F-218 (Rev 10OCT17) MEC1–130–02–L–D–EM2 MEC1–120–02–F–D–EM2 MEC1–120–02–L–D–RA1–SL (1.00 mm) .0394" MEC1-RA, MEC1-EM SERIES RIGHT-ANGLE/EDGE MOUNT SOCKETS SPECIFICATIONS POSITIONS CARD PLATING 1 MEC1 D RA1 NP SL For complete specifications and PER ROW SLOT OPTION recommended PCB layouts see www.samtec.com?MEC1-RA Insulator Material: Black LCP Mates with: Contact Material: –F POSITIONS POLARIZED –02 (1.60 mm) Phosphor Bronze PER ROW POSITIONS = Gold flash = (1.60 mm) .062" card –NP Plating: Au or Sn over 05, 08, 20, 30, on contact, 05 3, 4 .062" = No Polarization 50 µ" (1.27 µm) Ni Matte Tin thick card 08 5, 6 Current Rating: 1.6 A per pin (8 positions only) 40, 50, 60, 70 on tail (2 adjacent pins powered) 20 15, 16 Leave Blank for Operating Temp Range: 30 21, 22 polarization -55 °C to +125 °C –L 31, 32 40 Insertion Depth: = 10 µ" (5.84 mm) .230" to (8.13 mm) .320" 50 41, 42 (0.25 µm) (11.68) RoHS Compliant: Yes (11.96) 60 31, 32, 63 & 64 Gold on .460 (8.89) .471 ALSO contact, 70 53, 54, 115 & 116 .350 PROCESSING AVAILABLE Matte Tin (MOQ Required) on tail Lead–Free Solderable: Yes Note: While optimized for 50 W (No. of Positions + 2) x SMT Lead Coplanarity: • Elevated body applications, this connector with (1.00) .03937 + (2.54) .100 (0.10 mm) .004" max (05-40) alternative signal/ground patterns height (8.13) (0.15 mm) .006" max (50-70)* (0.36) .014 02 may also perform well in certain .320 • Other platings *(.004" stencil solution 75 W applications. Contact may be available; contact Contact Samtec. Samtec for further information. (6.81) IPG@samtec.com) .268 (0.91) .036 01 (1.00) RECOGNITIONS (1.78) HIGH-SPEED CHANNEL PERFORMANCE .03937 (0.91) (2.51) .070 (1.52) (No. of Positions + 2) .036 .099 For complete scope of DIA MEC1-RA .060 x (1.00) .03937 recognitions see Rating based on Samtec reference channel. www.samtec.com/quality Note: Some sizes, styles and For full SI performance data visit Samtec.com 14 options are non-standard, or contact SIG@samtec.com Gbps non-returnable. FILE NO. E111594 APPLICATION Samtec recommends that pads on the mating board be Gold plated. SPECIFICATIONS POSITIONS PLATING 1 MEC1 02 D EM2 NP For complete specifications and PER ROW OPTION recommended PCB layouts see www.samtec.com?MEC1-EM Insulator Material: Mates with: Black LCP Contact Material: (1.60 mm) Phosphor Bronze .062" card –NP –F Plating: 05, 08, 20, 30, = No Polarization = Gold flash on contact, Au or Sn over (8 positions only) 50 µ" (1.27 µm) Ni 40, 50, 60, 70 Matte Tin on tail Current Rating: Leave Blank for ALSO 1.8 A per pin (No. of Positions + 2) x –L polarization (2 adjacent pins powered) AVAILABLE (1.00) .03937 + (12.45) .490 = 10 µ" (0.25 µm) Gold on contact, Operating 02 (MOQ Required) Matte Tin on tail Temp Range: -55 °C to +125 °C • Edge mount leads (6.81) POSITIONS POLARIZED Insertion Depth: .268 for (0.80 mm) .031" Note: While optimized for 50 W applications, PER ROW POSITIONS (5.84 mm) .230" to thick board this connector with alternative signal/ground (8.13 mm) .320" 01 05 3, 4 patterns may also perform well in certain • Other platings RoHS Compliant: (No. of Positions + 2) 75 W applications. Contact Samtec for 08 5, 6 Yes x (1.00) .03937 Contact Samtec. further information. 20 15, 16 Lead–Free Solderable: Yes 30 21, 22 (8.13) (8.89) 40 31, 32 .320 RECOGNITIONS .350 50 41, 42 31, 32, 63 For complete scope of 60 (4.70) & 64 recognitions see (5.21) .185 .205 www.samtec.com/quality Note: Some sizes, 53, 54, 115 70 (1.19) (0.38) styles and options & 116 (4.57) (3.15) ± (0.36) .047 .015 are non-standard, .124 .180 (1.00) .014 FILE NO. E111594 non-returnable. .03937 Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM All parts within this catalog are built to Samtec’s specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.