Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink evaluation kit. BGA Heat Sink Heat Sink Height Recommended Attachment Sizes (mm) Footprint (mm) (inches) Series # Method 17 17 x 17 .40 D10650 Adhesive 19 19 x 19 1.00 602 Adhesive 21 21 x 21 .40 D10850 Adhesive 21 21 x 21 .25 .35 .45 .60 624 Adhesive 23 22 x 22 .40 .60 604 Adhesive 23 22 x 22 .75 605 Adhesive 25 25 x 25 .25 .35 .45 .60 625 Adhesive 27 28 x 28 .25 .35 .45 .60 658 Adhesive 29 30 x 30 .77 606 Adhesive 31 31 x 28 .65 607 Adhesive 31 31 x 31 .80 611 Adhesive 33 32 x 32 .35 .40 610 Adhesive 35 35 x 35 .65 612 Adhesive 35 35 x 35 .25 .35 .45 .60 642 Adhesive 35 35 x 35 .25 .35 .45 .60 630 Adhesive 37.5 37 x 37 .50 613 Adhesive 37.5 37 x 37 .65 659 Adhesive 45.7 x 35.5 37 x 47 .80 617 Adhesive 40 38 x 38 .30 .50 1.00 614 Adhesive 37.5 38 x 38 .29 660 Adhesive 40 40 x 28 .35 643 Clip 40 40 x 40 .26 .53 655 Adhesive 42.5 41 x 41 .41 615 Adhesive 45 43 x 43 .20 .25 .35 .45 .60 628 Adhesive 45 43 x 43 .15 662 Adhesive 47.5 47 x 47 .80 616 Adhesive 50 50 x 50 .40 .65 .80 1.00 698 Adhesive 50 51 x 51 .20 1.00 618 Adhesive 50 52 x 51 .80 622 Adhesive 50 53 x 47 .40 .65 .80 1.00 798 Adhesive 50 64 x 51 .24 620 Adhesive up to 45 73 x 50 .50 1.00 609 Clip up to 45 73 x 50 .95 619 Clip RoHS COMPLIANCE Please note that Wakefield part numbers designated with an “E” in this catalog denote new parts in compliance with the RoHS ini- tiative, with the exception of our Precision Clamps. Wakefield will still continue to offer non-RoHS compliant versions of these parts. Please be aware that many Wakefield Standard parts have always been compliant since their design inception and therefore will not carry the “E” designation. Wakefield requests that you refer to the RoHS compliance tool on our website at www.wakefield.com to verify RoHS compliance. If you require further clarification or information regarding RoHS, please contact the factory. 2 Thermal Interface THERMAL INTERFACE MATERIAL PART NUMBER GUIDE All of the heat sinks shown in this catalog are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the “T” series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide a good thermal link to the heat sink. The “S” series interface materials have adhesives on only one side, for pre-attachment to the heat sink, and provide superior thermal performance. Specify these materials in applications where the heat sink will be fixed to the electronic package by some mechanical means other than a tape. Please note that none of these materials are for use in applications requiring elec- trical isolation from the electronic device. All options other than -T1 and -T4 are RoHS compliant. Note: To obtain the estimated thermal resistance of the interface material in your application, divide the thermal impedance value by the area of the pad in square inches. For example, a 2” x 2” piece of T4 has a resistance of 1.10 C-in^2/W � 4 in^2=0.275 C/W “T” SERIES THERMALLY ENHANCED PRESSURE SENSITIVE ADHESIVES Manufacturer Thermal Impedance Thickness, Suffix Product C-in^2/W Inches Package Surface, Comments -T1 Chomerics, T405 0.47 0.006 Metal/ceramic; aluminum carrier -T1E Chomerics, T405R 0.47 0.006 RoHS-compliant version of -T1 -T3 Chomerics, T412 0.25 0.009 Metal/ceramic; very good performance and conformity -T4 Chomerics, T410 1.10 0.007 Plastic -T4E Chomerics, T410R 1.10 0.007 RoHS-compliant version of -T4 -T5 Chomerics, T411 1.00 0.011 Plastic; conforms to out-of-flat packages -T6 3M, 8810 0.88 0.010 Metal/ceramic; very good adhesion and conformity -T7 Bergquist, BP 108 1.28 0.008 Metal/ceramic; electrically insulating “S” SERIES THERMAL INTERFACE PADS Manufacturer Thermal Impedance Thickness, Suffix