Effective August 2017 Technical Data 4082 Supersedes November 2012 0603ESDA-TR1 ESD suppressor Applications • Laptop/notebook/netbook • Computers and peripherals • Digital camcorders • Blu-Ray/DVD players • DSL Modems • Satellite and HD radio • HDTV Equipment • Set top Boxes • A/V Equipment • High speed data ports • Cell phones o USB 2.0/3.0 • Digital still cameras o High speed Ethernet • MP3 / Multimedia players o Infiniband® • External storage o IEEE 1394 • GPS o DVI o HDMI Surface Mount Device Product features Catalog Number Description 5,000 pieces in paper tape on 7 inch • 0603/1608 footprint surface mount device 0603ESDA-TR1 • Ideal ESD protection for high frequency, low diameter (178 mm) reel. voltage applications. • Provides ESD protection with fast response time (<1ns) allowing equipment to pass IEC Device marking 61000-4-2 testing 0603ESDA-TR1 ESD Suppressors are marked on the tape and reel • Very low leakage current packages, not individually. Since the product is bi-directional and • Ultra low capacitance (0.15 pF maximum) symmetrical, no orientation marking is required. • Bi-directional Design considerations The location in the circuit for the 0603ESDA-TR1 family has to Performance Characteristics Units Min Typ Max be carefully determined. For better performance, the device should be placed as close to the signal input as possible and Continuous operating voltage Vdc - - 24 ahead of any other component. Due to the high current 2 Clamping voltage V - 35 60 associated with an ESD event, it is recommended to use a “0- 3 Trigger voltage V - 350 - stub” pad design (pad directly on the signal/data line and 4 ESD Threat voltage capability kV - 8 15 second pad directly on common ground). Capacitance (@ 1 kHz ~ 1.8 GHz) pF - - 0.15 Processing recommendations Leakage current (@ 12 Vdc) nA 0.01 <0.1 - The 0603ESDA-TR1 family currently has a convex profile on the 2 Peak current A - 30 45 top surface of the part. This profile is a result of the construction Operating temperature °C -56 +25 +105 of the device. They can be processed using standard pick-and- 2 1 place equipment. The placement and processing techniques for ESD pulse withstand # pulses 20 >500 - these devices are similar to those used for chip resistors and chip capacitors. 1. Some shifting in characteristics may occur when tested over several hundred ESD pulses at very rapid rate of 1 pulse per second or faster. 2. Per IEC 61000-4-2, 30A @ 8 kV, level 4, clamp measurement made 30 ns after initiation of pulse, all tests in contact discharge mode. 3. Trigger measurement made using Transmission Line Pulse (TLP) method. 4. PolySURG™ devices are capable of withstanding up to a 15 kV, 45 A ESD pulse. Device ratings are given at 8 kV per Note 1, unless otherwise specified. Discontinued effective April 12, 2013 or until inventory is depeleted. Recommended replacement is 0603ESDA2-TR2 data sheet #4419. 0603ESDA-TR1 Technical Data 4082 Effective August 2017 ESD suppressor Dimensions - mm (in) Recommended Pad Layout - in (mm) (per IPC-SM-782 ) R T H 0.60 min (0.023 min) 1.1 ref (0.043 ref) L 1.0 max W (0.039 max) EIA Size L W H T R 1.60±0.10 0.80±0.10 0.50±0.10 0.30±0.20 0.70±0.10 0603ESDA (0.063±0.004) (0.031±0.004) (0.020±0.004) (0.012±0.008) (0.028±0.004) Packaging- mm (in) 4.0±0.1 (.157±.004) 2.0±0.05 B (.079±.002) 2.0±0.75 (.079±.030) 3.5±0.05 (.138±.002) A 8.0±0.30 (.315±.012) 60.0±1.5 1.75±0.1 2.0±0.5 (2.362±.059) 4.0±0.1 (.069±.004) (.080±.020) 1.5±0.10 (.157±.004) (.059±.004) 178.0±2.0 21±0.8 (7.008±.080) (.827±.032) Dimension 0603 1.90±0.20 A (.075±0.008) 13.0±0.5 9.0±1.5 (.512±.020) 1.10±0.20 (.354±.059) B (.043±0.008) www.eaton.com/electronics 2 Discontinued effective April 12, 2013 or until inventory is depeleted. Recommended replacement is 0603ESDA2-TR2 data sheet #4419. 0603ESDA-TR1 Technical Data 4082 ESD suppressor Effective August 2017 Environmental Specifications: Moisture Resistance per EIA/IS-722 Paragraph 4.4.2. This standard is based upon MIL-STD-202G Method 103B but with temperature and relative humidity at +85 °C and 85% RH respectively. Test condition ‘A’ (240 Hours) per MIL-STD-202G. Thermal shock: MIL-STD-202, Method 107G, -55 °C to +125 °C, 30 min. cycle, 10 cycles. Vibration: MIL-STD-202F, Method 201A,(10 to 55 to 10 Hz, 1 min. cycle, 2 hours each in X-Y-Z). Chemical resistance: ASTM D-543, 4 hrs @ +40 °C, 3 solutions (H2O, detergent solution, defluxer). Operating temperature characteristics, measurement at +25 °C, +105 °C and -56 °C. Full load voltage: 14.4 Vdc, 18 Vdc & 24 Vdc for 1000 hours, +25 °C. Solder leach resistance and terminal adhesion: Per EIA-576. Solderability: MIL-STD-202, Method 208 (95% coverage). Soldering Recommendations Compatible with lead and lead-free solder reflow processes Peak reflow temperatures and durations: - IR Reflow = +260 °C max for 10 sec. max. - Wave Solder = +260 °C max. for 10 sec. max. Recommended IR Reflow Profile: Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton Eaton is a registered trademark. All Rights Reserved Printed in USA All other trademarks are property Publication No. 4082 BU-SB12920 of their respective owners. August 2017 Discontinued effective April 12, 2013 or until inventory is depeleted. Recommended replacement is 0603ESDA2-TR2 data sheet #4419.