @ 4W 2.8°C/W @ 400 LFM .0240 (10.90) 246-197ABE-50 2.168 (55.1) 1.986 (50.4) x 3.75 (9.5) Vertical 50 35°C @ 4W 2.8°C/W @ 400 LFM .0250 (11.40) Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section). Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) 31 WTS001_p26-49 6/14/07 10:55 AM Page 32 Board Level Heat Sinks BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATT™ COMPONENTS Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks MULTIWATT 247 SERIES Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) 247-195AB 1.950 (49.5) 1.900 (48.3) x .950 (24.1) Vert./Horiz. No Tab 25°C@ 4W 2.4°C/W @ 400 LFM .0330 (15.10) 247-195ABE-50 1.950 (49.5) 1.900 (48.3) x .950 (24.1) Vertical 50 25°C@ 4W 2.4°C/W @ 400 LFM .0340 (15.60) Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section). Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks MULTIWATT 248 SERIES Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) 248-162AB 1.620 (41.1) 2.000 (50.8) x .750 (19.1) Vert/Horiz. No Tab 35°C @ 4W 2.5°C/W @ 400 LFM .026 (11.60) 248-162ABE-50 1.620 (41.1) 2.000 (50.8) x .750 (19.1) Vertical 50 35°C @ 4W 2.5°C/W @ 400 LFM .027 (12.20) Order SpeedClip™ 285SC or 330SC separately. Material: Aluminum, Black Anodized Order SpeedClips™ separately for use MECHANICAL DIMENSIONS with Series 246, 247, 248 or 249 Dimensions: in. (mm) Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks MULTIWATT 249 SERIES Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) 249-113AB 1.130 (28.7) 1.900 (48.3) x .950 (24.1) Vert./Horiz, No Tab 35°C@ 4W 3.29°C/W @ 400 LFM .020 (8.90) 249-113ABE-50 1.130 (28.7) 1.900 (48.3) x .950 (24.1) Vertical 50 35°C@ 4W 3.29°C/W @ 400 LFM .021 (9.40) Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section). Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) 32 WTS001_p26-49 6/14/07 10:55 AM Page 33 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Compact Wave-Solderable Low-Cost Heat Sinks 288 SERIES TO-220, TO-202 Height Above Maximum Thermal Performance at Typical Load Standard PC Board Footprint Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) 288-1ABE 1.250 (31.8) 0.875 (22.2) x 0.215 (5.5) 85°C @ 4W 12°C/W @ 200 LFM 0.0057 (2.59) Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good space is available. The 288-1AB is a stamped aluminum heat sink, black an- electrical connections for vertical mounting of TO-220 and TO-202 semiconduc- odized, designed for applications requiring good heat dissipation from a heat tor packages. These heat sinks are designed for use where minimum PC board sink occupying minimum space, available at minimum cost. 288 SERIES MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) Top-Mount Booster Heat Sinks for Use with 270/272/280 Series TO-220 271 SERIES Horizontal Height Above Mounting Footprint Thermal Performance at Typical Load Standard Semiconductor Case Dimensions Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) 271-AB 0.500 (12.7) 1.750 (44.5) x 0.700 (17.8) 62°C @ 4W (NOTE A) 5.1°C/W @ 400 LFM 0.0052 (2.36) 31 °C @ 4W (NOTE B) 1.8°C/W 400 LFM (NOTE B) Material: Aluminum, Black Anodized This top-hat style booster heat sink can be added to any of the 270, 272, or 280 NOTE A: Thermal resistance with one 271-AB. NOTE B: Thermal resistance Series for improved performance. (total) as shown with (2) 271-AB types added to (1) 272-AB type. 271 SERIES MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) 33 WTS001_p26-49 6/14/07 10:55 AM Page 34 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Small Footprint Low-Cost Heat Sinks 270/272/280 SERIES TO-220, TO-202 Height Above Horizontal Mounting Thermal Performance at Typical Load Standard PC Board Maximum Footing Solderable Natural Forced Weight P/N in. (mm) in. (mm) Tab