Product C-in^2/W Inches Package Surface, Comments -S4 Berquist Softface 0.06 0.005 All surfaces; requires mechanical fasteners ORDERING INFORMATION Once you have chosen heat sink and thermal interface material that meets your thermal & mechanical requirements it is easy to designate the part number. Simply add the interface material suffix referenced on the chart above to the base part number for the heat sink. The base part number already includes information regarding its size and finish. Example: To order the 658 Series heat sink at .350” tall with the T5 thermal interface material, specify part number: 658-35AB - T5 From Catalog Page ?? From Table on Page ?? 3 Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Omnidirectional Pin Fin Heat Sink for BGAs 624 SERIES Fin Height Standard Base Dimensions “A” Typical Weight P/N in. Sq. in. (mm) Applications lbs. (grams) 624-25AB .827 (21) .250 (6.4) 21mm BGA .009 (4.09) 624-35AB .827 (21) .350 (8.9) 21mm BGA .011 (4.99) 624-45AB .827 (21) .450 (11.4) 21mm BGA .015 (6.81) 624-60AB .827 (21) .600 (15.2) 21mm BGA .026 (11.80) Material: Aluminum, Black Anodized The 624 Series is an omnidirectional pin fin heat sink for both natural and PRODUCT FEATURES forced-convection applications.Available in four standard heights, .25 inch, .35 inch, .45 inch, and .60 inch. Applications include network routers and switches, high-resolution printers, Available with pressure sensitive adhesives for quick and easy mounting. digital cameras, consumer video games, digital video disks (DVD) and See Page 3 global positioning systems (GPS). MECHANICAL DIMENSIONS 624 SERIES 624 THERMAL PERFORMANCE 30 624-25-T4 624-35-T4 25 624-45-T4 624-60-T4 20 15 10 5 0 200 300 400 500 600 Approach Velocity, LFM Dimensions: in. Omnidirectional Pin Fin Heat Sink for BGAs 625 SERIES Fin Height Standard Base Dimensions “A” Typical Weight P/N in. Sq. in. (mm) Applications lbs. (grams) 625-25AB .984 (25) 0.250 (6.4) 25 mm BGA .012 (5.45) 625-35AB .984 (25) 0.350 (8.9) 25 mm BGA .014 (6.36) 625-45AB .984 (25) 0.450 (11.4) 25 mm BGA .018 (8.17) 625-60AB .984 (25) 0.600 (15.2) 25 mm BGA .030 (13.62) Material: Aluminum, Black Anodized The 625 Series is an omnidirectional pin fin heat sink for both natural and PRODUCT FEATURES forced-convection applications.Available in four standard heights, .25 inch, .35 inch, .45 inch, and .60 inch. Applications include network routers and switches, high-resolution printers, Available with pressure sensitive adhesives for quick and easy mounting. digital cameras, consumer video games, digital video disks (DVD) and See Page 3 global positioning systems (GPS). MECHANICAL DIMENSIONS 625 SERIES 625 THERMAL PERFORMANCE 20 625-25-T4 18 625-25-T4 625-45-T4 16 625-60-T4 14 12 10 8 6 4 2 0 200 300 400 500 600 Approach Velocity, LFM Dimensions: in. 4 Case-to-Ambient Thermal Resistance, C/W Case-to-Ambient Thermal Resistance, C/W Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Unidirectional Fin Heat Sink for BGAs 659 SERIES Standard Base Dimensions Height Typical Heat Sink Weight P/N in. (mm) in. (mm) Application Finish lbs. (grams) 659-65AB 1.45 (36.8) sq 0.650 (16.5) 37mm BGA Black Anodized 0.050 (22.68) Notes: 1. Optional factory preapplied pressure-sensitive adhesive. See Page 3 NATURAL AND FORCED MECHANICAL DIMENSIONS CONVECTION CHARACTERISTICS Dimensions: in. (mm) Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC™ 655 SERIES Standard Base Dimensions Dimension “A” Dimension “B” Typical Heat Sink Weight P/N in. (mm) in. (mm) in. (mm) Applications Finish lbs. (grams) 655-26AB 1.600 (40.6) sq 0.260 (6.6) 0.125 (3.2) 40mm BGA Black Anodized 0.038 (17.01) 655-53AB 1.600 (40.6) sq 0.525 (13.3) 