Fuseholder Blocks & Clips OGN-SMD https://www.schurter.com /PG02b Fuseholder Open Design, 5 x 20 mm, SMD, var. Covers, IEC 60335-1 OGN-SMD OGN-SMD for increased solder OGN-SMD equiped with fuse OGN-SMD equiped with fuse temperature with gold contacts See below: 500 VAC · 4 W / 16 A (VDE) · 500 V · 16 A (UL/CSA) Approvals and Compliances Description Applications - For appliances in unattended use - Household appliances Unique Selling Proposition Weblinks - Suitable for fully automated PCD assembling pdf datasheet, html-datasheet, General Product Information, Packaging - Available with blister tape packaging details, Distributor-Stock-Check, Accessories, Detailed request for - Small design height product, Microsite - Available preassembled with fuses Technical Data Shock-Safe Category PC1 Soldering Methods Reflow (lead-free) Soldering Profile Fuse-Link 5 x 20 mm Solderability 245-260 °C / max. 30 sec acc. to JE- Mounting PCB DEC J-STD-020D Terminal Solder SMT Contact Resistance ≤ 10 mΩ at 20 mV acc. to IEC 60127-6 Rated Voltage 500 VAC (VDE), 500 V (UL/CSA) Dielectric Strength > 3 kV between life parts Rated current 10/16 A (VDE), 16 A (UL/CSA) (50 Hz: 1 min) Rated Power Acceptance IEC 4 W / 16 A @ Ta 23 °C Impulse Withstand Voltage > 4 kV between life parts 4 W / 10A with black cover Insulation Resistance ≥ 10 MΩ 2.5 W / 10 A with transparant cover, see (500 VDC: 1 min) derating curves Overvoltage Category III acc. to IEC 60664-1 Degree of Protection IP 20 (with cover) Pollution Degree 3 acc. to IEC 60664-1 Protection Class Suitable for appliances with protection class I acc. to IEC 61140 Admissible Ambient Air Temp. -40 °C to 85 °C Climatic Category 40/085/21 acc. to IEC 60068-1 Material: Socket see variants Material: Cover Thermoplastic UL 94V-0 Material: Terminals Tin-Plated Copper Alloy Unit Weight 1.7 g Storage Conditions 0 °C to 60 °C, max. 70% r.h. Product Marking , Type, Rated Voltage, Rated current, Power Rating, Approvals Approvals and Compliances Detailed information on product approvals, code requirements, usage instructions and detailed test conditions can be looked up in Details about Approvals Approvals The approval mark is used by the testing authorities to certify compliance with the safety requirements placed on electronic products. Approval Reference Type: OGN-SMD Approval Logo Certificates Certification Body Description VDE Approvals VDE VDE Certificate Number: 40001042 VDE Approvals VDE VDE Certificate Number: 40045404 UL Approvals UL UL File Number: E39328 Fuses 1 Fuseholder Blocks & Clips OGN-SMD https://www.schurter.com /PG02b Product standards Product standards that are referenced Organization Design Standard Description Designed according to IEC 60127-6 Miniature fuses. Part 6. Fuse-holders for miniature fuse-links Designed according to UL 4248-1 Fuseholder general requirements Designed according to CSA C22.2 no. 4248.1 Fuseholder general requirements Application standards Application standards where the product can be used Organization Design Standard Description Designed for applications acc. IEC/UL 60950 IEC 60950-1 includes the basic requirements for the safety of information technology equipment. Designed for applications acc. IEC 60335-1 Safety of electrical appliances for household and similar purposes. Meets the requirements for appliances in unattended use. This includes the en- hanced requirements of glow wire tests acc. to IEC 60695-2-12 and -13. Compliances The product complies with following Guide Lines Identification Details Initiator Description CE declaration of conformity SCHURTER AG The CE marking declares that the product complies with the applicable requirements laid down in the harmonisation of Community legislation on its affixing in accordance with EU Regulation 765/2008. RoHS SCHURTER AG EU Directive RoHS 2011/65/EU China RoHS SCHURTER AG The law SJ / T 11363-2006 (China RoHS) has been in force since 1 March 2007. It is similar to the EU directive RoHS. REACH SCHURTER AG On 1 June 2007, Regulation (EC) No 1907/2006 on the Registration, Evaluation, Authorization and Restriction of Chemicals 1 (abbreviated as "REACH") entered into force. White paperGlow wire test SCHURTER AG Meets the requirements of IEC 60335-1 for appliances in unattended use. This includes the enhanced requirements of glow wire tests acc. to IEC 60695-2-12 and -13. Dimension [mm] 22.7 mm 25 9.6 Cover 11 6 22.7 10.8 Soldering pads 2 Fuses 12 13.2 6 Fuseholder Blocks & Clips OGN-SMD https://www.schurter.com /PG02b Derating Curves With Transparent Cover 4.0 3.5 2.5 3.0 I = 1.0 I n 2.5 2.0 I = 0.7 I n 2.0 I = 1.0 I n I = << I 1.5 n 1.5 I = 0.7 I n 1.0 I = << I n 1.0 0.5 0.5 0.0 