Options Convection Convection lbs. (grams) 270-AB 0.375 (9.4) 1.750 (44.5) x 0.700 (17.8) — 70°C @ 4W 6.0°C/W @ 400 LFM 0.0052 (2.36) 272-AB 0.375 (9.4) 1.750 (44.5) x 1.450 (36.8) 01,02 42°C @ 4W 3.6°C/W @ 400 LFM 0.0105 (5.72) 280-AB 0.375 (9.4) 1.750 (44.5) x 0.700 (17.8) — 70°C @ 4W 6.0°C/W @ 400 LFM 0.0048 (2.18) Material: Aluminum, Black Anodized These exceptionally low-cost heat sinks can be mounted horizontally under a TO-220 or The 270-AB and 280-AB accept one power semiconductor; the 272-AB is designed for two TO-202 case style with a maximum height of only 0.375 in. (9.4). For added performance, power semiconductors. Specify solderable tab options for the 272 Series by the addition of a 271 Series heat sink can also be used for double-sided heat dissipation. suffix “O1” or “02” to the standard part number (i.e. 272-AB01 or 272-AB02). NATURAL AND FORCED MECHANICAL DIMENSIONS CONVECTION CHARACTERISTICS 270 SERIES 280 SERIES 272AB01 272AB02 272 SERIES Dimensions: in. (mm) Low-Cost Single or Dual Package Heat Sinks TO-218, TO-202, TO-220 289 & 290 SERIES Height Above Horizontal Mounting Thermal Performance at Typical Load Standard PC Board Maximum Footing Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) 289-AB 0.500 (12.7) 1.000 (25.4) x 0.710 (18.1) 50°C @ 2W 9.0 C/W @ 400 LFM 0.0055 (2.49) 289-AP 0.500 (12.7) 1.000 (25.4) x 0.710 (18.1) 50°C @ 2W 9.0 C/W @ 400 LFM 0.0055 (2.49) 290-1AB 0.500 (12.7) 1.000 (25.4) x 1.180 (30.0) 44°C @ 2W 7.0 C/W @ 400 LFM 0.0082 (3.72) 290-2AB 0.500 (12.7) 1.000 (25.4) x 1.180 (30.0) 44°C @ 2W 7.0 C/W @ 400 LFM 0.0081 (3.67) Material: Aluminum, Black Anodized Low in cost and compact in overall dimensions, one 289 Series heat sink can odized finish (289-AB) or with no finish (289-AP). Two semiconductors can be accommodate one semiconductor; the 289 Series is available with a black an- mounted to the 290-2AB style. NATURAL AND FORCED MECHANICAL DIMENSIONS 289 SERIES 290 SERIES CONVECTION CHARACTERISTICS Dimensions: in. (mm) 34 WTS001_p26-49 6/14/07 10:55 AM Page 35 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS High-Performance Slim Profile Heat Sinks With Integral Clips MULTIWATT 250 SERIES Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection 250-122AB 1.220 (31.0) 1.000 (25.4) x .500 (12.7) Vert./Horiz. No Tab Clip 50°C @ 4W 3.7°C/W @ 400 LFM 250-122ABE-09 1.220 (31.0) 1.000 (25.4) x .500 (12.7) Vertical 09 Clip 50°C @ 4W 3.7°C/W @ 400 LFM 250-122ABE-25 1.380 (35.1) 1.000 (25.4) x .500 (12.7) Vertical 25 Clip 50°C @ 4W 3.7°C/W @ 400 LFM Material: Aluminum, Black Anodized 250-122AB-09 250-122AB-25 NATURAL AND FORCED 250 SERIES MECHANICAL DIMENSIONS CONVECTION CHARACTERISTICS 250-122AB Dimensions: in. (mm) High-Performance, High-Power Vertical Mount Heat Sinks TO-220 237 & 252 SERIES Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection 237-167AB2 1.675 (42.5) 1.000 (25-4) x 1.000 (25.4) Vertical 2, Twisted Clip/Mtg Slot 46°C @ 4W 4.5°C/W @ 200 LFM 237-167AB3 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 3, Twisted Clip/Mtg Slot 46°C @ 4W 4.5°C/W @ 200 LFM 237-167ABE2-24 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Solderable Clip/Mtg Slot 46°C @ 4W 4.5°C/W @ 200 LFM 252-167AB2 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Twisted Clip/Mtg Slot 40°C @ 4W 4.5°C/W @ 200 LFM 252-167AB3 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 3, Twisted Clip/Mtg Slot 40°C @ 4W 4.5°C/W @ 200 LFM 252-167ABE2-24 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Solderable Clip/Mtg Slot 40°C @ 4W 4.5°C/W @ 200 LFM Order SpeedClips™ 285SC or 330SC separately for rapid component installation, lowering manufacturing costs. Material: Aluminum, Black Anodized NATURAL AND FORCED MECHANICAL DIMENSIONS 227-167 