WTS001_p26-49 6/14/07 10:56 AM Page 45 Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS Low-Profile Heat Sinks for All Metal-Case Power Semiconductors 621/623 SERIES TO-3 Footprint Thermal Performance at Typical Load Standard Dimensions Height Mounting Natural Forced Weight P/N in. (mm) in. (mm) Hole Pattern Convection Convection lbs. (grams) 621A 4.750 (120.6) x 1.500 (38.1) 0.461 (11.7) (1) TO-3 75°C @ 15W 2.0°C/W @ 250 LFM 0.1000 (45.36) 621K 4.750 (120.6) x 1.500 (38.1) 0.461 (11.7) None 75°C @ 15W 2.0°C/W @ 250 LFM 0.1000 (45.36) 623A 4.750 (120.6) x 3.000 (76.2) 0.461 (11.7) (1) TO-3 52°C @ 15W 1.5°C/W @ 250 LFM 0.2100 (95.26) 623K 4.750 (120.6) x 3.000 (76.2) 0.461 (11.7) None 52°C @ 15W 1.5°C/W @ 250 LFM 0.210O (95.26) A general purpose yet efficient heat dissipator for TO-3 and virtually all other styles of metal case width, accommodating many types of packages. Mounting hole pattern "A" is predrilled for the power semiconductor package types, the 621 and 623 Series low-profile flat back heat sinks find a standard TO-3 package. Material: Aluminum Alloy, Black Anodized. wide variety of applications. The central channel between fins measures 1.300 in. (33.0) (min.) in MECHANICAL DIMENSIONS 621 AND 623 SERIES (EXTRUSION PROFILE 1327) NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES A K Dimensions: in. (mm) Compact Heat Sinks for Dual Stud-Mounted Semiconductor Cases STUD-MOUNT 301/302/303 SERIES Outline Mounting Thermal Performance at Typical Load Standard Dimensions Length “A” Hole (s) Natural Forced Weight P/N in. (mm) in. (mm) Pattern and Number Convection Convection lbs. (grams) 301K 2.000 (50.8) x 2.000 (50.8) 0.750 (19.1) None 70°C @ 15W 2.5°C/W @ 250 LFM 0.0580 (26.31) 301M 2.000 (50.8) x 2.000 (50.8) 0.750 (19.1) (1) 10-32UNF, 0.625 in. thread depth 70°C @ 15W 2.5°C/W @ 250 LFM 0.0580 (26.31) 1 301N 2.000 (50.8) x 2.000 (50.8) 0.750 (19.1) (1) ⁄4 -28UNF, 0.625 in. thread depth 70°C @ 15W 2.5°C/W @ 250 LFM 0.0580 (26.31) 302M 2.000 (50.8) x 2.000 (50.8) 1.500 (38.1) (1) 10-32UNF, 0.625 in. thread depth 50°C @ 15W 1.8°C/W @ 250 LFM 0.1330 (60.33) 302MM 2.000 (50.8) x 2.000 (50.8) 1.500 (38.1) (2) 10-32UNF, 0.625 in. thread depth 50°C @ 15W 1.8°C/W @ 250 LFM 0.1330 (6033) 1 302N 2.000 (50.8) x 2.000 (50.8) 1.500 (38.1) (1) ⁄4 -28UNF, 0.625 in. thread depth 5O°C @ 15W 1.8°C/W @ 250 LFM 0.1330 (60.33) 1 302NN 2.000 (50.8) x 2.000 (50.8) 1.500 (38.1) (2) ⁄4 -28UNF, 0.625 in. thread depth 50°C @ 15W 1.8°C/W @ 250 LFM 0.1330 (60.33) 303M 2.000 (50.8) x 2.000 (50.8) 3.000 (76.2) (1) 10-32UNF, 0.625 in. thread depth 37°C @ 15W 1.3°C/W @ 250 LFM 0.2680 (121.56) 303MM 2.000 (50.8) x 2.000 (50.8) 3.000 (76.2) (2) 10-32UNF, 0.625 in. thread depth 37°C @ 15W 1.3°C/W @ 250 LFM 0.2680 (121.56) 1 303N 2.000 (50.8) x 2.000 (50.8) 3.000 (76.2) (1) ⁄4 -28UNF, 0.625 in. thread depth 37°C @ 15W 1.3°C/W @ 250 LFM 0.2680 (121.56) 1 303NN 2.000 (50.8) x 2.000 (50.8) 3.000 (76.2) (2) ⁄4 -28UNF, 0.625 in. thread depth 