0.145 (3.7) 40mm BGA Black Anodized 0.050 (22.68) Notes: 1. Optional factory preapplied pressure-sensitive adhesive. See Page 3 NATURAL AND FORCED MECHANICAL DIMENSIONS CONVECTION CHARACTERISTICS Dimensions: in. (mm) Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC™ 658 SERIES Standard Base Dimensions Dimension “A” Typical Heat Sink Weight P/N in. (mm) in. (mm) Applications Finish lbs. (grams) 658-25AB 1.100 (27.9) sq 0.250 (6.4) 27mm BGA Black Anodized 0.013 (5.67) 658-35AB 1.100 (27.9) sq 0.350 (8.9) 27mm BGA Black Anodized 0.015 (6.70) 658-45AB 1.100 (27.9) sq 0.450 (11.4) 27mm BGA Black Anodized 0.019 (8.50) 658-60AB 1.100 (27.9) sq 0.600 (15.2) 27mm BGA Black Anodized 0.031 (14.17) Notes: 1. Optional factory preapplied pressure-sensitive adhesive. See Page 3 NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS Dimensions: in. (mm) KEY: � 658-25AB +658-35AB � 658-45AB � 658-60AB 5 Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Unidirectional Fin Heat Sink for BGAs 660 SERIES Standard Base Dimensions Height Typical Heat Sink Weight P/N in. (mm) in. (mm) Application Finish lbs. (grams) 660-29AB 1.530SQ. (38.9)SQ. 0.285 (7.2) 37mm BGA Black Anodized 0.031 (14.17) Notes: 1. Optional factory preapplied pressure-sensitive adhesive. See Page 3 MECHANICAL NATURAL AND FORCED DIMENSIONS CONVECTION CHARACTERISTICS Dimensions: in. (mm) 642 SERIES Unidirectional Fin Heat Sink for BGAs Standard Base Dimensions Fin Height "A" Typical Weight P/N in. Sq. in. (mm) Applications lbs. (grams) 642-25AB 1.378 (35) .250 (6.4) 35 mm BGA .022 (9.99) 642-35AB 1.378 (35) .350 (8.9) 35 mm BGA .027 (12.26) 642-45AB 1.378 (35) .450 (11.4) 35 mm BGA .031 (14.07) 642-60AB 1.378 (35) .600 (15.2) 35 mm BGA .039 (17.71) Material: Aluminum, Black Anodized The 642 Series is an unidirectional pin fin heat sink for both natural and PRODUCT FEATURES forced-convection applications.Available in four standard heights, .25 inch, .35 inch, .45 inch, and .60 inch. Available with pressure sensitive adhesives for quick and easy mounting. Applications include network routers and switches, high-resolution printers, See Page 3 digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS). MECHANICAL DIMENSIONS 642 SERIES 642 THERMAL PERFORMANCE 14 642-25-T4 642-35-T4 12 642-45-T4 642-60-T4 10 8 6 4 2 0 200 300 400 500 600 Approach Velocity, LFM Performance shown is with T4 thermal adhesive applied. Dimensions: in. (mm) 6 Case-to-Ambient Thermal Resistance, C/W Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Omnidirectional Pin Fin Heat Sink for Limited Height BGAs 662 SERIES Standard Base Dimensions Height Typical Heat Sink Weight P/N in. (mm) in. (mm) Applications Finish lbs. (grams) 662-15AG 1.713 (43.5) sq 0.150 (3.8) 45mm BGA Gold Iridite 0.019 (8.50) 662-15AB 1.713 (43.5) sq 0.150 (3.8) 45mm BGA Black Anodized 0.019 (8.50) Notes: 1. Optional factory preapplied pressure-sensitive adhesive. See Page 3 MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) Omnidirectional Pin Fin Heat Sink for BGAs 628 SERIES Standard Base Dimensions Dimensions “A” Typical Heat Sink Weight P/N in. (mm) in. (mm) Applications Finish lbs. (grams) 628-20AB 1.750 (44.5) x 1.700 (43.2) 0.200 (5.1) 45mm BGA Black Anodized 0.031 (14.17) 628-25AB 1.750 (44.5) x 1.700 (43.2) 0.250 (6.4) 45mm BGA Black Anodized 0.038 (17.01) 628-35AB 1.750 (44.5) x 1.700 (43.2) 0.350 (8.9) 45mm BGA Black Anodized 0.044 (19.84) 628-40AB 1.750 (44.5) x 1.700 (43.2) 0.400 (10.2) 45mm BGA Black Anodized 0.050 (22.68) 628-65AB 1.750 (44.5) x 1.700 (43.2) 0.650 (16.5) 45mm BGA Black Anodized 0.056 (25.51) Notes: 1. Optional factory preapplied pressure-sensitive adhesive. See Page 3 NATURAL CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) KEY: � � 628-20AB � 628-25AB � 628-35AB � � 628-40AB � 628-65AB 7 Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Omnidirectional Pin Fin Heat Sink for BGAs 630 SERIES Fin Height Standard Base Dimensions “A” Typical Weight P/N in. Sq. in. (mm) Applications lbs. (grams) 630-25AB 1.378 (35) .250 (6.4) 35mm BGA .009 (4.09) 630-35AB 1.378 (35) .350 (8.9) 35mm BGA .011 (4.99) 630-45AB 1.378 (35) .450 (11.4) 35mm BGA .015 (6.81) 630-60AB 1.378 (35) .600 (15.2) 35mm BGA .026 (11.80) Material: Aluminum, Black Anodized The 630 Series is an omnidirectional pin fin heat sink for both natural and PRODUCT FEATURES forced-convection applications.Available in four standard heights, .25 inch, .35 inch, .45 inch, and .60 inch. Applications include network routers and switches, high-resolution printers, Available with pressure sensitive adhesives for quick and easy mounting. digital cameras, consumer video games, digital video disks (DVD) and global See Page 3 positioning systems (GPS). MECHANICAL DIMENSIONS 630 SERIES 630 THERMAL PERFORMANCE Dimensions: in. HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Omnidirectional Pin Fin Heat Sink For BGAs 698 SERIES Standard Base Dimensions Dimensions “A” Typical Heat Sink Weight P/N in. (mm) in. (mm) Applications Finish lbs. (grams) 698-40AB 2.100 (53.3) sq. 0.400 (10.2) sq. 45mm BGA Black Anodized 0.075 (34.02) 698-65AB 2.100 (53.3) sq. 0.650 (16.5) sq. 45mm BGA Black Anodized 0.119 (53.86) 698-80AB 2.100 (53.3) sq. 0.800 (20.3) sq. 45mm BGA Black Anodized 0.125 (56.70) 698-100AB 2.100 (53.3) sq. 1.000 (25.4) sq. 45mm BGA Black Anodized 0.144 (65.20) Notes: 1. Optional factory preapplied pressure-sensitive adhesive. See Page 3 MECHANICAL DIMENSIONS FORCED CONVECTION THERMAL PERFORMANCE DATA (FLOW PARALLEL TO EXTRUSION DIRECTION) Dimensions: in. (mm) KEY: � � 698-40AB � 698-65AB � � 698-80AB � 698-100AB 8 Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Pin Fin Heat Sink for BGAs 798 SERIES Standard Base Dimensions Dimensions “A” Typical Heat Sink Weight P/N in. (mm) in. (mm) Applications Finish lbs. (grams) 798-40AB 2.100 (53.3) x 1.860 (47.2) 0.400 (10.2) 45mm BGA Black Anodized 0.063 (28.35) 798-65AB 2.100 (53.3) x 1.860 (47.2) 0.650 (16.5) 45mm BGA Black Anodized 0.106 (48.19) 798-80AB 2.100 (53.3) x 1.860 (47.2) 0.800 (20.3) 45mm BGA Black Anodized 0.113 (51.03) 798-100AB 2.100 (53.3) x 1.860 (47.2) 1.000 (25.4) 45mm BGA Black Anodized 0.131 (59.53) MECHANICAL DIMENSIONS FORCED CONVECTION THERMAL PERFORMANCE DATA (FLOW PARALLEL TO EXTRUSION DIRECTION) KEY: � 798-40AB � 798-65AB � 798-80AB � 798-100AB Notes: 1 . Heat sink mounting surface flatness: 0.004" TIR 2. Optional factory preapplied pressure-sensitive adhesive. See Page 3 Dimensions: in. (mm) Omnidirectional Pin Fin Heat Sink for BGAs 643 SERIES Standard Base Dimensions Fin Height Typical Weight P/N in. (mm) in. (mm) Applications lbs. (grams) 643-35AP 1.60 (40.64) x 1.10 (27.94) 0.350 (8.89) 40 mm BGA .070 (31.78) Material: Aluminum, Plain Finish The Series 643-35AP is an omnidirectional pin fin heat sink for both natural PRODUCT FEATURES and forced-convection applications designed to fit a 40 mm BGA. Available with pressure sensitive adhesives to ensure good thermal Applications include network routers and switches, high-resolution printers, performance. See page 3 digital cameras, consumer video games, digital video disks (DVD) and globalCan be ordered with the 829SC clip. Order clip separately. positioning systems (GPS). (Clip cannot be purchased without heat sink) MECHANICAL DIMENSIONS 643-35AP SERIES 643 THERMAL PERFORMANCE 10 9 8 7 6 5 4 3 2 1 0 0 100 200 300 400 500 600 700 Approach Air