252-167 237-167AB2 237-167AB2-24 CONVECTION CHARACTERISTICS 252-167AB2 252-167AB2-24 237 AND 252 SERIES 237-167AB3 252-167AB3 237 AND 252 SERIES 237-167AB3 252-167AB3 Dimensions: in. (mm) Labor-Saving Clip-on Heat Sinks 291 SERIES TO-220 Vertical Height Above Mounting Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Natural Forced Weight P/N in. (mm) in. (mm) Style Convection Convection lbs. (grams) 291-C236AB 0.860 (21.)9 1.100 (27.0) x 0.360 (9.1) TO-220 (Clip) 80°C @ 2W 24°C/W @ 600 LFM 0.0026 (1.18) 291-H36AB 0.860 (21.9) 1.100 (27.0) x 0.360 (9.1) TO-220 (Mtg. Hole) 68°C @ 2W 16°C/W @ 600 LFM 0.0026 (1.18)) Material: Aluminum, Black Anodized Designed for mounting horizontally or vertically on a circuit board, 291 Series One type is available with a locking clip and one with a 0.140 in. (3.6) diameter heat sinks employ a unique clip for attachment of TO-220 case styles. mounting hole only. 291 SERIES MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) 291-C2 291-H 35 WTS001_p26-49 6/14/07 10:55 AM Page 36 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks 286 SERIES TO-220 See also 286DB Series on Page 7. Height Above Thermal Performance at Typical Load Standard PC Board Maximum Footprint Natural Forced Weight P/N in. (mm) in. (mm) Material Convection Convection lbs. (grams) 286-AB 1.190 (30.2) 1.000 (25.4) x 0.500 (12.7) Aluminum, Anodized 58°C @ 4W 7.4°CW @ 200 LFM 0.0085 (3.86) 286-CBTE 1.190 (30.2) 1.000 (25.4) x 0.500 (12.7) Copper, Black 58°C @ 4W 7.4°CW @ 200 LFM 0.0250 (11.34) 286-CTE 1.190 (30.2) 1.000 (25.4) x 0.500 (12.7) Copper, Tinned 58°C @ 4W 7.4°CW @ 200 LFM 0.0250 (11.34) Efficient heat removal at low cost can be achieved by inserting the 286 Series di- the board. Material: 286-AB style (aluminum, black anodized), 286-CBT style rectly into pre-drilled circuit boards; scored mounting tabs may be bent after in- (copper, black paint tin tabs), and 286-CT style (copper, tinned). sertion to provide added stability. The 286 Series can be wavesoldered directly to NATURAL AND FORCED MECHANICAL DIMENSIONS CONVECTION CHARACTERISTICS 286 SERIES Dimensions: in. (mm) Wave-Solderable Low-Cost Heat Sinks 287 SERIES TO-220 Height Above Maximum Thermal Performance at Typical Load Standard P/N PC Board Footprint “A” Natural Forced Weight Mounting Slot Mounting Hole in. (mm) in. (mm) Convection Convection lbs. (grams) 287-1ABE 287-1ABH 1.180 (30.0) 1.000 (25.4) x 0.500 (12.7) 65°C @ 4W 7.8°CW @ 200 LFM 0.0090 (4.08) 287-2ABE 287-2ABH 1.180 (30.0) 1.000 (25.4) x 1.000 (25.4) 55°C @ 4W 6.4°CW @ 200 LFM 0.0140 (6.35) Material: Aluminum, Black Anodized Mount these cost-effective TO-220 heat sinks vertically into pre-drilled printed board. A 0.375 in. (9.5 mm) mounting slot allows for correct positioning of TO- circuit boards. Soldered, pre-tinned tabs can be wavesoldered directly to the 220 and similar semiconductor packages. MECHANICAL DIMENSIONS 287 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS Standard P/N Dim. “A” 287-1AB 0.500 (12.7) 287-2AB 1.000 (25.4) 287-1ABH 0.500 (12.7) 287-2ABH 1.000 (25.4) Dimensions: in. (mm) 285 SC and 330 SC SpeedClips™ Zif Socket 8 And 285 & 330 SERIES 387 SPGA LIF Standard Nominal Installed For Use Weight P/N Loading Force With Series Material lbs. (grams) 285 SC 10 lbs 232, 237, 240, 252, 667 Carbon Steel 0.00053 (0.24) 330 SC 4 lbs 232, 237, 240, 252, 667 Stainless Steel 0.00074 (0.34) SpeedClips™ employ a locking safety tab for mounting. Must be ordered sepa- one SpeedClip™ for each heat sink purchased. Must be purchased with heat rately for these heat sink series. Use these SpeedClips™ with our 237, 240, and sinks. 