37°C @ 15W 1.3°C/W @ 250 LFM 0.2680 (121.56) The large fin area in minimum total volume provided by the radial design of the 301/302/303 302 and 303 Series offer maximum cost savings with dual mounting locations (“MM” and Series offers maximum heat transfer efficiency in natural convection. All types are available “NN” mounting hole patterns) for two stud-mount devices. Material: Aluminum Alloy, Black with one tapped mounting hole for rectifiers and other stud-mounting semiconductors; the Anodized. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES K M N 302 AND 303 SERIES SERIES 301 302 301 SERIES 303 Dimensions: in. (mm) 45 WTS001_p26-49 6/14/07 10:56 AM Page 46 Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS Double-Surface Heat Sinks for TO-3 Case Styles 401 & 403 SERIES TO-3; Stud-Mount Standard Width Overall Dimensions Height Semiconductor Thermal Performance at Typical Load Weight P/N in. (mm) in. (mm) in. (mm) Mounting Hole Pattem Natural Convection Forced Convection lbs. (grams) 401A 4.750 (120.7) 1.500 (38.1) 1.250 (31.8) (1) TO-3 80°C @ 30W 1.5°C/W @ 250 LFM 0.1500 (68.04) 401F 4.750 (120.7) 1.500 (38.1) 1.250 (31.8) 0.270 in. (6.9)-Dia Hole 80°C @ 30W 1.5°C/W @ 250 LFM 0.1500 (68.04) 401K 4.750 (120.7) 1.500 (38.1) 1.250 (31.8) None 80°C @ 30W 1.5°C/W @ 250 LFM 0.1500 (68.04) 403A 4.750 (120.7) 3.000 (76.2) 1.250 (31.8) (1) TO-3 55°C @ 30W 0.9°C/W @ 250 LFM 0.3500 (158.76) 403F 4.750 (120.7) 3.000 (76.2) 1.250 (31.8) 0.270 in. (6.9)-Dia Hole 55°C @ 30W 0.9°C/W @ 250 LFM 0.3500 (158.76 403K 4.750 (120.7) 3.000 (76.2) 1.250 (31.8) None 55°C @ 30W 0.9°C/W @ 250 LFM 0.3500 (158.76) With fins oriented vertically in cabinet sidewall applications, 401 and 403 Series heat sinks are in. (6.9)-diameter mounting hole (with a 0.750 in. (19.1)-diameter area free of anodize) for recommended for critical space applications where maximum heat dissipation is required for mounting stud-type diodes and rectifiers. Hole pattem “V" available upon request. Material: high-power TO-3 case styles. Forced convection performance is also exemplary with these Aluminum Alloy, Black Anodized. double surface fin types. Semiconductor mounting hole style “F” offers a single centered 0.270 MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 401 SERIES 403 SERIES Dimensions: in. (mm) SEMICONDUCTOR MOUNTING HOLES A F K V 401 AND 403 SERIES (EXTRUSION PROFILE 1024) TO-3; DO-5; Stud-Mount Low-Height Double-Surface Heat Sinks for TO-3 Case Styles and Diodes 413/421/423 SERIES Nominal Dimensions Standard Width Length Height “A” Semiconductor Thermal Performance at Typical Load Weight P/N in. (mm) in. (mm) in. (mm) Mounting Hole Pattern Natural Convection Forced Convection lbs. (grams) 413A 4.750 (120.7) 3.000 (76.2) 1.875 (47.6) (1) TO-3 72°C @ 50W 0.85°C/W @ 250 LFM 0.6300 (285.77) 413F 4.750 (120.7) 3.000 (76.2) 1.875 (47.6) 0.270 in. (6.9)-Dia Hole 72°C @ 50W 0.85°C/W @ 250 LFM 0.6300 (285.77) 413K 4.750 (120.7) 3.000 (76.2) 1.875 (47.6) None 72°C @ 50W 0.85°C/W @ 250 LFM 0.6300 (285.77) 421A 4.750 (120.7) 3.000 (76.2) 2.625 (66.7) (1) TO-3 58°C @ 50W 0.7°C/W @ 250 LFM 0.6300 (285.77) 421F 4.750 (120.7) 3.000 (76.2) 2.625 (66.7) 0.270 in. (6.9)-Dia Hole 58°C @ 50W 0.7°C/W @ 250 LFM 0.6300 (285.77) 421K 4.750 (120.7) 3.000 (76.2) 2.625 (66.7) None 58°C @ 50W 0.7°C/W @ 250 LFM 0.6300 (285.77) 423A 4.750 (120.7) 5.500 (140.2) 2.625 (66.7) (1) TO-3 47°C @ 50W 0.5°C/W @ 250 LFM 1.1700 (530.71) 423K 4.750 (120.7) 5.500 (140.2) 2.625 (66.7) None 47°C @ 50W 0.5°C/W @ 250 LFM 1.1700 (530.71) Space-saving double surface 413, 421, and 423 Series utilize finned surface field Type 126 silicone-free thermal compound or Wakefield DeltaPad™ inter- area on both sides of the power semiconductor mounting surface to provide face materials for maximum performance. Material: Aluminum Alloy, Black An- maximum heat dissipation in a compact profile. Ready to install on popular odized. power components in natural and forced convection applications. Apply Wake- MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 423 SERIES 413 SERIES (EXTRUSION PROFILE 1025) (EXTRUSION PROFILE 2276) 421 SERIES SEMICONDUCTOR MOUNTING HOLES (EXTRUSION A FK PROFILE 1025) V SERIES 413 421 Dimensions: in. (mm) 46 WTS001_p26-49 6/14/07 10:56 AM Page 47 Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS High-Performance Heat Sinks for 30-100W Metal Power Semiconductors 431 & 433 SERIES TO-3; Stud-Mount Nominal Dimensions Standard Width Length “A” Height Semiconductor Thermal Performance at Typical Load Weight P/N in. (mm) in. (mm) in. (mm) Mounting Hole Pattern Natural Convection Forced Convection lbs. (grams) 431K 4.750 (120.7) 3.000 (76.2) 3.000 (76.2) None 55°C @ 5OW 0.40°C/W @ 250 LFM 0.7800 (353.81) 433K 4.750 (120.7) 5.500 (139.7) 3.000 (76.2) None 42°C @ 5OW 0.28°C/W @ 250 LFM 1.4900 (675.86) Need maximum heat dissipation from a TO-3 rectifier heat sink in 100-watt operating range. Additional interface resistance reduction for maximized overall per- minimum space? The Wakefield 431 and 433 Series center chan- formance can be achieved with proper application of Wakefield Type 126 silicone-free thermal nel double-surface heat sinks offer the highest performance-to-weight ratio for minimum vol- compound. Material: Aluminum Alloy, Black Anodized. ume occupied for TO-3, diode, and stud-mount metal power semiconductors in the 30- to MECHANICAL DIMENSIONS NATURAL AND FORCED SERIES CONVECTION CHARACTERISTICS 431 433 SEMICONDUCTOR MOUNTING HOLE K 431 AND 433 SE- RIES (EXTRUSION PRO- FILE 2726) Dimensions: in. (mm) Lightweight Quadruple Mount Heat Sink for TO-3 Case Styles 435 SERIES TO-3 Nominal Dimensions Standard Width Length Height Semiconductor Thermal Performance at Typical Load Weight P/N in. (mm) in. (mm) in. (mm) Mounting Hole Pattern Natural Convection Forced Convection lbs. (grams) 435AAAA 4.250 (108.0) 5.500 (139.7) 4.300 (109.2) (4) TO-3 37°C @ 50W 0.38°C/W @ 250 LFM 1.1500 (521.64) 