Velocity, LFM Performance shown is with S5 interface material applied. Dimensions: in. 9 Case-to-Ambient Thermal Resistance, C/W Integrated Circuit Heat Sinks ™ DELTEM COMPOSITE HEAT SINKS FOR BGAs Pin Fin Heat Sink Deltem™ D10650-40 Standard Base Dimensions Height Weight P/N in. (mm) in. (mm) lbs. (grams) D10650-40 0.650 (16.5) sq 0.400 (10.2) 0.004 (1.91) Notes: Available with pressure sensitive adhesives for quick and easy mounting. See Page 3 Pin Fin Heat Sink Deltem™ D10850-40 Standard Base Dimensions Height Typical Weight P/N in. (mm) in. (mm) Applications lbs. (grams) D10850-40 0.850 (21.6) sq 0.400 (10.2) 21mm BGA 0.006 (3.9) Notes: Available with pressure sensitive adhesives for quick and easy mounting. See Page 3 MECHANICAL DIMENSIONS DELTEM™ D10650-40 PIN FIN HEAT SINK DELTEM™ D10850-40 PIN FIN HEAT SINK NATURAL AND FORCED NATURAL AND FORCED CONVECTION CHARACTERISTICS CONVECTION CHARACTERISTICS AIR VELOCITY (LFM) AIR VELOCITY (LFM) 0 200 400 600 800 1000 0 200 400 600 800 1000 10 0 30 10 0 16 14 25 80 80 12 20 60 60 10 15 8 40 40 10 6 4 20 20 5 2 0 0 0 0 0.25 0.50 0.75 1.00 1.25 0 0 0.25 0.50 0.75 1.00 1.25 HEAT DISSIPATED (WATTS) HEAT DISSIPATED (WATTS) Dimensions: in. (mm) 10 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) THERMAL RESISTANCE SINK TO AMBIENT (C) HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) THERMAL RESISTANCE SINK TO AMBIENT (C) Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Pin Fin Heat Sink/Clip Assembly for BGAs and PowerPC™ Packages 609 SERIES Standard Base Dimensions Dimensions “A” Typical Heat Sink Weight P/N in. (mm) in. (mm) Applications Finish lbs. (grams) 609-50AB 2.895 (73.5) x 2.000 (50.8) 0.500 (12.7) 40&45mm BGA Black Anodized 0.094 (42.5) 609-100AB 2.808 (71.32) x 1.700 (43.2) 1.00 (25.4) 40&45mm BGA Black Anodized 0.130 (59.0) Note: Optional factory preapplied thermal interface material. 2 S3 (Bergquist Q-Pad 3, 0.14 °C in /w) 2 S4 (Bergquist Softface, 0.07 °C in /w) MECHANICAL DIMENSIONS FORCED CONVECTION THERMAL PERFORMANCE DATA (FLOW PARALLEL TO EXTRUSION DIRECTION) 5 4 609-50AB 3 2.808 609-100AB * 2 1 0 100 200 300 400 500 AIR VELOCITY (LFM) *Performance is for shrouded conditions. 609-100 will perform better than 609-50 in cases with bypass. “A” � DIM. (609-50AB) (609-100AB) Dimensions: in. (mm) 609-50AB HEAT SINK AND CLIP ASSEMBLY Designed to fit a .063” thick PCB electronic package thickness of .110” Fan Heat Sink for BGA and PowerPC™ Packages 619 SERIES Standard Base Dimensions Height Typical Heat Sink Thermal Weight P/N in. (mm) in. (mm) Applications Finish Performance lbs. (grams) 61995AB124D1 2.871 (72.92) x 1.98 (50.29) 0.953 (24.21) 40&45mm BGA Black Anodized 1.2° C/W .150 (68.10) 61995AB054D1 2.871 (72.92) x 1.98 (50.29) 0.953 (24.21) 40&45mm BGA Black Anodized 1.2° C/W .150 (68.10) Note: Optional factory preapplied thermal interface material. See 609 series. FEATURES AND BENEFITS: Impingement air flowCaptivated clips for ease of assembly Accommodates BGA packages up to 45 mm in sizeLow acoustic noise MECHANICAL DIMENSIONS Dimensions: in. See 609 Series for PCB hole layout for clip attachment 11 THERMAL RESISTANCE SINK TO AMBIENT (°C/WATT) Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Unidirectional Fin Heat Sink for BGAs 602 SERIES Standard Base Dimensions Height Heat Sink Weight P/N in. (mm) in. (mm) Finish lbs. (grams) 602-100AP .750 (19.1) sq 1.000 (25.4) Plain .021 (9.59) Material: Aluminum, Plain Finish MECHANICAL DIMENSIONS 602 THERMAL PERFORMANCE 7 6 5 4 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 604 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard Base Dimensions Height Heat Sink Weight P/N in. (mm) in. (mm) Finish