252 Series heat sinks for the lowest production assembly time and cost. Order MECHANICAL DIMENSIONS Speed Speed Clip Clip 330 SC 285 SC 4 lb (17.8N) 10 lb (44.5N) Nominal Force Nominal Force Installed Dimensions: in. (mm) Installed 36 WTS001_p26-49 6/14/07 10:55 AM Page 37 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Space-Saving Heat Sinks for Small Stud-Mounted Diodes STUD-MOUNT 695 SERIES Maximum Thermal Performance at Typical Load Standard Width Height Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) 695-1B 1.330 (33.8) 0.530 (13.7) 72°C @ 4.0W 5.2°C/W @ 400 LFM 0.008 (4.0) Mount and effectively heat sink small stud-mounted diodes with the 695 Series provides good heat dissipation for use where height is limited above the printed space-saving heat sink type. Each unit is black anodized aluminum with an circuit board or base plate. 0.200 in. (5.1) dia. mounting hole centered in the base. The folded fin design NATURAL AND FORCED 695 SERIES MECHANICAL CONVECTION CHARACTERISTICS DIMENSIONS Dimensions: in. (mm) Cup Clips for TO-5 Case Style Semiconductors TO-5 260 SERIES Depth of Characteristics TO-5 Model Tapped Base Thermal Resistance – Epoxy Insulated 14° C/W 260-4T5E 0.093 (2.36) 260-4TH5E 0.125 (3.18) Breakdown Voltage – Epoxy Type (VAC), 60 Hz 500 Recommended Operating Voltage, AC or DC Clean Conditions: % Hipot Rating 50 Thread Dusty Conditions: % Hipot Rating 30 Size: 4 = #4-40 UNC Base Style: H = hex Dirty Conditions: % Hipot Rating 10 to 20 6 = #6-32 UNC Semiconductor Temperature Range — Continuous (C°) -73/+149 Mounting T = tapped Case Style: 5 = TO-5 Style: S = stud Insulation E = epoxy P = plain TO-5 CASE STYLE CUP CLIPS — ORDERING GUIDE Outline Dimension Standard Insulation L x W x I.D. Weight Case P/N Type in. (mm) lbs. (grams) Style 260-4T5E Epoxy Insulated 0.370 (9.4) x 0.380 (9.7) dia. x 0.290 (7.4) 0.0024 (1.09) TO-5 260-4TH5E Epoxy Insulated 0.400 (10.2) x 0.370 (9.4) hex. x 0.290 (7.4) 0.0031 (1.41) TO-5 260-6SH5E Epoxy Insulated 0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4) 0.0037 (1.68) TO-5 Materials and Finish: Cups – beryllium copper, black ebonol “C”; Bases – brass, black ebonol “C” Base Mounting Configurations — TO-5 Plain Type — Epoxy bonded, or used with #4 pan head screws. Tapped Base — #4-40 UNC screw (not supplied) fits tapped hole. Care should be taken not to use too long a screw, which could short against the semicon- ductor case. For correct screw lengths: Correct Screw Length (L) = + + Depth of Base Panel Thickness Washer Thickness To determine the correct mounting screw lengths, add dimensions as follows: Stud Mounting Base. #6-32 UNC. Nuts and washers not supplied. Stud hole must be slightly countersunk to ensure flat mounting. Correct Screw Length (L) = + + Depth of Base Panel Thickness Washer Thickness 37 WTS001_p26-49 6/14/07 10:56 AM Page 38 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Epoxy Insulated For TO-5 260 SERIES 260-4T5E 260-4TH5E 260-6SH5E Thermal Links for Fused Glass Diodes 258 SERIES DIODES Standard Dimensions Weight P/N in. (mm) Material Finish lbs. (grams) 258 0.500 (12.7) x 0.250 (6.4) x 0.340 (8.6) Aluminum DeltaCoate™ 151 on all surfaces 0.0018 (0.82) except solder pads and base The thermal resistance from diode leads to chassis or heat sink is 12°C/watt, sink to ambient impedance is available, the thermal resistance from the diode when unit is mounted with TYPE 120 Joint Compound. If a 10°C/watt chassis or leads to ambient is reduced from about 150°C/watt to 22°C/watt. MECHANICAL DIMENSIONS 258 SERIES Dimensions: in. (mm) Heat Sink for Single TO-92 292 SERIES TO-92 Height Above Overall Standard PC Board Fin Width Thermal Performance Weight P/N in. (mm) in. (mm) Natural Convection Finish lbs. (grams) 292-AB 0.750 (19.1) 0. 