54°C @ 80W 0.24°C/W @ 600 LFM This lightweight high-performance heat sink is designed to mount selection and installation of a Wakefield Type 175 DeltaPad Kapton™ interface material for and cool efficiently one to four TO-3 style metal case power semi- each power semiconductor or, for maximum reduction of case-to-sink interface loss, the appli- conductors. The Type 435AAAA is the standard configuration available from stock, predrilled cation of Wakefield Type 126 silicone-free thermal compound. Material: Aluminum Alloy, Black for mounting four TO-3 style devices. Increased performance can be achieved with the proper Anodized. MECHANICAL DIMENSIONS Dimensions: in. (mm) NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES AAAA 435 SERIES (EXTRUSION PROFILE 4226) High-Performance Natural Convection Heat Sinks for Rectifiers and Diodes 441 SERIES Stud-Mount Nominal Dimensions Standard Width Length Height Semiconductor Thermal Performance at Typical Load Weight P/N in. (mm) in. (mm) in. (mm) Mounting Hole Pattern Natural Convection Forced Convection lbs. (grams) 441K 4.750 (120.7) 5.500 (139.7) 4.500 (114.3) None 34°C @ SOW 0.30°C/W @ 250 LFM 1.9700 (893.59) 47°C @ 80W 0.19°C/W @ 600 LFM Designed for vertical mounting within a power supply enclosure tion environment, the 441K Type will achieve thermal resistance of 0.18°C/W (sink to ambient) or equipment cabinet without forced airflow available. This Wake- at 1000 LFM. Supplied with no predrilled device mounting hole pattern. Material: Aluminum field 441 Series heat sink will dissipate up to 100 watts efficiently in natural convection with a Alloy, Black Anodized. maximum 55°C heat sink temperature rise above ambient. When applied in a forced convec- Dimensions: in. (mm) NATURAL AND FORCED MECHANICAL DIMENSIONS CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLE K 441 SERIES (EXTRUSION PROFILE 1273) 47 WTS001_p26-49 6/14/07 10:56 AM Page 48 Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS High-Power Heat Sinks for Medium Hex-Type Rectifiers and Diodes 465 & 476 SERIES Stud-Mount Nominal Dimensions Standard Width Length Height Hex Style Mounting Thermal Performance at Typical Load Weight P/N in. (mm) in. (mm) in. (mm) Type Hole Pattern Natural Convection Forced Convection lbs. (grams) 465K 4.000 (101.6) 5.000 (127.0) 4.000 (101.6) 1.060 in. Hex None 38°C @ 5OW 0.27°C/W @ 500 LFM 1.9300 (875.45) 476K 5.000 (127.0) 6.000 (152.4) 5.000 (127.0) 1.250 in. Hex None 25°C @ 5OW 0.19°C/W @ 500 LFM 2.8200 (1279.15) 476W 5.000 (127.0) 6.000 (152.4) 5.000 (127.0) 1.250 in. Hex 0.765 in. 25°C @ 5OW 0.19°C/W @ 500 LFM 2.8000 (1270.08) (19.4) Dia. Center Mount Wakefield Engineering has designed four standard heat sink types for ease of installation and signed for 1.060 in. Hex (465 Type) and 1.250 in. Hex (476 Type). The 476W Type is available efficient heat dissipation for industry standard hex-type rectifiers and similar stud-mount predrilled for an 0.765 in. (19.4) dia, mounting