lbs. (grams) 604-40AB .850 (21.6) sq .400 (10.2) Black Anodized .012 (5.60) 604-60AB .850 (21.6) sq .600 (15.2) Black Anodized .016 (7.47) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 604 THERMAL PERFORMANCE 14 12 604-40AB 10 8 6 4 604-60AB 2 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 12 THERMAL RESISTANCE SINK TO AMBIENT (C) THERMAL RESISTANCE SINK TO AMBIENT (C) Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Unidirectional Fin Heat Sink for BGAs 605 SERIES Standard Base Dimensions Height Heat Sink Weight P/N in. (mm) in. (mm) Finish lbs. (grams) 605-75AB .880 (22.4) sq .750 (19.1) Black Anodized .030 (13.5) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 605 THERMAL PERFORMANCE 8 7 6 5 4 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) Unidirectional Fin Heat Sink for BGAs 606 SERIES Standard Base Dimensions Height Heat Sink Weight P/N in. (mm) in. (mm) Finish lbs. (grams) 606-77AB 1.185 (30.1) sq .767 (19.5) Black Anodized .041 (18.7) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 606 THERMAL PERFORMANCE 7 6 5 4 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 13 THERMAL RESISTANCE SINK TO AMBIENT (C) THERMAL RESISTANCE SINK TO AMBIENT (C) Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Unidirectional Fin Heat Sink for BGAs 607 SERIES Standard Base Dimensions Height Heat Sink Weight P/N in. (mm) in. (mm) Finish lbs. (grams) 607-65AB 1.200 (30.5) x 1.105 (28.1) .650 (16.5) Black Anodized .041 (18.7) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 607 THERMAL PERFORMANCE 7 6 5 4 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) Omnidirectional Pin Fin Heat Sink for BGAs 610 SERIES Standard Base Dimensions Height Heat Sink Weight P/N in. (mm) in. (mm) Finish lbs. (grams) 610-35AB 1.240 (31.5) sq .350 (8.9) Black Anodized .022 (10.0) 610-40AB 1.240 (31.5) sq .400 (10.2) Black Anodized .024 (10.8) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 610 THERMAL PERFORMANCE 10 9 8 610-35AB 7 6 5 610-40AB 4 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 14 THERMAL RESISTANCE SINK TO THERMAL RESISTANCE SINK TO AMBIENT (C) AMBIENT (C) Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Unidirectional Fin Heat Sink for BGAs 611 SERIES Standard Base Dimensions Height Heat Sink Weight P/N in. (mm) in. (mm) Finish lbs. (grams) 611-80AB 1.200 (30.5) sq .800 (20.3) Black Anodized .036 (16.3) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 611 THERMAL PERFORMANCE 7 6 5 4 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) Unidirectional Fin Heat Sink for BGAs 612 SERIES Standard Base Dimensions Height Heat Sink Weight P/N in. (mm) in. (mm) Finish lbs. (grams) 612-65AB 1.390 (35.3) sq .650 (16.5) Black Anodized .054 (24.5) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 612 THERMAL PERFORMANCE 4 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 15 THERMAL RESISTANCE SINK TO AMBIENT (C) THERMAL RESISTANCE SINK TO AMBIENT (C) Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 613 SERIES Unidirectional Fin Heat Sink for BGAs Standard Base Dimensions Height Heat Sink Weight P/N in. (mm) in. (mm) Finish lbs. (grams) 613-50AB 1.450 (36.8) sq .500 (12.7) Black Anodized .046 (20.8) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 613 THERMAL PERFORMANCE 6 5 4 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) Unidirectional Fin Heat Sink for BGAs 614 SERIES Standard Base Dimensions Height Heat Sink Weight P/N in. (mm) in. (mm) Finish lbs. (grams) 614-30AB 1.500 (38.1) sq .300 (7.6) Black Anodized .030 (13.8) 614-50AB 1.500 (38.1) sq .500 (12.7) Black Anodized .048 (21.8) 614-100AP 1.500 (38.1) sq 1.000 (25.4) Plain .046 (20.9) Material: Aluminum, Black Anodized or