600 (15.3) 0.225°C/W @ 0.250 W Black Anodized 0.00049 (0.22) Power semiconductors packaged in a TO-92 style plastic case can be cooled ef- 292-AB is effective over the typical power range of such devices. fectively at little additional cost with the addition of the 292-AB heat sink. The Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 292 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) 38 WTS001_p26-49 6/14/07 10:56 AM Page 39 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Slim Profile Unidirectional Fin Vertical Mount Heat Sink 634 SERIES TO-220 and TO-218 Standard Height Above Footprint P/N PC Board Dimensions Weight Plain Pin Without Pin in. (mm) in. (mm) lbs. (grams) 634-10ABEP 634-10AB 1.000 (25.4) 0.640 (16.26) x 0.640 (16.26) 0.016 (7.48 634-15ABEP 634-15AB 1.500 (38.1) 0.640 (16.26) x 0.640 (16.26) 0.025 (11.21) 634-20ABEP 634-20AB 2.000 (50.8) 0.640 (16.26) x 0.640 (16.26) 0.033 (14.95) Material: Aluminum, Black Anodized. These slim profile unidirectional fin heat sinks offer users two assembly alternatives for verti- solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications cally mounting TO-220 and TO-218 components. Models are available with or without wave- where quick assembly is needed and space is at a premium. 634 SERIES MECHANICAL DIMENSIONS TYPICAL THERMAL PERFORMANCE FOR 634-15ABP Notes: 1. Thermal compound is as- sumed between device and heat sink. 2. Tab temp with longer heat sink (634-20ABP) will typically be about 15% cooler. Tab temp with shorter heat sink (634- I0ABP) will typically be about 25% higher. Dimensions: in. (mm) High-Efficiency Heat Sinks For Vertical Board Mounting TO-220 637 SERIES Height Above Thermal Performance at Typical Load Standard PC Board “A” Maximum Footprint Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) 637-10ABEP 1.000 (25.4) 1.375 (34.9) x 0.500 (12.7) 76°C @ 6W 5.8°C/W @ 200 LFM 0.023 (10.43) 637-15ABEP 1.500 (38.1) 1.375 (34.9) x 0.500 (12.7) 65°C @ 6w 5.5°C/W @ 200 LFM 0.035 (15.88) 637-20ABEP 2.000 (50.8) 1.375 (34.9) x 0.500 (12.7) 55°C @ 6W 4.7°C/W @ 200 LFM 0.050 (22.68) 637-25ABEP 2.500 (63.5) 1.375 (34.9) x 0.500 (12.7) 48°C @ 6W 4.2°C/W @ 200 LFM 0.062 (28.12) Material: Aluminum, Black Anodized Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maxi- board space occupied must be minimized. Refer to the Accessory products section for thermal mum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight and interface materials, thermal compounds, and other accessories products. MECHANICAL DIMENSIONS 637 SERIES NATURAL AND FORCED (EXTRUSION PROFILE 5183) CONVECTION CHARACTERISTICS Dimensions: in. (mm) 39 6 7 6 - 1 6 0 6 A 7 - B P 2 5 A P B WTS001_p26-49 6/14/07 10:56 AM Page 40 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Labor-Saving SpeedClip™ Heat Sinks for Vertical Board Mounting 667 SERIES TO-220 Height Above Maximum Thermal Performance at Typical Load Standard P/N PC Board “A” Footprint Natural Forced Weight Standoff Pin Plain Pin in. (mm) in. (mm) Convection Convection lbs (grams) 667-10ABESP 667-10ABPP 1.000 (25.4) 1.375 (34.9) x 0.500 (12.7) 76°C @ 6W 5.8°C/W @ 200 LFM 0.0240 (11.0) 667-15ABESP 667-15ABPP 1.500 (38.1) 1.375 (34.9) x 0.500 (12.7) 66°C @ 6W 5.5°C/W @ 200 LFM 0.0340 (15.6) 667-20ABESP 667-20ABPP 2.000 (50.8) 1.375 (34.9) x 0.500 (12.7) 58°C @ 6W 4.7°C/W @ 200 LFM 0.0460 (21.0) 667-25ABESP 667-25ABPP 2.500 (63.5) 1.375 (34.9) x 0.500 (12.7) 48°C @ 6W 4.2°C/W @ 200 LFM 0.0580 (26.2) Wave-solderable pins. Material: Aluminum, Black Anodized Excellent performance, choice of wave-solderable plain pins (PP-Type) or wave-solderable hex-shaped standoff pins (SP-Type), and reduced assembly cost. Note: Order 330 SC or 285 SC SpeedClip™ separately. 