KINGBRIGHT APT1608F3C
Specifications
Manufacturer
Kingbright
Manufacturers Part #
APT1608F3C
Industry Aliases
APT1608F3C
Sub-Category
Infrared Emitters
Factory Pack Quantity
2000
Datasheet
Extracted Text
APT1608F3C 1.6 x 0.8 mm Infrared Emitting Diode DESCRIPTIONS PACKAGE DIMENSIONS � F3 Made with Gallium Arsenide Infrared Emitting diodes FEATURES � 1.6 mm x 0.8 mm SMD LED, 0.75 mm thickness � Mechanically and spectrally matched to phototransistor � Package: 2000pcs / reel � Moisture sensitivity level : 3 � RoHS compliant APPLICATIONS � Backlight � Status indicator � Home and smart appliances � Wearable and portable devices � Healthcare applications RECOMMENDED SOLDERING PATTERN (units : mm; tolerance : ± 0.1) Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1(0.004") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SELECTION GUIDE [2] [1] Po (mW/sr) @ 20mA Viewing A ngle Emitting Color Part Number Lens Type (Material) Min. Typ. 2θ1/2 1.2 3 APT1608F3C Infrared (GaAlAs) Water Clear 150° *0.8 *2 Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity / luminous flux: +/-15%. * Luminous intensity value is traceable to CIE127-2007 standards. Page 1 / 4 © 2017 Kingbright. All Rights Reserved. Spec No: DSAH3781 / 1203001654 Rev No: V.8A Date: 08/14/2017 APT1608F3C ELECTRICAL / OPTICAL CHARACTERISTICS at T =25°C A Value Parameter Symbol Emitting Color Unit Typ. Max. Wavelength at Peak Emission I = 20mA λ Infrared 940 - nm F peak Spectral Bandwidth at 50% Φ REL MAX Δλ Infrared 50 - nm = 20mA I F Capacitance C Infrared 90 - pF [1] Forward Voltage I = 20mA V Infrared 1.2 1.6 V F F Reverse Current (V = 5V) I Infrared - 10 uA R R Temperature Coefficient of Wavelength TC Infrared 0.3 - nm/°C λ I = 20mA, -10°C ≤ T ≤ 85°C F Temperature Coefficient of V F TC Infrared -1.2 - mV/°C V I = 20mA, -10°C ≤ T ≤ 85°C F Notes: 1. Forward voltage: ±0.1V. 2. Wavelength value is traceable to CIE127-2007 standards. 3. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. ABSOLUTE MAXIMUM RATINGS at T =25°C A Parameter Symbol Value Unit Power Dissipation P 90 mW D Reverse Voltage V 5 V R Junction Temperature T 115 °C j Operating Temperature T -40 to +85 °C op Storage Temperature T -40 to +85 °C stg DC Forward Current I 50 mA F [1] Peak Forward Current I 1200 mA FM Electrostatic Discharge Threshold (HBM) 8000 V - [2] Thermal Resistance (Junction / Ambient) R 320 °C/W th JA [2] Thermal Resistance (Junction / Solder point) R 220 °C/W th JS Notes: 1. 1/100 Duty Cycle, 10μs Pulse Width. 2 2. R ,R Results from mounting on PC board FR4 (pad size ≥ 16 mm per pad). th JA th JS 3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033. Page 2 / 4 © 2017 Kingbright. All Rights Reserved. Spec No: DSAH3781 / 1203001654 Rev No: V.8A Date: 08/14/2017 APT1608F3C TECHNICAL DATA SPATIAL DISTRIBUTION RELATIVE INTENSITY vs. WAVELENGTH F3 100% 0° -15° 15° T = 25 °C a T = 25 °C a -30° 30° 80% -45° 45° 60% 60° -60° 40% 20% -75° 75° 0% 550 600 650 700 750 800 850 900 950 1000 1050 -90° 90° Wavelength (nm) 1.0 0.5 0.0 0.5 1.0 INFRARED Forward Current vs. Radiant Intensity vs. Forward Current Derating Curve Radiant Intensity vs. Forward Voltage Forward Current Ambient Temperature 50 2.5 70 2.5 T = 25 °C a T = 25 °C a 60 40 2.0 2.0 50 30 1.5 1.5 40 30 20 1.0 1.0 20 10 0.5 0.5 10 0 0.0 0 0.0 0.8 1.0 1.2 1.4 1.6 1.8 0 1020 3040 50 -40 -20 0 20 406080 100 -40 -20 0 204060 80 100 Forward voltage (V) Forward current (mA) Ambient temperature (°C) Ambient temperature (°C) REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS TAPE SPECIFICATIONS (units : mm) REEL DIMENSION (units : mm) Notes: 1. Don't cause stress to the LEDs while it is exposed to high temperature. 2. The maximum number of reflow soldering passes is 2 times. 3. Reflow soldering is recommended. Other soldering methods are not recommended as they might cause damage to the product. Page 3 / 4 © 2017 Kingbright. All Rights Reserved. Spec No: DSAH3781 / 1203001654 Rev No: V.8A Date: 08/14/2017 Forward current (mA) Relative Intensity (a. u.) Radiant intensity normalised at 20mA Permissible forward current (mA) Radiant intensity normalised at T = 25 °C a APT1608F3C PACKING & LABEL SPECIFICATIONS PRECAUTIONARY NOTES 1. The information included in this document reflects representative usage scenarios and is intended for technical reference only. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes Page 4 / 4 © 2017 Kingbright. All Rights Reserved. Spec No: DSAH3781 / 1203001654 Rev No: V.8A Date: 08/14/2017
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