Plain MECHANICAL DIMENSIONS 614 THERMAL PERFORMANCE 8 7 614-30AB 6 5 614-100AP (dashed) 4 3 614-50AB 2 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 16 THERMAL RESISTANCE SINK TO THERMAL RESISTANCE SINK TO AMBIENT (C) AMBIENT (C) Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Unidirectional Fin Heat Sink for BGAs 615 SERIES Standard Base Dimensions Height Heat Sink Weight P/N in. (mm) in. (mm) Finish lbs. (grams) 615-41AB 1.600 (40.6) sq .410 (10.4) Black Anodized .046 (21.0) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 615 THERMAL PERFORMANCE 8 7 6 5 4 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) Unidirectional Fin Heat Sink for BGAs 616 SERIES Standard Base Dimensions Height Heat Sink Weight P/N in. (mm) in. (mm) Finish lbs. (grams) 616-80AB 1.85 (47.0) sq .800 (20.3) Black Anodized .054 (24.5) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 616 THERMAL PERFORMANCE 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 17 THERMAL RESISTANCE SINK TO THERMAL RESISTANCE SINK TO AMBIENT (C) AMBIENT (C) Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Unidirectional Fin Heat Sink for BGAs 617 SERIES Standard Base Dimensions Height Heat Sink Weight P/N in. (mm) in. (mm) Finish lbs. (grams) 617-80AB 1.450 (36.8) x 1.850 (47.0) .800 (20.3) Black Anodized .082 (37.2) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 617 THERMAL PERFORMANCE 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) Unidirectional Fin Heat Sink for BGAs 618 SERIES Standard Base Dimensions Height Heat Sink Weight P/N in. (mm) in. (mm) Finish lbs. (grams) 618-20AB 2.00 (50.8) sq .200 (5.1) Black Anodized .046 (21.0) 618-100AP 2.00 (80.8) sq 1.000 (25.4) Plain .122 (55.5) Material: Aluminum, Black Anodized or Plain MECHANICAL DIMENSIONS 618 THERMAL PERFORMANCE 7 6 618-20AB 5 4 3 2 1 618-100AB 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 18 THERMAL RESISTANCE SINK TO THERMAL RESISTANCE SINK TO AMBIENT (C) AMBIENT (C) Integrated Circuit Heat Sinks HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Unidirectional Fin Heat Sink for BGAs 620 SERIES Standard Base Dimensions Height Heat Sink Weight P/N in. (mm) in. (mm) Finish lbs. (grams) 620-24AB 2.500 (63.5) x 2.000 (50.8) .235 (6.0) Black Anodized .063 (28.6) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 620 THERMAL PERFORMANCE 5 4 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) Unidirectional Fin Heat Sink for BGAs 622 SERIES Standard Base Dimensions Height Heat Sink Weight P/N in. (mm) in. (mm) Finish lbs. (grams) 622-80AB 2.050 (52.1) x 2.000 (50.8) .800 (20.3) Black Anodized .123 (56.0) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 622 THERMAL PERFORMANCE 3 2 1 0 100 200 300 400 500 600 700 AIR VELOCITY (LFM) 19 THERMAL RESISTANCE SINK TO THERMAL RESISTANCE SINK TO AMBIENT (C) AMBIENT (C) Integrated Circuit Heat Sinks HEAT SINKS FOR MICROPROCESSORS AND ASICs Heat Sinks & Clip for Intel’s Pentium, Pentium MMX, AMD’s K6 & K62, CYRIX’s 6x86 & Media GX, 569, 579, 589, 599 SERIES Centaur/IDT’s WinChip C6 Fin Thermal Resistance Interface Standard Base Dimensions Height at 200 LFM Material P/N in. (mm) in. (mm) (°C/W) Options 569-100AK 2.34 (59.44) x 2.68 (67.95) 1.00 (25.4) 1.7 Pages 74–76 579-150AK 2.15 (54.71) x 1.95 (49.53) 1.50 (38.10) 1.6 Pages 74–76 589-150AK 2.15 (54.71) x 3.10 (78.74) 1.50 (38.10) 1.5 Pages 74–76 599X-100AB 1.96 (49.78) x 2.67 (67.95) 1.00 (25.4) 1.9 Pages 74–76 Material: Aluminum, Black Anodized Clips are not captive to sink PRODUCT FEATURES To order heat sink with optional interface material pre-applied at the factory, Compact design heat sinks can comfortably fit a variety of Robust Socket 7-based PC boxes add S4 or S5 