667 SERIES MECHANICAL DIMENSIONS NATURAL AND FORCED 0.093 (EXTRUSION PROFILE 8073) DIA CONVECTION CHARACTERISTICS (2.4) 0.500 (NOMINAL) REF (12.7) STANDOFF PLAIN AIR VELOCITY (FPM) Speed PINS PINS 0 200 400 600 800 1000 Clip "SP" "PP" 100 5 330SC 1.375 0.180 4 lb REF 80 4 DIA (34.9) 0.730 0.093 Nominal (4.6) (18.5) DIA Force 1.000 (2.4) 60 3 Installed (25.4) Speed 40 2 Clip 0.044 (1.1) (STANDOFF) 285SC 0.156 0.670 0.062 20 1 (4.0) REF (17.0) 10 lb (1.6) A 0.130 (3.3) Nominal 0 0 Force 0 4 8 121620 Installed 0.125 (3.2) DIA RAISED BOSS x 0.030 (0.8) HIGH POWER DISSIPATION (WATTS) Dimensions: in. (mm) High-Efficiency Heat Sinks for Vertical Board Mounting TO-218, TO-220 626 & 627 SERIES Height Above Maximum Thermal Performance at Typical Load Standard Standard PC Board “A” Footprint Natural Forced P/N P/N in. (mm) in. (mm) Convection Convection 626-10ABEP 627-10ABP 1.000 (25.4) 1.375 (34.9) x .500 (12.7) 76°C @ 6W 5.8°C/W @ 200 LFM 626-15ABEP 627-15ABP 1.500 (38.1) 1.375 (34.9) x .500 (12.7) 65°C @ 6W 5.5°C/W @ 200 LFM 626-20ABEP 627-20ABP 2.000 (50.8) 1.375 (34.9) x .500 (12.7) 55°C @ 6W 4.7°C/W @ 200 LFM 626-25ABEP 627-25ABP 2.500 (63-5) 1.375 (34.9) x .500 (12.7) 48°C @ 6W 4.2°C/M @ 200 LFM Wave-solderable pins. Material: Aluminum, Black Anodized NATURAL AND FORCED 626 AND 627 SERIES MECHANICAL DIMENSIONS CONVECTION CHARACTERISTICS Dimensions: in. (mm) 40 2 5 - P 7 6 A B 6 P 6 6 B 7 - A 1 0 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT (°C) THERMAL RESISTANCE SINK TO AMBIENT (°C/WATT) WTS001_p26-49 6/14/07 10:56 AM Page 41 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS High-Performance Heat Sinks for Vertical Board Mounting 647 SERIES TO-220 Height Above Thermal Performance at Typical Load Standard PC Board “A” Maximum Footprint Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) 647-1OABEP 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 42°C @ 6W 3.8°C/W @ 200 LFM 0.055 (24.95) 647-15ABEP 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 37°C @ 6W 3.5°C/W @ 200 LFM 0.075 (34.02) 647-175ABEP 1.750 (44.5) 1.650 (41.9) x 1.000 (25.4) 34°C @ 6W 3.3°C/W @ 200 LFM 0.090 (40.82) 647-20ABEP 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 31°C @ 6W 3.1°C/W @ 200 LFM 0.104 (47.17) 647-25ABEP 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) 25°C @ 6W 2.8°C/W @ 200 LFM 0.125 (56.70) Material: Aluminum, Black Anodized Wave-solderable pins on 1 in. centers for vertical mounting of larger devices on printed Products section for thermal interface materials, 126 Series silicone-free thermal compounds, circuit boards. Maximum semiconductor package width: 0.625 (15.9). Refer to the Accessory and other accessories products. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 647 SERIES (EXTRUSION PROFILE 5195) Dimensions: in. (mm) High-Performance Heat Sinks for Vertical Board Mounting 657 SERIES TO-220, TO-247, TO-218 Height Above Maximum Thermal Performance at Typical Load Standard PC Board “A” Footprint Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs (grams) 657-10ABEP 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 41°C @ 6W 3.7°C/W @ 200 LFM 0.0515 (23.36) 657-15ABEP 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 38°C @ 6W 3.3°C/W @ 200 LFM 0.0760 (34.60) 657-20ABEP 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 32°C @ 6W 2.9°C/W @ 200 LFM 0.1030 (47.00) 657-25ABEP 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) 25°C @ 6W 2.7°C/W @ 200 LFM 0.1250 (57.00) Wave-solderable pins. Material: Aluminum, Black Anodized NATURAL AND FORCED MECHANICAL DIMENSIONS 657 SERIES CONVECTION CHARACTERISTICS 657 SERIES (EXTRUSION PROFILE 6533) Dimensions: in. (mm) 41 WTS001_p26-49 6/14/07 10:56 AM Page 42 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS High-Performance Notched Heat Sinks for Vertical Board Mounting TO-220, TO-247, TO-218 657 SERIES Height