hole, Material: Aluminum Alloy, Black anodized. power devices: 465, 476, 486, and 489 Series. The 465 and 476 Series shown here are de- MECHANICAL DIMENSIONS NATURAL AND FORCED 465 SERIES (EXTRUSION PROFILE 1244) CONVECTION CHARACTERISTICS 476 SERIES (EXTRUSION PROFILE 1245) W K SEMICONDUCTOR MOUNTING HOLES Dimensions: in. (mm) Heat Sinks for High-Power Hex-Type Rectifiers and Diodes 486 & 489 SERIES Stud-Mount Nominal Dimensions Standard Width Length Height Hex Style Mounting Thermal Performance at Typical Load Weight P/N in. (mm) in. (mm) in. (mm) Type Hole Pattern Natural Convection Forced Convection lbs. (grams) 486K 6.250 (158.8) 6.000 (152.4) 6.250 (158.8) 1.750 in. Hex None 24°C @ 50W 0.20°C/W @ 250 LFM 4.2100 (1909.66) 86°C @ 250W 0.13°C/W @ 500 LFM 489K 6.250 (158.8) 9.000 (228.6) 6.250 (158.8) 1.750 in. Hex None 19°C @ 50W 0.15°C/W @ 250 LFM 6.1400 (2785.10) 75°C @ 250W 0.10°C/W @ 500 LFM These two heat sink types accept industry standard 1.750 in. (44.5) hex-type devices for in. (50.8) area on the semiconductor base mounting surface which is free of anodize. Material: mounting and efficient heat dissipation. Each type is provided with a 1.750 in. (44.5) x 2.000 Aluminum Alloy, Black Anodized. MECHANICAL DIMENSIONS SEMICONDUCTOR K MOUNTING HOLE NATURAL AND FORCED CONVECTION CHARACTERISTICS 486 AND 489 SERIES (EX- TRUSION SERIES PROFILE 1541) 486 Dimensions: in. (mm) 489 48 WTS001_p26-49 6/14/07 10:56 AM Page 49 Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS King Size Heat Sinks for High-Power Rectifiers 490 SERIES GENERAL PURPOSE Nominal Dimensions Standard Width Length “A” Height Semiconductor Thermal Performance at Typical Load Weight P/N in. (mm) in. (mm) in. (mm) Mounting Hole Pattern Natural Convection Forced Convection lbs. (grams) 490-35K 9.250 (235.0) 3.500 (88.9) 6.750 (171.5) None 84°C @ 20OW 0.18°C/W @ 600 LFM 3.2400 (1469.66) 490-6K 9.250 (235.0) 6.000 (152.4) 6.750 (171.5) None 60°C @ 20OW 0.13°C/W @ 600 LFM 5.4700 (2481.19) 490-12K 9.250 (235.0) 12.000 (304.8) 6.750 (171.5) None 45°C @ 20OW 0.09°C/W @ 600 LFM 10.6200 (4817.23) The 490 Series can be used to mount a single high-power rectifier or a grouping of smaller free mounting surface is milled for maximum contact area. The 490 Series Can also be drilled power devices. The semiconductor device mounting surface is free of anodize on the entire for mounting and cooling IGBTs and other isolated power modules. Material: Aluminum Alloy, surface on one side only; finish overall is black anodize. Use Type 109 mounting brackets (see Black Anodized. accessories section) for mounting to enclosure wall and for electrical isolation. The anodize- MECHANICAL DIMENSIONS NATURAL AND FORCED SEMICONDUCTOR CONVECTION CHARACTERISTICS MOUNTING HOLE 490 SERIES (EXTRUSION PROFILE 2131) Dimensions: in. (mm) PERFORMANCE, LOW PROFILE HEAT SINKS FOR POWER MODULES & IGBT’S 394, 395, 396 SERIES Thermal Resistance at Typical Load Overall Dimensions: in. (mm) Device