020406080 100 0.0 Ambient Air Temperature Ta °C 020406080 100 Ambient Air Temperature Ta °C Fuses 3 Admissible Power Acceptance in Watt Admissible Power Acceptance in Watt Fuseholder Blocks & Clips OGN-SMD https://www.schurter.com /PG02b Order numbers for pre-assembled OGN-SMD, blister tape packaging with 400 pieces per reel Rated FTT 5x20 FTT 5x20 FST 5x20 FST 5x20 FSF 5x20 FSF 5x20 SMD-SPT 5x20 SMD-SPT 5x20 current In with reflow cover no cover with reflow cover no cover with reflow cover no cover with reflow cover no cover 0853.0571 0853.0571 0853.0571 0853.0571 50 mA 0031.8304 0031.8354 63 mA 0031.8501 0031.8551 0031.8305 0031.8355 80 mA 0031.8502 0031.8552 0031.8306 0031.8356 100 mA 0031.8503 0031.8553 0031.8307 0031.8357 125 mA 0031.8504 0031.8554 0031.8308 0031.8358 160 mA 0031.8505 0031.8555 0031.8309 0031.8359 200 mA 0031.8506 0031.8556 0031.8310 0031.8360 250 mA 0031.8507 0031.8557 0031.8311 0031.8361 315 mA 0031.8508 0031.8558 0031.8312 0031.8362 400 mA 0031.8509 0031.8559 0031.8313 0031.8363 500 mA 0031.8510 0031.8560 0031.8314 0031.8364 0031.8413 0031.8463 630 mA 0031.8511 0031.8561 0031.8315 0031.8365 0031.8414 0031.8464 800 mA 0031.8512 0031.8562 0031.8316 0031.8366 0031.8415 0031.8465 1 A 0031.8513 0031.8563 0031.8317 0031.8367 0031.8416 0031.8466 0031.8993 0031.9007 1,25 A 0031.8514 0031.8564 0031.8318 0031.8368 0031.8417 0031.8467 0031.8994 0031.9008 1,6 A 0031.8515 0031.8565 0031.8319 0031.8369 0031.8418 0031.8468 0031.8995 0031.9009 2A 0031.8516 0031.8566 0031.8320 0031.8370 0031.8419 0031.8469 0031.8996 0031.9010 2,5 A 0031.8517 0031.8567 0031.8321 0031.8371 0031.8420 0031.8470 0031.8997 0031.9011 3,15 A 0031.8518 0031.8568 0031.8322 0031.8372 0031.8421 0031.8471 0031.8998 0031.9012 4 A 0031.8519 0031.8569 0031.8323 0031.8373 0031.8422 0031.8472 0031.8999 0031.9013 5 A 0031.8324 0031.8374 0031.8423 0031.8473 0031.9000 0031.9014 6,3 A 0031.8325 0031.8375 0031.8424 0031.8474 0031.9001 0031.9015 8 A 0031.8326 0031.8376 0031.8425 0031.8475 0031.9002 0031.9016 10 A 0031.8327 0031.8377 0031.8426 0031.8476 0031.9003 0031.9017 All fuses in the pre-assembled OGN-SMD fuseholders are suitable for the reflow solder process. 4 Fuses Fuseholder Blocks & Clips OGN-SMD https://www.schurter.com /PG02b All Variants Holder Material Material: Terminals Reflow Condition Packaging Order Number l Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020D, Tp=245 +0/-5 °C, tp = max. 30 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8221 █ l Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020D, Tp=245 +0/-5 °C, tp = max. 30 s Blister Tape 38 cm Reel (400 pcs.) 0031.8225 █ l Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020D, Tp=245 +0/-5 °C, tp = max. 30 s Blister Tray 266 x 174 mm (500 pcs.) 0031.8222 l Spec. Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020D, Tp=260 +0/-5 °C, tp = max. 30 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8263 l Spec. Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020D, Tp=260 +0/-5 °C, tp = max. 30 s Blister Tape 38 cm Reel (400 pcs.) 0031.8265 █ l Spec. Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020D, Tp=260 +0/-5 °C, tp = max. 30 s Blister Tray 266 x 174 mm (500 pcs.) 0031.8264 l Spec. Thermoplastic Gold-Plated Copper Alloy acc. to JEDEC J-STD-020D, Tp=260 +0/-5 °C, tp = max. 30 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8273 █ l Spec. Thermoplastic Gold-Plated Copper Alloy acc. to JEDEC J-STD-020D, Tp=260 +0/-5 °C, tp = max. 30 s Blister Tape 38 cm Reel (400 pcs.) 0031.8275 l Spec. Thermoplastic Gold-Plated Copper Alloy acc. to JEDEC J-STD-020D, Tp=260 +0/-5 °C, tp = max. 30 s Blister Tray 266 x 174 mm (500 pcs.) 0031.8274 █ Most Popular. Availability for all products can be searched real-time:https://www.schurter.com/en/Stock-Check/Stock-Check-SCHURTER The fuseholder is suitable for use in equipment according to IEC 60335-1. Fuseholders with gold-plated terminals are more heat resistant than fuseholders with tin-plated terminals. If soldering problems occur with the thermoplastic version, it is recommended to use the spec. thermoplastic with tin-plated and gold-plated terminals. see variants Packaging Unit Accessories Description Covers for OGN, OGN-SMD Cover for Holder OGN, OGN-SMD Adapter to OGN, OGN-SMD Fuse Carriage with Handle for OGN, OGN-SMD The specifications, descriptions and illustrations indicated in this document are based on current information. All content is subject to modifications and amendments. Information furnished is believed Fuses 5 to be accurate and reliable. However, users should independently evaluate the suitability and test each product selected for their own applications. 04.06.2018