Above Maximum Thermal Performance at Typical Load Standard PC Board “A” Footprint Natural Forced P/N in. (mm) in. (mm) Convection Convection 657-10ABEPN 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 41°C @ 6W 3.7°C/W @ 200 LFM 657-15ABEPN 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 38°C @ 6W 3.3°C/W @ 200 LFM 657-20ABEPN 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 32°C @ 6W 2.9°C/W @ 200 LFM 657-25ABEPN 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) 25°C @ 6W 2.7°C/W @ 200 LFM Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS NATURAL AND FORCED 657 SERIES CONVECTION CHARACTERISTICS 657 SERIES (EXTRUSION PROFILE 6533) Dimensions: in. (mm) High-Performance Heat Sinks with SpeedClips™ for Vertical Board Mounting TO-220, TO-247, TO-218 657 SERIES Height Above Maximum Thermal Performance at Typical Load Standard PC Board “A” Footprint Natural Forced P/N in. (mm) in. (mm) Convection Convection 657-10ABEPSC 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 41°C @ 6W 3.7°C/W @ 200 LFM 657-15ABEPSC 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 38°C @ 6W 3.3°C/W @ 200 LFM 657-20ABEPSC 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 32°C @ 6W 2.9°C/W @ 200 LFM 657-25ABEPSC 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) 25°C @ 6W 2.7°C/W @ 200 LFM Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 657 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS 657 SERIES (EXTRUSION PROFILE 6533) Dimensions: in. (mm) High-Performance, High-Power Heat Sinks for Vertical Board Mounting TO-218, TO-220, TO-247 677 SERIES 15-LEAD Multiwatt Height Above Maximum Thermal Performance at Typical Load Standard PC Board “A” Footprint Natural Forced P/N in. (mm) in. (mm) Convection Convection 677-10ABEP 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 52°C @ 6W 3.1°C/W @ 200 LFM 677-15ABEP 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 46°C @ 6W 2.8°C/W @ 200 LFM 677-20ABEP 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 40°C @ 6W 2.5°C/W @ 200 LFM 677-25ABEP 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) 35°C @ 6W 2.2°C/W @ 200 LFM Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 677 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS 677 SERIES (EXTRUSION PROFILE 8719) Dimensions: in. (mm) 42 WTS001_p26-49 6/14/07 10:56 AM Page 43 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS HIghest Efficiency/Lowest Unit Cost Heat Sinks 690 SERIES TO-3, TO-66, TO-220 Height Above Thermal Performance at Typical Load Semiconductor Standard PC Board Outline Dimensions Natural Forced Mounting Weight P/N in. (mm) in. (mm) Convection Convection Hole Pattern lbs. (grams) 690-3B 1.310 (33.3) 1.860 (47.2)-sq 44°C @ 7.5W 2.0°C/W @ 400 LFM (1) TO-3 0.0700 (31.75) 690-66B 1.310 (33.3) 1.860 (47.2)-sq 44°C @ 7.5W 2.0°C/W @ 400 LFM (1) TO-66 0.0700 (31.75) 690-220B 1.310 (33.3) 1.860 (47.2)-sq 44°C @ 7.5W 2.0°C/W @ 400 LFM (2) TO-220 0.0700 (31.75) Material: Aluminum, Black Anodized These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are semiconductors, the 690 Series can dissipate up to 20 watts while maintaining a mounting available in three standard types to mount and cool one TO-3 or TO-66 metal power semicon- surface temperature rise above ambient air temperature of no more than 91°C. ductor type or two plastic package TO-220 power semiconductor types. For higher power MECHANICAL DIMENSIONS NATURAL AND FORCED SEMICONDUCTOR MOUNTING HOLES CONVECTION CHARACTERISTICS 690 SERIES TO-3 TO-66 *TWO TO-220’S Dimensions: in. (mm) Maximum Efficiency Omnidirectional Heat Sinks 680 SERIES TO-3, TO-220 Height Above Horizontal Mounting Thermal Performance at Typical Load Semiconductor Standard PC Board “A” Footprint Dimensions Natural Forced