Base Natural Forced (1) Standard Length Height Width Mounting Area Base Mounting Convection (Øsa) Convection (Øsa) P/N in. (mm) in. (mm) in. (mm) (mm) Holes (°C/W) (°C/W @ 500 LFM) 394-1AB 3.000 (76.2) 1.500 (38.1) 5.000 (127.0) 101 x 76 4 1.85 0.90 394-2AB 5.500 (139.7) 1.500 (38.1) 5.000 (127.0) 101 x 139 6 1.51 0.60 395-1AB 3.000 (76.2) 2.500 (63.5) 5.000 (127.0) 50 x 76 4 1.10 0.50 395-2AB 5.500 (139.7) 2.500 (63.5) 5.000 (127.0) 50 x 139 6 0.90 0.32 396-1AB 3.000 (76.2) 1.380 (35.1) 5.000 (127.0) 50 x 76 4 1.85 1.07 396-2AB 5.500 (139.7) 1.380 (35.1) 5.000 (127.0) 50 x 139 6 1.51 0.64 Note: 1.Thermal resistance values shown are for black anodized finish at 50°C rise above ambient. NATURAL AND FORCED MECHANICAL DIMENSIONS CONVECTION CHARACTERISTICS 394 SERIES (EXTRUSION PROFILE 7332) NATURAL AND FORCED CONVECTION CHARACTERISTICS 395 SERIES (EXTRUSION PROFILE 7330) NATURAL AND FORCED CONVECTION CHARACTERISTICS 396 SERIES (EXTRUSION PROFILE 7331) Dimensions: in. (mm) 49 WTS001_p50-68 6/14/07 10:46 AM Page 50 Extruded Heat Sinks EXTRUDED HEAT SINKS FOR DC/DC CONVERTERS Heat Sinks for “Full-Brick” DC/DC Converters TO-220 and TO-218 SERIES 557, 558 & 559 Natural Convection Footprint Forced Convection Power Dissipation (Watts) Standard Dimensions Height Fin Number Thermal Resistance 40°C Rise Heat Sink P/N in. (mm) in. (mm) Orientation of Fins at 300 ft/min (C/W) to Ambient 557-140AB 4.60 (116.8) x 2.40 (61.0) 1.40 (35.6) Horizontal 6 1.3 14 558-75AB 2.40 (61.0) x 4.60 (116.8) 0.75 (19.1) Vertical 16 1.8 12 559-50AB 2.40 (61.0) x 4.60 (116.8) 0.50 (12.7) Vertical 27 2.2 10 Material: Aluminum, Black Anodized Standard mounting hole pattern mates with Vicor DC/DC converters. Aluminum extruded fin Integral thermal interface pad option eliminates need to order and install pad separately. construction keeps DC/DC converter modules cool in both forced and natural convection appli- Ordering a single part number with the hardware kit option provides everything necessary to cations. Three fin heights, two flow direction options. Black anodized finish standard. keep your converter cool. MECHANICAL DIMENSIONS 557 SERIES PRODUCT DESIGNATION DIMENSIONS Dimensions: in. (mm) MECHANICAL DIMENSIONS 558 SERIES DIMENSIONS PRODUCT DESIGNATION Dimensions: in. (mm) MECHANICAL DIMENSIONS 559 SERIES DIMENSIONS PRODUCT DESIGNATION Dimensions: in. (mm) 50 WTS001_p50-68 6/14/07 10:46 AM Page 51 Extruded Heat Sinks EXTRUDED HEAT SINKS FOR DC/DC CONVERTERS Heat Sinks for “Half-Brick” DC/DC Converters TO-220 and TO-218 SERIES 517, 527, 518 & 528 THERMAL PERFORMANCE Footprint Natural Convection Forced Convection Standard Dimensions Height Fin Number Power Dissipation (Watts) Thermal Resistance P/N in. (mm) in. (mm) Orientation of Fins 60°C Rise Heat Sink to Ambient at 300 ft/min (C/W) 517-95AB 2.28 (57.9) x 2.40 (61.0) 0.95 (24.1) Horizontal 8 11W 2.1 527-45AB 2.28 (57.9) x 2.40 (61.0) 0.45 (11.4) Horizontal 11 7W 2.3 527-24AB 2.28 (57.9) x 2.40 (61.0) 0.24 (6.1) Horizontal 11 5W 4.2 518-95AB 2.40 (61.0) x 2.28 (57.9) 0.95 (24.1) Vertical 8 11W 2.2 528-45AB 2.40 (61.0) x 2.28 (57.9) 0.45 (11.4) Vertical 11 7W 2.1 528-24AB 2.40 (61.0) x 2.28 (57.9) 0.24 (6.1) Vertical 11 5W 3.5 Material: Aluminum, Black Anodized Standard mounting hole patterns mate with the majority of “half-brick” DC/DC converters on available in a variety of heights. Black anodized finish standard. Integral thermal interface the market. Aluminum extruded fin construction keeps DC/DC converter modules cool in pad option eliminates need to order and install pad separately. Ordering a single part number both forced and natural convection applications. Vertical and horizontal fin configurations with the hardware kit option provides everything necessary to keep your converter cool. MECHANICAL DIMENSIONS 517, 527, 518 AND 528 SERIES 517/527 SERIES DIMENSIONS 518/528 SERIES DIMENSIONS PRODUCT DESIGNATION Dimensions: in. (mm) MOUNTING HARDWARE FOR EXTRUDED HEAT SINKS Teflon Mounting Insulators 100 SERIES Standard Description For Use with Series Mounting Hipot Rating Weight P/N Hardware Material (VAC) lbs. (grams) 103 Spool-shaped insulator 300, 400, 600, 111, 113 #6-32 screw Teflon 1500 0.00012 (0.05) 107 Spool-shaped insulator 300, 400, 600, 111, 113 #6-32 screw, nut Teflon 5000 0.0034 (1.54) 107 SERIES 103 SERIES 51 WTS001_p50-68 6/14/07 10:46 AM Page 52 Extruded Heat Sinks EXTRUDED HEAT SINKS FOR DC/DC CONVERTERS Heat Sinks for “Quarter-Brick” DC/DC Converters 537 & 547 SERIES TO-220 and TO-218 Footprint Forced Convection Standard Dimensions Height Fin Number Thermal Resistance P/N in. (mm) in. (mm) Orientation of Fins at 300 ft/min (C/W) 537-95AB 2.28 (57.9) x 1.45 (36.8) 0.95 (24.1) Horizontal 8 2.1 537-45AB 2.28 (57.9) x 1.45 (36.8) 0.45 (11.4) Horizontal 13 2.3 537-24AB 2.28 (57.9) x 1.45 (36.8) 0.24 (6.1) Horizontal 14 4.2 547-95AB 1.45 (36.8) x 2.28 (57.9) 0.95 (24.1) Vertical 11 2.2 547-45AB 1.45 (36.8) x 2.28 (57.9) 0.45 (11.4) Vertical 20 2.1 547-24AB 1.45 (36.8) x 2.28 (57.9) 0.24 (6.1) Vertical 22 3.5 Material: Aluminum, Black Anodized Mounting slots accomodate two hole patterns: 1.86” x 1.03” and 2.00” x 1.20”, fitting the heights. Black anodized finish standard. Integral thermal interface pad option eliminates vast majority of quarter-brick converters on the market. Designed for optimum use in forced need to order and install pad separately. Ordering a single part number with the hardware kit convection applications. Vertical and horizontal fin configurations available in a variety of option provides everything necessary to keep your converter cool. MECHANICAL DIMENSIONS 537 & 547 SERIES 537 SERIES DIMENSIONS 547 SERIES DIMENSIONS PRODUCT DESIGNATION Dimensions: in. (mm) 52 WTS001_p50-68 6/14/07 10:46 AM Page 53 Bonded Fin Heat Sinks HIGH FIN DENSITY HEAT SINKS FOR POWER MODULES, IGBTS, RELAYS (5) 510, 511 & 512 SERIES Height Thermal Resistance (Øsa) at Typical Load (5) (1) (2) Standard