3.0x1.5mm SMD CHIP LED LAMP APL3015F3C Description Features F3 Made with Gallium Arsenide Infrared Emitting z3.0mmx1.5mm SMT LED, 1.4mm THICKNESS. diodes. zLOW POWER CONSUMPTION. zWIDE VIEWING ANGLE. zIDEAL FOR BACKLIGHT AND INDICATOR. zVARIOUS COLORS AND LENS TYPES AVAILABLE. zPACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD1360 REV NO: V.1 DATE:MAR/31/2003 PAGE: 1 OF 4 APPROVED: J.LU CHECKED: Allen Liu DRAWN: D.L.HUANG Selection Guide P PP) P) Po o o o o ( ( ( ( (m m m m mW W W W W/////s s s s sr r r r r) ) ) V VVg Vg Viiiiie e e e ew w w w wiiiiin n n n ng g g @ 20 mA Angle P PP. P.Pe a a a a ar r r r rttttt N N N N No o o o o... D DDe DeDe iiiiic c c c ce e L LLe Le Le e e e en n n n ns s s s s T T T T Ty y y y yp p p p pe e M MM.M. M. iiiiin n n n n... T TT. T. Ty y y y yp p p p p.. 22 2 22 22 θ θ θ θ θ1 1 11 1/////2 22 As PL3015F3CGR aA W4 ATER CLEA 02 . 1° . 70 Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T =25°°°°°C A IIIm ImIN ttttte e e e em m m P P PN PNPl /////N N S SSl SlS. y y y y ym m m m mb b b b bo o o o oll T TT. T.T. y y y y yp p p p p.. M MM. M.Mt a a a a ax x x x x.. U UUt UtUn n n n n niiiiitt C CCn Cn Co o o o on n n n nd d d d diiiiitttttiiiiio o o o on n F3 orward Voltage FVF 16 .2 1V . I F =20mA R3 everse Current FI R -01AuVR=5V C3 apacitance FC 9-F0 pVF=0V; f=1MHz P3 eak Wavelength F λ P 9- 40 nIm F =20mA S3 pectral Line Half-width F ∆λ 1 / 2 5- 0 nI m F =20mA Absolute Maximum Ratings at T =25°°°°°C A IIIm ImIl ttttte e e e em m m S SSl SlS3 y y y y ym m m m mb b b b bo o o o oll F F F3 F3Fs 3 3 U UUs Us Un n n n niiiiittttts s PP ower Dissipation T 1W 00 m DF C Forward Current I05A m Peak Forward Current [1] 1A .2 iFS RV everse Voltage R 5V Operating /Storage Temperature -40° C To +85°C Note: 1. 1/100 Duty Cycle, 10us Pluse Width. SPEC NO: DSAD1360 REV NO: V.1 DATE:MAR/31/2003 PAGE: 2 OF 4 APPROVED: J.LU CHECKED: Allen Liu DRAWN: D.L.HUANG APL3015F3C SPEC NO: DSAD1360 REV NO: V.1 DATE:MAR/31/2003 PAGE: 3 OF 4 APPROVED: J.LU CHECKED: Allen Liu DRAWN: D.L.HUANG APL3015F3C SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD1360 REV NO: V.1 DATE:MAR/31/2003 PAGE: 4 OF 4 APPROVED: J.LU CHECKED: Allen Liu DRAWN: D.L.HUANG