Mounting Weight P/N in. (mm) in. (mm) Convection Convection Hole Pattern lbs. (grams) 680-5A 0.500 (12.7) 1.810 (46.0)-sq 70°C @ 7.5W 3.0°C/W @ 400 LFM (1) TO-3 0.0700 (31.75) 680-75A 0.750 (19.1) 1.810 (46.0)-sq 58°C @ 7.5W 2.4°C/W @ 400 LFM (1) TO-3 0.0900 (40.82) 680-10A 1.000 (25.4) 1.810 (46.0)-sq 52°C @ 7.5W 2.0°C/W @ 400 LFM (1) TO-3 0.0980 (44.45) 680-125A 1.250 (31.8) 1.810 (46.0)-sq 45°C @ 7.5W 1.5°C/W @ 400 LFM (1) TO-3 0.1100 (49.90) 680-5220 0.500 (12.7) 1.810 (46.0)-sq 7O°C @ 7.5W 3.0°C/W @ 400 LFM (2) TO-220 0.0700 (31.75) 680-75220 0.750 (19.1) 1.810 (46.0)-sq 58°C @ 7.5W 2.4°C/W @ 400 LFM (2) TO-220 0.0900 (40.82) 680-10220 1.000 (25.4) 1.810 (46.0)-sq 52°C @ 7.5W 2.0°C/W @ 400 LFM (2) TO-220 0.0980 (44.45) 680-125220 1.250 (31.8) 1.810 (46.0)-sq 45°C @ 7.5W 1.5°C/W @ 400 LFM (2) TO-220 0.1100 (49.90) Material: Aluminum, Black Anodized Achieve optimum natural convection cooling per unit volume occupied above the printed natural convection applications. These 680 Series heat sinks can also be specified without any circuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style cases, semiconductor mounting hole pattern by specifying suffix “K” (Example: 680-5K). when this low-cost heat sink is used. Any mounting attitude will provide free circulation of air in NATURAL AND FORCED MECHANICAL CONVECTION CHARACTERISTICS 680 SERIES DIMENSIONS SEMICONDUCTOR MOUNTING HOLES A 220 K Dimensions: in. (mm) TO-3 *TWO TO-220’S 43 WTS001_p26-49 6/14/07 10:56 AM Page 44 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Low-Height Heat Sinks DO-4/DO-5 Diodes 601 & 603 SERIES Footprint Mounting Thermal Performance at Typical Load Standard Dimensions Height Hole Dia. Natural Forced Weight P/N in. (mm) in. (mm) in. (mm) Convection Convection lbs. (grams) 601E 2.000 (50.8) x 1.250 (31.8) 0.562 (14.3) 0.200 (5.1) 52°C @ 5.0W 4.5°C/W @ 175 LFM 0.0500 (22.68) 601F 2.000 (50.8) x 1.250 (31.8) 0.562 (14.3) 0.270 (6.9) 52°C @ 5.0W 4.5°C/W @ 175 LFM 0.0500 (22.68) 601K 2.000 (50.8) x 1.250 (31.8) 0.562 (14.3) None 52°C @ 5.0W 4.5°C/W @ 175 LFM 0.0500 (22.68) 603K 2.000 (50.8) x 2.000 (50.8) 0.562 (14.3) None 41°C @ 5.0W 4.0°C/W @ 175 LFM 0.0810 (36.74) Material: Aluminum Alloy, Black Anodized Use these low-height heat sinks on printed circuit board applications for TO-66 power semi- dissipation are required. The 601 and 603 Series may also be attached to enclosure panels or conductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient heat brackets using isolation hardware where necessary. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 603 SERIES 601 SERIES (EXTRUSION PROFILE 1284) (EXTRUSION PROFILE 1284) SEMICONDUCTOR MOUNTING HOLES KE F Dimensions: in. (mm) Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors 641 SERIES TO-3 Outline Mounting Thermal Performance at Typical Load Standard Dimensions Height Hole Natural Forced Weight P/N in. (mm) in. (mm) Pattern Convection Convection lbs. (grams) 641A 4.125 (104.8) x 3.000 (76.2) 1.000 (25.4) (1) TO-3 36°C @ 15W 0.9°C/W @ 250 LFM 0.2900 (131.54) 641K 4.125 (104.8) x 3.000 (76.2) 1.000 (25.4) None 36°C @ 15W 0.9°C/W @ 250 LFM 0.2900 (131.54) Available with a standard TO-3 mounting hole pattern predrilled for cost-effective mounting in 1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting require- limited-height applications, the 641 Series provides maximum performance in natural convec- ments for most metal case power semiconductor types. Material: Aluminum Alloy, Black An- tion with an optimized heat sink surface area. The 641K type with an open channel area of odized. 641 SERIES NATURAL AND FORCED MECHANICAL (EXTRUSION PROFILE 1371) CONVECTION CHARACTERISTICS DIMENSIONS SEMICONDUCTOR MOUNTING HOLES A K Dimensions: in. (mm) 44