Catalog P/N Milled Base Nonmilled Base Natural Forced (3) (4) Milled Nonmilled Base Width Length (“M Series”) (“U” Series) Convection Convection (1) (2) Base Base in. (mm) in. (mm) in. (mm) in. (mm) (°C/W) (°C/W @ 100 CFM) 510-3M 510-3U 7.380 (187.452) 3.000 (76.2) 3.106 (78.9) 3.136 (79.7) 0.56 0.088 510-6M 510-6U 7.380 (187.452) 6.000 (152.4) 3.106 (78.9) 3.136 (79.7) 0.38 0.070 510-9M 510-9U 7.380 (187.452) 9.000 (228.6) 3.106 (78.9) 3.136 (79.7) 0.29 0.066 510-12M 510-12U 7.380 (187.452) 12.000 (304.8) 3.106 (78.9) 3.136 (79.7) 0.24 0.062 510-14M 510-14U 7.380 (187.452) 14.000 (355.6) 3.106 (78.9) 3.136 (79.7) 0.21 0.059 511-3M 511-3U 5.210 (132.33) 3.000 (76.2) 2.350 (59.7) 2.410 (61.2) 0.90 0.120 511-6M 511-6U 5.210 (132.33) 6.000 (152.4) 2,350 (59.7) 2.410 (61.2) 0.65 0.068 511-9M 511-9U 5.210 (132.33) 9.000 (228.6) 2.350 (59.7) 2.410 (61.2) 0.56 0.060 511-12M 511-12U 5.210 (132.33) 12.000 (304.8) 2.350 (59.7) 2.410 (61.2) 0.45 0.045 512-3M 512-3U 7.200 (182.88) 3.000 (76.2) 2.350 (59.7) 2.410 (61.2) 0.90 0.120 512-6M 512-6U 7.200 (182.88) 6.000 (152.4) 2.350 (59.7) 2.410 (61.2) 0.65 0.068 512-9M 512-9U 7.200 (182.88) 9.000 (228.6) 2.350 (59.7) 2.410 (61.2) 0.56 0.060 512-12M 512-12U 7.200 (182.88) 12.000 (304.8) 2.350 (59.7) 2.410 (61.2) 0.45 0.045 Notes: 2. Nonmilled base flatness: 0.006 in./in. 4. Forced convection heat dissipation for distributed heat 1. Precision-milled base for maximum heat transfer 3. Natural convection heat dissipation for distributed heat sources at 100 cubic feet per minute, shrouded condition. performance (flatness 0.002 in./in.) sources at 50°C rise. 5. Standard models are provided without finish. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 510 SERIES 510 Series (Extrusion Profile 5113) Series A B Flatness 510-U 0.216 (5.5) 3.136 (79.7) 0.006 in./in. (0.15 mm/mm) 510-M 0.165 (4.2) 3.106 (78.9) 0.002 in./in. (0.05 mm/mm) 511 Series (Extrusion Profile 6438-1) 511 AND 512 SERIES 512 Series (Extrusion Profile 6438-2) Series A B C Flatness 511-U 512-U 0.250 (6.4) 2.410 (61.2) 0.372 (9.4) 0.006 in./in. (0.15 mm/mm) 511-M 512-M 0.220 (5.6) 2.350 (59.7 0.342 (8.7) 0.002 in./in. (0.05 mm/mm) Dimensions: in. (mm) High Performance Heat Sinks for Power Modules, IGBTs and Solid State Relays 392 SERIES Thermal Resistance at Typical Load Standard P/N, Finish Natural Forced Black Gold Length Convection (Øsa) Convection (Øsa) Weight Anodized Iridite in. (mm) (°CW) (°CW) lbs. (grams) 392-120AB 392-120AG 4.725 (120.0) 0.50 0.16 @ 100 CFM 4.452 (2019.43) 392-180AB 392-180AG 7.087 (180.0) 0.43 0.11 @ 100 CFM 6.636 (3010.09) 392-300AB 392-300AG 11.811 (300.0) 0.33 0.08 @ 100 CFM 1O.420 (4726.51) NATURAL AND FORCED MECHANICAL DIMENSIONS CONVECTION CHARACTERISTICS NATURAL CONVECTION 392-120 (1 MOD) 392-180 (1 MOD) 392-300 (1 MOD) 392-300 (3 MOD) FORCED 392 SERIES CONVECTION 392-120 (1 MOD) (EXTRUSION 392-120 (3 MOD) PROFILE 5658) 392-180 (1 MOD) 392-180 (3 MOD) 392-300 (3 MOD) Dimensions: in. (mm) 53