suffix to the part number. (See Product Designation)Robust clip attachments MECHANICAL DIMENSIONS .42 2.34 1.00 1.50 .23 1.50 2.68 PRODUCT DESIGNATION 569-100AK SERIES 569 - 100 XX - XX OPTIONAL THERMAL INTERFACE MODEL NUMBER THERMAL INTERFACE PAD (SEE PRODUCT DES.) S4 = DELTALINK IV HEIGHT BLANK = NO THERMAL PAD 100 = 1.00" CLIP SPRING CLIP OPTION AK = SPRING CLIP (SEE PRODUCT DES.) Dimensions: in. Low-Cost Heat Sinks for DIPs and SRAMs 650/651 SERIES 14-16 Pin DIPs Standard Length Width Height Typical Weight P/N in. (mm) in. (mm) in. (mm) Applications lbs. (grams) 650B 0.250 (6.4) 0.740 (18.9) 0.240 (6.1) 14-Pin, 16-Pin DIP 0.003 (1.36) 651B 0.750 (19.1) 0.415 (10.5) 0.240 (6.1) 14-Pin, 16-Pin DIP 0.005 (2.27) These extruded heat sinks serve as low-cost heat dissipation solutions for DIPs acrylic adhesive. The 650 and 651 are also available in natural aluminum finish. with pin counts from 14 to 16. Use an epoxy such as Wakefield Engineering They can be ordered as 650P or 651P. DeltaBond™ 152 or 155, or use Wakefield 2-part DeltaBond™ 156 modified NATURAL AND FORCED MECHANICAL DIMENSIONS CONVECTION CHARACTERISTICS Notes: 1. Finish: black anodize 2. TIR: Total Indicator Read- ing. This is a measure of flatness across the greatest dimension of a surface. 650B 651B Dimensions: in. (mm) 20 Wakefield 5x9SC Integrated Circuit Heat Sinks HEAT SINKS FOR MICROPROCESSORS AND ASICs 649 SERIES SpiderClip™ Heat Sink Assembly for Motorola MC68040™, MC68060 18 x 18 PGA Standard Base Dimensions Height Base Thickness Clip Heat Sink Weight P/N in. (mm) in. (mm) in. (mm) Color Finish lbs. (grams) 649-33AB 1.70 (43.2) sq 0.315 (8.0) 0.090 (2.3) Gray Black Anodized 0.044 (19.84) 649-51AB 1.86 (47.2) sq 0.510 (13.0) 0.090 (2.3) Gray Black Anodized 0.056 (25.51) NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS 649-33AB SPIDERCLIP™ 649-51AB SPIDERCLIP™ Dimensions: in. (mm) ASSEMBLY ASSEMBLY SpiderClip™ Heat Sink Assembly for IntelDX4™, AMD AM486DX2, and AM486DX4 17 x 17 SPGA 669 SERIES Heat Sink without clip 661 SERIES Dimensions “A” Base Standard Base Dimensions Height Thickness Clip Standard Weight P/N in. (mm) in. (mm) in. (mm) Color Finish lbs. (grams) 669-32AG 1.70 (43.2) sq 0.315 (8.0) 0.090 (2.3) Black Gold Iridite 0.044 (19.84) 669-33AB 1.70 (43.2) sq 0.315 (8.0) 0.090 (2.3) Black Black Anodized 0.044 (19.84) 669-40AB 1.70 (43.2) sq 0.400 (10.2) 0.090 (2.3) Black Black Anodized 0.044 (19.84) 669-52AB 1.70 (43.2) sq 0.520 (13.2) 0.090 (2.3) Black Black Anodized 0.050 (22.68) 661-32AG 1.70 (43.2) sq 0.315 (8.0) 0.090 (2.3) N/A Gold Iridite 0.044 (19.84) 661-33AB 1.70 (43.2) sq 0.315 (8.0) 0.090 (2.3) N/A Black Anodized 0.044 (19.84) 661-40AB 1.70 (43.2) sq 0.400 (10.2) 0.090 (2.3) N/A Black Anodized 0.044 (19.84) 661-52AB 1.70 (43.2) sq 0.520 (13.2) 0.090 (2.3) N/A Black Anodized 0.050 (22.68) 669 Series SpiderClip™ Heat Sink Assemblies may be applied to the following: Intel 80486DX and 80486DX2™ (168 PGA) Intel 82495 Cache Controller Intel DX4™ (168 PGA) AMD A M 29000 Microcontrollers Intel 80486SX (168 PGA) and I860XR (208 PGA) AMD A M 486 Microprocessors AM486DX2, AM486DX4 Intel I960CA, I960CF Enbedded Controllers MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 669-32AG 669-33AB 669-40AB 669-52AB 669-52AB SPIDERCLIP™ 669-32AG SPIDERCLIP™ ASSEMBLY ASSEMBLY Dielectric Breakdown (Nylon Clip Coating) KEY: Dielectric Strength: 100 VDC/mil Dimensions: � 669-32AG 0.315 (8.0) Pin Height, low density pin pattern � 669-40AB 0.400 (10.2) Pin Height, high density pin pattern Breakdown Voltage: 200 VDC (minimum) in. (mm) � 669-33AB 0.315 (8.0) Pin Height, high density pin pattern � 669-52AB 0.520 (13.2) Pin Height, high density pin pattern 21